Apparatus for controlling temperature uniformity of a substrate

Patent metadata

Field	Value
Publication number	US-2016169593-A1
Application number	US-201615050419-A
Country	US
Kind code	A1
Filing date	Feb 22, 2016
Priority date	Jan 27, 2010
Publication date	Jun 16, 2016
Grant date	—

Abstract

Apparatus for controlling the thermal uniformity of a substrate are provided. The thermal uniformity of the substrate may be controlled to be more uniform or the thermal uniformity of the substrate may be controlled to be non-uniform in a desired pattern. In some embodiments, an apparatus for controlling the thermal uniformity of a substrate includes: a substrate support having a support surface to support a substrate thereon; and a flow path disposed within the substrate support to flow a heat transfer fluid beneath the support surface, wherein the flow path comprises a first portion and a second portion, each portion having a substantially equivalent axial length, wherein the first portion is spaced about 2 mm to about 10 mm from the second portion, and wherein the first portion provides a flow of heat transfer fluid in a direction opposite a flow of heat transfer fluid of the second portion.

First claim

1 . An apparatus for controlling the thermal uniformity of a substrate, comprising:
a substrate support having a support surface to support a substrate thereon; and a flow path disposed within the substrate support to flow a heat transfer fluid beneath the support surface, wherein the flow path comprises a first portion and a second portion, each portion having a substantially equivalent axial length, wherein the first portion is spaced about 2 mm to about 30 mm from the second portion, and wherein the first portion provides a flow of heat transfer fluid in a direction opposite a flow of heat transfer fluid of the second portion.

2 . The apparatus of claim 1 , wherein the first portion is spaced about 2 mm to about 10 mm from the second portion.

3 . The apparatus of claim 1 , wherein the substrate support further comprises:
an inlet coupled to a first end of the flow path; an outlet coupled to a second end of the flow path; and a heat transfer fluid source coupled to the inlet and the outlets to provide a flow of the heat transfer fluid to the flow path and to control a temperature and a flow rate of the heat transfer fluid.

4 . The apparatus of claim 1 , wherein an inlet and an outlet of the flow path are disposed proximate each other near a periphery of the substrate support, and wherein the first and second portions of the flow path together generally wind radially inward toward a center point of the substrate support then loop back and generally wind radially outward until an end of the first and second portions is reached.

5 . The apparatus of claim 4 , wherein the radially inward and radially outward winding of the first and second portions of the flow path is interleaved.

6 . The apparatus of claim 5 , wherein the first and second portions of the flow path are configured to provide a dual counter flow.

7 . The apparatus of claim 1 , wherein an inlet and an outlet of the flow path are disposed proximate each other near a center point of the substrate support, and wherein the first and second portions of the flow path together generally wind radially outward toward a periphery of the substrate support then loop back and generally wind radially inward until an end of the first and second portions is reached.

8 . The apparatus of claim 7 , wherein the radially inward and radially outward winding of the first and second portions of the flow path is interleaved.

9 . The apparatus of claim 8 , wherein the first and second portions of the flow path are configured to provide a dual counter flow.

10 . The apparatus of claim 1 , further comprising:
at least one valve respectively coupled to the first and second portions of the flow path to control a flow rate of the heat transfer fluid.

11 . The apparatus of claim 10 , further comprising a controller coupled to at least one valve to control the operation thereof.

12 . The apparatus of claim 1 , wherein the substrate support is disposed in an inner processing volume of a process chamber.

Assignees

• Applied Materials Inc

Inventors

• Bera Kallol
• Zhou Xiaoping
• Buchberger Jr Douglas A
• Nguyen Andrew
• Tavassoli Hamid
• Kumar Surajit
• Rauf Shahid

Classifications

• F28F3/12 Primary

  Elements constructed in the shape of a hollow panel, e.g. with channels {(F28D1/02, F28D1/03 take precedence)} · CPC title

• F28F2013/001

  Particular heat conductive materials, e.g. superconductive elements · CPC title