Pick-and-place tool for packaging process

Patent metadata

Field	Value
Publication number	US-9105760-B2
Application number	US-201314040004-A
Country	US
Kind code	B2
Filing date	Sep 27, 2013
Priority date	Nov 7, 2011
Publication date	Aug 11, 2015
Grant date	Aug 11, 2015

Abstract

An apparatus includes a guide ring, and a bond head installed on the guide ring. The bond head is configured to move in loops along the guide ring. The bond head is configured to pick up dies and place the dies during the loops.

First claim

What is claimed is:

1. A method comprising:
operating a first bond head to move along a first guide apparatus for a first loop;
picking up a first die using the first bond head during the first loop; wherein the first guide apparatus is configured in a ring shape;
aligning the first die with a first package component, comprising:
moving the first package component in a first direction and a second direction, the second direction being different from the first direction; and…

Assignees

• Taiwan Semiconductor Mfg

Inventors

• Hwang Chien Ling
• Huang Ying-Jui
• Hsiao Yi-Li

Classifications

• H10W72/07173

  Electricity · mapped topic

• B23K1/0016

  Operations & Transport · mapped topic

• B23K3/047

  Operations & Transport · mapped topic

• B23K1/203

  Operations & Transport · mapped topic

• B23K3/082

  Operations & Transport · mapped topic