Dry bonding system and wearable device for skin bonding including the same

US10327704B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10327704-B2
Application numberUS-201514982475-A
CountryUS
Kind codeB2
Filing dateDec 29, 2015
Priority dateDec 29, 2014
Publication dateJun 25, 2019
Grant dateJun 25, 2019

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Disclosed are a dry bonding system and a wearable device for skin bonding including the dry bonding system.

First claim

Opening claim text (preview).

What is claimed is: 1. A bonding device, comprising: cylindrical micro structures each extending from a substrate and having a terminal end, wherein each of the micro structures includes a chamber extending into the terminal end, and wherein a diameter of an opening of the chamber at the terminal end is smaller than a diameter of the terminal end, wherein a protuberance extends from a floor of the chamber, wherein a circumference of a middle portion of the protuberance is larger than each of a circumference of an upper end of the protuberance and a circumference of a lower end of the protuberance, and wherein the circumference of the middle portion of the protuberance is smaller than a circumference of the chamber. 2. The bonding device of claim 1 , wherein each of the micro structures includes a material selected from the group consisting of polyurethaneacrylate, polydimethylsiloxane, polyethyleneterephthalate, polyurethane, polyethylenenaphthalate, and a combination thereof. 3. The bonding device of claim 1 , wherein the chamber is a sucker chamber. 4. The bonding device of claim 1 , wherein the protuberance is spherical or semi-spherical. 5. The bonding device of claim 1 , wherein the protuberance has a diameter of 1 μm to 100 μm and has a height of 1 μm to 100 μm, and an aspect ratio of the diameter to the height is within a range of ⅔ to 3. 6. The bonding device of claim 1 , wherein adjacent micro structures among the micro structures are spaced apart from each other at an interval, and a ratio of the interval to a diameter the chamber is within a range of 1:1 to 1:3. 7. A wearable device for skin bonding comprising a sensor part and a bonding part provided at a side of the sensor part, wherein the bonding part includes the bonding device according to claim 1 . 8. A skin bonding patch comprising the bonding device according to claim 1 . 9. The skin bonding patch of claim 8 , wherein the skin bonding patch includes a moist wound healing dressing. 10. A drug delivery bonding patch comprising the bonding device according to claim 1 . 11. The drug delivery bonding patch of claim 10 , wherein the bonding device includes a drug disposed in the chamber. 12. A bonding device, comprising: holes extending into a flat substrate; and a protuberance formed on a floor of each of the holes, wherein the protuberance has a height smaller than a depth of each of the holes, wherein a circumference of a middle portion of the protuberance is larger than each of a circumference of an upper end of the protuberance and a circumference of a lower end of the protuberance, and wherein the circumference of the middle portion of the protuberance is smaller than a circumference of each of the holes. 13. The bonding device of claim 12 , wherein the protuberance is contained within each of the holes. 14. The bonding device of claim 12 , wherein each of the holes has a diameter of 1 μm to 100 μm and has a height of 1 μm to 100 μm, and an aspect ratio of the diameter to the height is within a range of ⅔ to 3.

Assignees

Inventors

Classifications

  • A61B5/6834Primary

    using vacuum · CPC title

  • characterized by the parametric properties of the adhesive · CPC title

  • characterised by a layer formed with recesses or projections, e.g. {hollows, grooves, protuberances, ribs (apertured layer B32B3/266; layer with cavities or internal voids B32B3/26)} · CPC title

  • characterized by the adhesive material · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10327704B2 cover?
Disclosed are a dry bonding system and a wearable device for skin bonding including the dry bonding system.
Who is the assignee on this patent?
Research & Business Found Sungkyunkwan Univ
What technology area does this patent fall under?
Primary CPC classification A61B5/6834. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Tue Jun 25 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).