Dry bonding system and wearable device for skin bonding including the same

Patent metadata

Field	Value
Publication number	US-2016206243-A1
Application number	US-201514982475-A
Country	US
Kind code	A1
Filing date	Dec 29, 2015
Priority date	Dec 29, 2014
Publication date	Jul 21, 2016
Grant date	—

Abstract

Disclosed are a dry bonding system and a wearable device for skin bonding including the dry bonding system.

First claim

1 . A dry bonding system comprising a plurality of micro structures each having a sucker chamber formed on a substrate.

2 . The dry bonding system of claim 1 , wherein the micro structure includes a material selected from the group consisting of polyurethaneacrylate, polydimethylsiloxane, polyethyleneterephthalate, polyurethane, polyethylenenaphthalate, and a combination thereof.

3 . The dry bonding system of claim 1 , wherein the micro structure includes an embossed structure, and the sucker chamber is formed at an upper end of the embossed structure.

4 . The dry bonding system of claim 3 , wherein the sucker chamber is provided at a base surface thereof with a hill-shaped embossed part, and the hill-shaped embossed part has a height smaller than a depth of the sucker chamber.

5 . The dry bonding system of claim 4 , wherein the hill-shaped embossed part is formed such that a middle portion of a body of the hill-shaped embossed part has a circumference larger than circumferences of an upper end and a lower end of the body.

6 . The dry bonding system of claim 5 , wherein a circumference of the hill-shaped embossed part is smaller than a circumference of the sucker chamber, and when the hill-shaped embossed part is attached to a surface to be bonded and a pressure for adsorption of the sucker chamber is not applied to a rear surface of the bonding system, a maximum circumferential surface of the hill-shaped embossed part does not come into contact with the circumference of the sucker chamber, and when the hill-shaped embossed part is attached to the surface to be bonded and a pressure for adsorption of the sucker chamber is applied to the rear surface of the bonding system, the maximum circumferential surface of the hill-shaped embossed part comes into contact with an inner surface of the sucker chamber.

7 . The dry bonding system of claim 4 , wherein the embossed structure is provided in the form of a cylinder, and
the hill-shaped embossed part is provided in the form of a sphere or semi-sphere protruding from the base surface.

8 . The dry bonding system of claim 4 , wherein the embossed structure has a diameter of about 1 μm to 100 μm and has a height of about 1 μm to 100 μm, and an aspect ratio of the diameter to the height of the embossed structure is within a range of ⅔ to 3.

9 . The dry bonding system of claim 1 , wherein the micro structure is an engraved structure carved in a surface of the substrate, and the engraved structure is a sucker chamber.

10 . The dry bonding system of claim 9 , wherein the sucker chamber is provided at a base surface thereof with a hill-shaped embossed part, and the hill-shaped embossed part has a height smaller than a depth of the sucker chamber.

11 . The dry bonding system of claim 9 , wherein the hill-shaped embossed part is formed such that a middle portion of a body of the hill-shaped embossed part has a circumference larger than circumferences of an upper end and a lower end of the body.

12 . The dry bonding system of claim 11 , wherein a circumference of the hill-shaped embossed part is smaller than a circumference of the sucker chamber, and when the hill-shaped embossed part is attached to a surface to be bonded and a pressure for adsorption of the sucker chamber is not applied to a rear surface of the bonding system, a maximum circumferential surface of the hill-shaped embossed part does not come into contact with the circumference of the sucker chamber, and when the hill-shaped embossed part is attached to the bonding surface and a pressure for adsorption of the sucker chamber is applied to the rear surface of the bonding system, the maximum circumferential surface of the hill-shaped embossed part comes into contact with an inner surface of the sucker chamber.

13 . The dry bonding system of claim 10 , wherein the engraved structure is provided in the form of a cylinder, and
the hill-shaped embossed part is provided in the form of a sphere or semi-sphere protruding from the base surface.

14 . The dry bonding system of claim 9 , wherein the engraved structure has a diameter of about 1 μm to 100 μm and has a height of about 1 μm to 100 μm, and an aspect ratio of the diameter to the height of the engraved structure is within a range of ⅔ to 3

15 . The dry bonding system of claim 1 , wherein the plurality of micro structures are arranged while spaced apart each other at an interval whose ratio with respect to a diameter of the sucker chamber is within a range of 1:1 to 1:3.

16 . A wearable device for skin bonding comprising a sensor part and a bonding part provided at an opposite side of the sensor part,
wherein the bonding part includes the dry bonding system according to claim 1 .

17 . A skin bonding patch comprising the dry bonding system according to claim 1 .

18 . The skin bonding patch of claim 17 , wherein the skin bonding patch is a moist wound healing dressing.

19 . A drug delivery bonding patch comprising the dry bonding system according to claim 1 .

20 . The drug delivery bonding patch of claim 19 , wherein the dry bonding system includes a drug loaded into the sucker chamber.

Assignees

• Univ Sungkyunkwan Res & Bus

Inventors

• Pang Changhyun
• Park Young Jin
• Baik Sang Yul

Classifications

• A61F13/0253

  characterized by the adhesive material · CPC title

• A61B5/6834 Primary

  using vacuum · CPC title

• B32B3/30

  characterised by a layer formed with recesses or projections, e.g. {hollows, grooves, protuberances, ribs (apertured layer B32B3/266; layer with cavities or internal voids B32B3/26)} · CPC title

• A61F13/0256

  characterized by the parametric properties of the adhesive · CPC title

• A61M35/00

  Devices for applying media, e.g. remedies, on the human body (devices for handling toiletry or cosmetic substances A45D; absorbent pads, e.g. swabs, A61F13/15) · CPC title