Photoresist having decreased outgassing

Patent metadata

Field	Value
Publication number	US-2016108170-A1
Application number	US-201414516681-A
Country	US
Kind code	A1
Filing date	Oct 17, 2014
Priority date	Oct 17, 2014
Publication date	Apr 21, 2016
Grant date	—

Abstract

Provided is a method of fabricating a semiconductor device. A substrate is provided. A material layer is formed over the substrate. A photoresist layer is formed over the material layer. The photoresist layer contains a polymer. The polymer includes an acid labile group (ALG) that is linked to a plurality of carboxylic acid function groups. The photoresist layer is then patterned using a lithography process, for example an extreme ultraviolet (EUV) lithography process.

First claim

1 . A photoresist material, comprising:
a polymer, wherein the polymer includes an acid labile group (ALG) that is linked to a plurality of carboxylic acid function groups, and wherein the ALG has one of the following chemical formulas:

and wherein:
Z represents a C4˜C15 cyclic alkyl or cyclic alkyl derivative;
R1, R2, R3, and R4 each represent a respective C1˜C15 alkyl group; and
Rxa, Rxb, and Rxc each represent an alkyl group having a carbon number between 1˜10.

2 - 7 . (canceled)

8 . A photoresist material, comprising:
a polymer, wherein the polymer includes an acid labile group (ALG) that is linked to two or more carboxylic acid function groups, and wherein the ALG has one of the following chemical formulas:

wherein:
Z represents a C4˜C15 cyclic alkyl or cyclic alkyl derivative;
R1, R2, R3, and R4 each represent a respective C1˜C15 alkyl group; and
Rxa, Rxb, and Rxc each represent an alkyl group having a carbon number between 1˜10.

9 . The photoresist material of claim 8 , wherein:
the photoresist further contains a photo acid generator (PAG) that is configured to release acid; and the polymer is cleavable by the acid, after which the polymer becomes more hydrophilic and is dissolvable by a basic solution.

10 . The photoresist material of claim 8 , wherein the polymer is configured to be applied in a positive tone developer process or in a negative tone developer process.

11 . A method of fabricating a semiconductor device, comprising:
providing a substrate; forming a photoresist layer over the substrate, the photoresist layer containing a polymer that includes an acid labile group (ALG) that is linked to a plurality of carboxylic acid function groups; and patterning the photoresist layer using a lithography process; wherein the ALG is linked to two or more carboxylic acid function groups, and wherein the ALG has one of the following chemical formulas:

wherein:
Z represents a C4˜C15 cyclic alkyl or cyclic alkyl derivative;
R1, R2, R3, and R4 each represent a respective C1˜C15 alkyl group; and
Rxa, Rxb, and Rxc each represent an alkyl group having a carbon number between 1˜10.

12 . The method of claim 11 , wherein the lithography process is an extreme ultraviolet (EUV) lithography process.

13 . The method of claim 11 , further comprising forming a material layer over the substrate, wherein the photoresist layer is formed over the material layer.

14 - 15 . (canceled)

16 . The method of claim 11 , wherein the photoresist further contains a photo acid generator (PAG), and wherein the lithography process comprises:
an optical exposure process in which the PAG releases acid; and a post-exposure baking process in which the polymer is cleaved by the acid released by the PAG.

17 . The method of claim 11 , wherein the polymer becomes more hydrophilic after being cleaved by the acid.

18 . The method of claim 11 , wherein the lithography process further comprises: after the polymer becomes more hydrophilic, dissolving the polymer by a basic solution in a positive tone developer process or by an organic solvent in a negative tone developer process.

19 . The method of claim 11 , wherein the basic solution contains Tetramethylammonium hydroxide with a concentration of about 2%-3%.

20 . (canceled)

21 . The photoresist material of claim 1 , wherein the photoresist further contains a photo acid generator (PAG) that is configured to release acid in response to an optical exposure.

22 . The photoresist material of claim 21 , wherein the polymer is configured to be cleaved by the acid in a post-exposure baking process.

23 . The photoresist material of claim 22 , wherein:
the polymer becomes more hydrophilic after being cleaved by the acid; and the polymer is dissolvable by a basic solution after becoming more hydrophilic.

24 . The photoresist material of claim 1 , wherein the ALG is linked to a first carboxylic acid function group via R1 and is linked to a second carboxylic acid function group via R2.

25 . The photoresist material of claim 24 , wherein the ALG is further linked to a third carboxylic acid function group via R3.

26 . The photoresist material of claim 8 , wherein the ALG is linked to a first carboxylic acid function group via R1 and is linked to a second carboxylic acid function group via R2.

27 . The photoresist material of claim 26 , wherein the ALG is further linked to a third carboxylic acid function group via R3.

28 . The method of claim 11 , wherein the ALG is linked to a first carboxylic acid function group via R1 and is linked to a second carboxylic acid function group via R2.

29 . The method of claim 28 , wherein the ALG is further linked to a third carboxylic acid function group via R3.

Assignees

• Taiwan Semiconductor Mfg

Inventors

• Lai Wei-Han
• Chang Ching-Yu

Classifications

• G03F7/0392 Primary

  the macromolecular compound being present in a chemically amplified positive photoresist composition · CPC title

• C08G63/00 Primary

  Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule (polyester-amides C08G69/44; polyester-imides C08G73/16) · CPC title

• G03F7/30

  Imagewise removal using liquid means · CPC title

• G03F7/325

  Non-aqueous compositions · CPC title

• G03F7/0382 Primary

  the macromolecular compound being present in a chemically amplified negative photoresist composition · CPC title