Electromagnetic interference shielding techniques

Patent metadata

Field	Value
Publication number	US-9155188-B2
Application number	US-201213631156-A
Country	US
Kind code	B2
Filing date	Sep 28, 2012
Priority date	Nov 4, 2011
Publication date	Oct 6, 2015
Grant date	Oct 6, 2015

Abstract

Methods and apparatuses are disclosed for fabricating a printed circuit board (PCB) having electromagnetic interference (EMI) shielding and also having reduced volume over conventional frame-and-shield approaches. Some embodiments include fabricating the PCB by mounting an integrated circuit to the PCB, outlining an area corresponding to the integrated circuit with a number of grounded vias, selectively applying an insulating layer over the PCB such that at least one of the grounded vias are exposed, and selectively applying a conductive layer over the PCB such that the conductive layer covers at least a portion of the integrated circuit and such that the conductive layer is coupled to the at least one of the grounded vias that are exposed.

First claim

What is claimed is:

1. An apparatus comprising:
a circuit board comprising a first surface and a second surface;
a first integrated circuit coupled to the first surface of the circuit board;
a first pad on the first surface of the circuit board adjacent the first integrated circuit;
a second pad on one of the first surface of the circuit board and the second surface of the circuit board;
a conductive layer, wherein the conductive layer is electrically coupled to the first…

Assignees

• Apple Inc

Inventors

• Merz Nicholas G
• Wang Hong
• Nikkhoo Michael M
• Pyper Dennis R
• Werner Christopher Matthew

Classifications

• Y10T29/49146

  Cross-Sectional Technologies · mapped topic

• H05K2201/0317

  Electricity · mapped topic

• H05K3/284

  Electricity · mapped topic

• H05K2201/09618

  Electricity · mapped topic

• H05K2201/10371

  Electricity · mapped topic