Methods of fabricating polygon-sectional rodlike ingot and substrate with orientation marker or rounded corners, rodlike ingot and substrate

US2016201220A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016201220-A1
Application numberUS-201314895179-A
CountryUS
Kind codeA1
Filing dateDec 27, 2013
Priority dateSep 26, 2013
Publication dateJul 14, 2016
Grant date

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  1. Title

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  2. Abstract

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention discloses a method of forming a polygon-sectional rodlike ingot having an orientation marker or rounded corners, a rodlike ingot and a sheet substrate so formed. The method comprises: selecting one of sides of the polygon-sectional rodlike ingot that is parallel to an axial direction thereof as a first feature of a surface orientation marker; forming a minisize notch, which is parallel to an edge, in the one of sides selected as the first feature in the axial direction of the rodlike ingot, as a second feature of the orientation marker; and processing the rodlike ingot to form rounded corners. The sheet substrate is obtained by cutting the rodlike ingot.

First claim

Opening claim text (preview).

1 . A method of forming a polygon-sectional rodlike ingot having an orientation marker, the method comprising: selecting one of sides of the polygon-sectional rodlike ingot that is parallel to an axial direction thereof as a first feature of a surface orientation marker; forming a minisize notch, which is parallel to an edge of the rodlike ingot, in the one of sides having the first feature in the axial direction of the rodlike ingot, as a second feature of the surface orientation marker. 2 . The method according to claim 1 , wherein the polygon-sectional rodlike ingot is made of sapphire, silicon carbide, gallium nitride, aluminum nitride, gallium oxide, zinc oxide or monocrystalline silicon. 3 . The method according to claim 1 , wherein the polygon-sectional rodlike ingot has a cross section of quadrate, regular pentagon, regular hexagon or regular octagon. 4 . The method according to claim 1 , wherein the one of sides that is selected as the first feature and parallel to the axial direction of the rodlike ingot is any of cylinder surfaces of the rodlike ingot. 5 . The method according to claim 1 , wherein the minisize notch, as the second feature, is formed at a random position on the one of sides that is the first feature, except at a central line that halves the one of sides that is the first feature. 6 . The method according to claim 5 , wherein the minisize notch has a V-shape or semi-circular cross section. 7 . A polygon-sectional rodlike ingot having an orientation marker formed according to the method of claim 1 . 8 . A method of forming a polygonal substrate having an orientation marker, the method comprising: forming a rodlike ingot according to the method of claim 1 ; cutting the rodlike ingot to obtain a sheet-like substrate. 9 . A polygonal substrate having an orientation marker fabricated according to the method of claim 8 . 10 . The polygonal substrate according to claim 9 , wherein the polygonal substrate has rounded corners, the circularly rounded corners each having a radius in a range from 0.1 mm to 10 mm. 11 . The polygonal substrate according to claim 10 , wherein the polygonal substrate is in a form of one of square, rectangle, regular pentagonal, regular hexagonal and regular octagonal. 12 . The polygonal substrate according to claim 10 , wherein one side of the polygonal substrate has a notch that is not located on a central line halving the side. 13 . The polygonal substrate according to claim 12 , wherein the notch is a V-shaped or semicircle-shaped notch. 14 . A method of forming a polygon-sectional rodlike ingot having an orientation marker and rounded corners, the method comprising: a) selecting one of sides of the polygon-sectional rodlike ingot that is parallel to an axial direction thereof as a first feature of a surface orientation marker; b) forming a minisize notch, which is parallel to an edge of the rodlike ingot in the one of sides selected as the first feature in the axial direction of the rodlike ingot, as a second feature of the orientation marker; and c) processing the rodlike ingot to form rounded corners, wherein the step c) is performed prior to or posterior to the step a) and the step b). 15 . A polygon-sectional rodlike ingot having an orientation marker and rounded corners. 16 . A method of forming a polygonal substrate having an orientation marker and rounded corners, the method comprising: forming a rodlike ingot according to the method of claim 14 ; and cutting the rodlike ingot. 17 . A method of forming a polygonal substrate having an orientation marker and rounded corners, comprising: forming a polygonal substrate having an orientation marker and rounded corners according to the method of claim 8 ; and processing the polygonal substrate so as to obtain four rounded corners.

Assignees

Inventors

Classifications

  • located on the periphery of wafers, e.g. orientation notches or lot numbers · CPC title

  • H10P74/23Primary

    characterised by multiple measurements, corrections, marking or sorting processes · CPC title

  • C30B29/66Primary

    Crystals of complex geometrical shape, e.g. tubes, cylinders · CPC title

  • C30B25/18Primary

    characterised by the substrate · CPC title

  • by tools other than rotary type, e.g. reciprocating tools {(B28D5/0005 takes precedence)} · CPC title

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What does patent US2016201220A1 cover?
The present invention discloses a method of forming a polygon-sectional rodlike ingot having an orientation marker or rounded corners, a rodlike ingot and a sheet substrate so formed. The method comprises: selecting one of sides of the polygon-sectional rodlike ingot that is parallel to an axial direction thereof as a first feature of a surface orientation marker; forming a minisize notch, whic…
Who is the assignee on this patent?
Inst Semiconductors Cas
What technology area does this patent fall under?
Primary CPC classification H10P74/23. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Jul 14 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).