Wiring board and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-2016198561-A1
Application number	US-201414907400-A
Country	US
Kind code	A1
Filing date	Jul 17, 2014
Priority date	Aug 2, 2013
Publication date	Jul 7, 2016
Grant date	—

Abstract

A wiring board including a board main body made of an insulating material and having a front surface and rear surface and side surfaces at four sides located between the front and the rear surfaces, and a wiring conductor for plating, an end surface of which is exposed on any side surface of the board main body, wherein the wiring board includes a first insulating layer formed on the side surface on which the end surface of the wiring conductor for plating is exposed to cover the end surface, and a conductor layer formed on the side surface of the board main body on which the first insulating layer is formed along a side direction of the side surface including a surface of the first insulating layer, and wherein the conductor layer is electrically connected to a ground layer formed inside the board main body.

First claim

What is claimed is:

1 . A wiring board comprising:
a board main body made of an insulating material and having a front surface and rear surface having a rectangular shape in a planar view and side surfaces at four sides located between the front surface and the rear surface; and a wiring conductor for plating, an end surface of which is exposed on any side surface of the board main body, characterized in that: the wiring board includes a first insulating layer formed on at least the side surface of the board main body on which the end surface of the wiring conductor for plating is exposed among the side surfaces of the board main body to cover the end surface of the wiring conductor for plating, and a conductor layer formed on the side surface of the board main body on which the first insulating layer is formed along a side direction of the side surface including a surface of the first insulating layer, and the conductor layer is electrically connected to a ground layer formed inside the board main body.

2 . A wiring board comprising:
a board main body made of an insulating material and having a front surface and rear surface having a rectangular shape in a planar view and side surfaces at four sides located between the front surface and the rear surface, and a wiring conductor for plating, an end surface of which is exposed on any side surface of the above board main body, characterized in that: the wiring board includes a first insulating layer formed on at least the side surface of the board main body on which the end surface of the wiring conductor for plating is exposed among the side surfaces of the board main body to cover the end surface of the wiring conductor for plating, and a conductor layer formed on the side surface of the board main body on which the first insulating layer is formed along a side direction of the side surface including a surface of the first insulating layer, and the conductor layer is electrically connected to a ground layer formed inside the board main body at a plurality of positions.

3 . The wiring board according to claim 1 ,
characterized in that: a second insulating layer is further formed on the side surface of the board main body on which the conductor layer is formed along the side direction of the side surface to cover the whole surface of the conductor layer.

4 . The wiring board according to claim 1 ,
characterized in that: at a corner portion between adjacent two side surfaces, the conductor layers formed respectively on the two side surfaces are directly connected to each other.

5 . The wiring board according to claim 1 ,
characterized in that: a concave portion that dents toward a central side of the board main body in a planar view is formed between adjacent two side surfaces located on the same side of the board main body along a thickness direction of the front surface and the rear surface or at a corner portion between adjacent two side surfaces of the board main body along the thickness direction of the front surface and the rear surface, a metalized layer formed on a surface of the concave portion is electrically connected to the ground layer, and the conductor layer is continuously formed on the surface of the metalized layer along a side direction of the adjacent two side surfaces.

6 . The wiring board according to claim 3 ,
characterized in that: the conductor layer and the second insulating layer are formed on the side surface of the board main body from which the end surface of the wiring conductor for plating is not exposed along a side direction of the side surface.

7 . A method for manufacturing a wiring board comprising a board main body made of an insulating material and having a front surface and rear surface having a rectangular shape in a planar view and side surfaces at four sides located between the front surface and the rear surface, and a wiring conductor for plating, an end surface of which is exposed at any side surface of the board main body,
characterized in that: the method comprises:
a step of forming a first insulating layer on at least the side surface of the board main body on which the end surface of the wiring conductor for plating is exposed among the side surfaces of the board main body to cover the end surface of the wiring conductor for plating, and
a step of forming a conductor layer on the side surface of the board main body on which the first insulating layer is formed along a side direction of the side surface including a surface of the first insulating layer, and
the conductor layer is electrically connected to a ground layer formed inside the board main body.

8 . The method for manufacturing a wiring board according to claim 7 ,
characterized in that: the method further comprises a step of forming a second insulating layer on the side surface of the board main body on which the conductor layer is formed along the side direction of the side surface to cover the whole surface of the conductor layer.

9 . The method for manufacturing a wiring board according to claim 7 ,
characterized in that: the step of forming the conductor layer includes a step of forming the conductor layer continuously on a surface of a metalized layer along a side direction of adjacent two side surfaces, a concave portion, which dents toward a central side of the board main body in a planar view, being formed between the adjacent two side surfaces located on the same side of the board main body along a thickness direction of the front surface and the rear surface or at a corner portion between the adjacent two side surfaces of the board main body along the thickness direction of the front surface and the rear surface, and the metalized layer formed on the surface of the concave portion being electrically connected to the ground layer.

10 . The method for manufacturing a wiring board according to claim 8 ,
characterized in that: a step of forming the conducting layer and a second insulating layer along a side direction of the side surface is performed on the side surface of the board main body from which the end surface of the wiring conductor for plating is not exposed.

11 . The wiring board according to claim 2 ,
characterized in that: a second insulating layer is further formed on the side surface of the board main body on which the conductor layer is formed along the side direction of the side surface to cover the whole surface of the conductor layer.

12 . The wiring board according to claim 2 ,
characterized in that: at a corner portion between adjacent two side surfaces, the conductor layers formed respectively on the two side surfaces are directly connected to each other.

13 . The wiring board according to claim 2 ,
characterized in that: a concave portion that dents toward a central side of the board main body in a planar view is formed between adjacent two side surfaces located on the same side of the board main body along a thickness direction of the front surface and the rear surface or at a corner portion between adjacent two side surfaces of the board main body along the thickness direction of the front surface and the rear surface, a metalized layer formed on a surface of the concave portion is electrically connected to the ground layer, and the conductor layer is continuously formed on the surface of the metalized layer along a side direction of the adjacent two side surfaces.

14 . The wiring board according to claim 11 ,
characterized in that: the conductor layer and the second insulating layer are formed on the side surface of the board main body from which the end surface of the w

Assignees

• Ngk Spark Plug Co

Inventors

• Tsunemi Daiki
• Morita Masahito
• Kito Naoki
• Ikawa Tatsuharu
• Kodama Hiroyuki

Classifications

• H10W70/685

  comprising multiple insulating layers · CPC title

• H10W70/657

  on sidewalls or bottom surfaces of the package substrates, interposers or redistribution layers · CPC title

• H10W70/635

  Through-vias · CPC title

• H10W70/68

  Shapes or dispositions thereof · CPC title

• H10W42/20

  protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons · CPC title