Wireless Sensor Patches and Methods of Manufacturing
US-2015351689-A1 · Dec 10, 2015 · US
Flexible patch including a plurality of through holes which can be adhered to skin and method for manufacturing the same
US10898138B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10898138-B2 |
| Application number | US-201816223623-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 18, 2018 |
| Priority date | Dec 18, 2018 |
| Publication date | Jan 26, 2021 |
| Grant date | Jan 26, 2021 |
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- Title
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Abstract
Official abstract text for this publication.
Exemplary embodiments relate to a skin-adherable flexible patch including a flexible patch layer having one surface that can adhere to skin and configured to support a micro scale semiconductor device; and a plurality of holes passing through from one surface of the flexible patch to the other surface of the flexible patch, and a method for manufacturing the flexible patch.
First claim
Opening claim text (preview).
What is claimed is: 1. A method for manufacturing a skin-adherable flexible patch, comprising: forming a first sacrificial layer on a mold having a plurality of concave furrows on one surface; forming a flexible patch layer on the first sacrificial layer; contacting a board with the flexible patch layer, and rubbing the board or the flexible layer to remove a region of the flexible patch layer exceeding the furrows; and etching the first sacrificial layer to obtain a flexible patch having a plurality of holes. 2. The method for manufacturing a skin-adherable flexible patch according to claim 1 , wherein in the removing the flexible patch layer, the board includes a substrate; and a second sacrificial layer formed on one surface of the substrate, the second sacrificial layer contacts the region of the flexible layer exceeding the furrows. 3. The method for manufacturing a skin-adherable flexible patch according to claim 1 , wherein the removing the flexible patch layer further comprises heating the contact region. 4. The method for manufacturing a skin-adherable flexible patch according to claim 3 , wherein the removing the flexible patch layer further comprises applying pressure to the contact region between the board and the region of the flexible layer exceeding the furrows. 5. The method for manufacturing a skin-adherable flexible patch according to claim 1 , wherein the flexible patch layer is made of a material including poly-dimethylsiloxane (PDMS). 6. The method for manufacturing a skin-adherable flexible patch according to claim 1 , wherein the forming the flexible patch layer comprises: forming a first flexible layer on the sacrificial layer; and forming a second flexible layer on the first flexible layer, the second flexible layer being more rigid than the first flexible layer. 7. The method for manufacturing a skin-adherable flexible patch according to claim 6 , wherein a thickness (t 1 ) of the first flexible layer and a thickness (t 2 ) of the second flexible layer are determined based on the following Equation: W ≥ Wc where Wc = Eeqt 3 / ( 24 R 2 ) , W = 4 γ dPatch γ dskin γ dPatch + γ dskin 4 γ pPatch γ pskin γ pPatch + γ pskin , E eq = ( t 1 t 1 + t 2 ) E 1 + ( t 2 t 1 + t 2 ) E 2 t = t 1 + t 2 , where t denotes a thickness of the flexible patch, E 1 denotes an elastic modulus of the first flexible layer, E 2 denotes an elastic modulus of the second flexible layer, R denotes a curvature of the flexible patch adhered to the skin, y dskin denotes a dispersive component of contact surface of the skin, y dPatch denotes a dispersive component of contact surface of the patch, y pSkin denotes a polar component of contact surface
Assignees
Inventors
Classifications
characterised by the manufacture of electrodes · CPC title
- A61B5/6833Primary
Adhesive patches · CPC title
Patches, e.g. medical patches, repair patches · CPC title
Mechanical properties · CPC title
comprising polysiloxanes · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US10898138B2 cover?
- Exemplary embodiments relate to a skin-adherable flexible patch including a flexible patch layer having one surface that can adhere to skin and configured to support a micro scale semiconductor device; and a plurality of holes passing through from one surface of the flexible patch to the other surface of the flexible patch, and a method for manufacturing the flexible patch.
- Who is the assignee on this patent?
- Amorepacific Corp, Massachusetts Inst Technology
- What technology area does this patent fall under?
- Primary CPC classification A61B5/6833. Mapped technology areas include Human Necessities.
- When was this patent published?
- Publication date Tue Jan 26 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).