Method for joining metal parts

Patent metadata

Field	Value
Publication number	US-2016199931-A1
Application number	US-201414903464-A
Country	US
Kind code	A1
Filing date	Sep 10, 2014
Priority date	Sep 26, 2013
Publication date	Jul 14, 2016
Grant date	—

Abstract

A method for joining a first metal part with a second metal part, the metal parts having a solidus temperature above 1000° C. The method includes applying a melting depressant composition on a surface of the first metal part, the melting depressant composition including a melting depressant component that includes phosphorus and silicon for decreasing a melting temperature of the first metal part; bringing the second metal part into contact with the melting depressant composition at a contact point on said surface; heating the first and second metal parts to a temperature above 1000° C.; and allowing a melted metal layer of the first metal component to solidify, such that a joint is obtained at the contact point. The melting depressant composition and related products are also described.

First claim

1 . A method for joining a first metal part with a second metal part, the metal parts having a solidus temperature above 1000° C., the method comprising the steps of:
applying a melting depressant composition on a surface of the first metal part, the melting depressant composition comprising:
a melting depressant component that comprises phosphorus and silicon for decreasing a melting temperature of the first metal part; and
optionally, a binder component for facilitating the applying of the melting depressant composition on the surface;

bringing the second metal part into contact with the melting depressant composition at a contact point on said surface;
heating the first and second metal parts to a temperature above 1000° C., said surface of the first metal part thereby melting such that a surface layer of the first metal part melts and, together with the melting depressant component, forms a melted metal layer that is in contact with the second metal part at the contact point; and
allowing the melted metal layer to solidify and form a joint at the contact point, the joint comprising at least 50 wt % metal that, before the heating, was part of any of the first metal part and the second metal part.

2 . The method according to claim 1 , wherein the phosphorus originates from a phosphorus compound selected from at least any of the following compounds: Mn x P y , Fe x P y and Ni x P y .

3 . The method according to claim 1 , wherein the silicon originates from any of elemental silicon and silicon of a silicon compound selected from at least any of the following compounds: silicon carbide, silicon boride and ferrosilicon.

4 . The method according to claim 1 , wherein the melting depressant component comprises any of at least 25 wt %, at least 35 wt % and at least 55 wt % phosphorus and silicon.

5 . The method according to claim 1 , wherein phosphorus constitutes at least 10 wt % of the phosphorus and silicon content of the melting depressant compound.

6 . The method according to claim 1 , wherein silicon constitutes at least 55 wt % of the phosphorus and silicon content of the melting depressant compound.

7 . The method according to claim 1 , wherein the melting depressant component comprises less than 50 wt % metallic elements.

8 . A method according to claim 1 , wherein the melting depressant component comprises less than 10 wt % metallic elements.

9 . The method according to claim 1 , wherein the first metal part comprises a thickness of 0.3-0.6 mm and the applying of the melting depressant composition comprises applying an average of 0.02-1.00 mg phosphorus and silicon per mm 2 on the surface of the first metal part.

10 . The method according to claim 1 , wherein the first metal part comprises a thickness of 0.6-1.0 mm and the applying of the melting depressant composition comprises applying an average of 0.02-2.0 mg phosphorus and silicon per mm 2 on the surface of the first metal part.

11 . The method according to claim 1 , wherein the surface has an area that is larger than an area defined by the contact point on said surface, such that metal in the melted metal layer flows to the contact point when allowing the joint to form.

12 . The method according to claim 11 , wherein the area of the surface is at least 3 times larger than the area defined by the contact point.

13 . The method according to claim 11 , wherein the area of the surface is at least 10 times larger than a cross-sectional area of the joint.

14 . The method according to claim 1 , wherein any of the first metal part and the second metal part comprises a plurality of protrusions that extend towards the other metal part, such that, when bringing the second metal part into contact with said surface, a plurality of contact points are formed on said surface.

15 . The method according to claim 1 , wherein the first metal part comprises one of:
>50 wt % Fe, <13 wt % Cr, <1 wt % Mo, <1 wt % Ni and <3 wt % Mn, >90 wt % Fe, >65 wt % Fe and >13 wt % Cr, >50 wt % Fe, >15.5 wt % Cr and >6 wt % Ni, >50 wt % Fe, >15.5 wt % Cr, 1-10 wt % Mo and >8 wt % Ni, >97 wt % Ni, >10 wt % Cr and >60 wt % Ni, >15 wt % Cr, >10 wt % Mo and >50 wt % Ni, >70 wt % Co, >80% Cu, and >10 wt % Fe, 0.1-30 wt % Mo, 0.1-30 wt % Ni and >50 wt % Co.

16 . A product comprising a first metal part that is joined with a second metal part by a joint, the metal parts having a solidus temperature above 1000° C., wherein the joint comprises at least 50 wt % metallic elements that have been drawn from an area that surrounds the joint and was part of any of the first metal part and the second metal part.

17 . A product comprising a first metal part that is joined with a second metal part according to the method of claim 1 .

18 . A melting depressant composition for joining a first metal part with a second metal part according to the method of claim 1 , the melting depressant composition comprising i) a melting depressant component that comprises phosphorous and silicon for decreasing a melting temperature, and ii), optionally, a binder component for facilitating applying of the melting depressant composition on the first metal part.

19 . The method according to claim 2 , wherein the silicon originates from any of elemental silicon and silicon of a silicon compound selected from at least any of the following compounds: silicon carbide, silicon boride and ferrosilicon.

20 . The method according to claim 2 , wherein the melting depressant component comprises any of at least 25 wt %, at least 35 wt % and at least 55 wt % phosphorus and silicon.

Assignees

• Alfa Laval Corp Ab

Inventors

• Sjödin Per
• Walter Kristian

Classifications

• B23K1/19

  taking account of the properties of the materials to be soldered · CPC title

• B23K1/008

  Soldering within a furnace (B23K1/012 takes precedence) · CPC title

• B23K1/20

  Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating · CPC title

• B21D53/04

  of sheet metal · CPC title

• B23K35/025

  Pastes, creams or slurries · CPC title