Customized module lid

Patent metadata

Field	Value
Publication number	US-2016172259-A1
Application number	US-201414535391-A
Country	US
Kind code	A1
Filing date	Nov 7, 2014
Priority date	Nov 7, 2014
Publication date	Jun 16, 2016
Grant date	—

Abstract

A method of forming a custom module lid. The method may include placing a multichip module (MCM) between a module base and a temporary lid, target components are exposed through viewing windows in the temporary lid, a top surface of the target components is measured and mapped to create a target profile, the target profile is used to form custom pockets in a custom lid, and the custom pockets correspond to the target components.

First claim

1 - 15 . (canceled)

16 . A structure comprising:
a module base having a base pocket, wherein the base pocket is an opening in the module base on a top surface of the module base, and the base pocket has a depth extending into the module base that is less than a thickness of the module base; a multichip module (MCM) on the module base, wherein the MCM includes a substrate, a first component on a bottom surface of the substrate and a target component on a top surface of the substrate, the bottom surface of the substrate is directly on the top surface of the module base, and the first component is in the base pocket; a first thermal interface material (TIM) between the first component and a bottom surface of the base pocket; a custom lid on the MCM, wherein the custom lid includes a custom pocket, the custom pocket is an opening in the custom lid on a bottom surface of the custom lid, the custom pocket has a depth extending into the custom lid that is less than a thickness of the custom lid, and the custom pocket has an inside surface with a same profile as a target component surface profile; and a second TIM between the target component and the custom pocket.

17 . The structure of claim 16 , wherein the custom lid is a cold plate.

18 . The structure of claim 16 , wherein the module base includes a slot and the custom lid includes a corresponding fin, and the fin fits inside of the slot.

19 . The structure of claim 16 , wherein the substrate is an organic laminate.

20 . The structure of claim 16 , wherein the module base and the custom lid are aluminum.

Assignees

• IBM

Inventors

• Arvelo Amilcar R
• Ellsworth Michael J
• Mckeever Eric J
• Nguyen Thong N
• Seminaro Edward J

Classifications

• H10W40/70

  Fillings or auxiliary members in containers or in encapsulations for thermal protection or control · CPC title

• H10W76/17

  characterised by their materials · CPC title

• H10W76/12 Primary

  characterised by their shape · CPC title

• H10W76/01

  Manufacture or treatment · CPC title

• H10W40/22

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title