Center flex single side polishing head having recess and cap

Patent metadata

Field	Value
Publication number	US-2016101502-A1
Application number	US-201414512779-A
Country	US
Kind code	A1
Filing date	Oct 13, 2014
Priority date	Oct 13, 2014
Publication date	Apr 14, 2016
Grant date	—

Abstract

A polishing head assembly for single side polishing of silicon wafers is provided. The polishing head assembly includes a polishing head and a cap. The polishing head has a recess along a bottom portion, the recess having a recessed surface. The cap is positioned within the recess, and has an annular wall and a floor extending across the annular wall. The floor is spaced from the recessed surface to form a chamber therebetween. The chamber is configured to be pressurized for deflecting the floor. The annular wall is attached to the polishing head with an adhesive.

First claim

What is claimed is:

1 . A polishing head assembly for single side polishing of silicon wafers, the polishing head assembly comprising:
a polishing head having a recess along a bottom portion, the recess having a recessed surface; and a cap positioned within the recess, the cap having an annular wall and a floor extending across the annular wall, the floor being spaced from the recessed surface to form a chamber therebetween, the chamber configured to be pressurized for deflecting the floor, the annular wall being attached to the polishing head with an adhesive.

2 . The polishing head assembly of claim 1 , wherein the annular wall is attached to the polishing head along an outer surface of the annular wall.

3 . The polishing head assembly of claim 1 , wherein one of the polishing head and the cap is made of a metallic material and has a non-metallic barrier to prevent polishing chemicals from contacting and reacting with the metallic material.

4 . The polishing head assembly of claim 3 , wherein the metallic material is cast aluminum.

5 . The polishing head assembly of claim 3 , wherein the non-metallic barrier is a non-metallic coating.

6 . The polishing head assembly of claim 3 , wherein the non-metallic barrier is a band along an outside surface of the polishing head to prevent the polishing chemicals from contacting and reacting with the polishing head.

7 . The polishing head assembly of claim 6 , wherein the band is made of plastic.

8 . The polishing head assembly of claim 6 , further comprising a backing film, the backing film overlapping at least a portion of the band to form a seal therebetween.

9 . The polishing head assembly of claim 3 , wherein the non-metallic barrier is a protective sheet along a bottom surface of the cap to prevent the polishing chemicals from contacting and reacting with the cap.

10 . The polishing head assembly of claim 9 , wherein the protective sheet is attached to the polishing head assembly with an adhesive.

11 . The polishing head assembly of claim 9 , wherein the protective sheet is formed by lamination on the bottom surface of the cap.

12 . The polishing head assembly of claim 9 , wherein the protective sheet is plastic.

13 . The polishing head assembly of claim 3 , wherein the non-metallic barrier includes a band along an outside surface of the polishing head and a protective sheet along a bottom surface of the cap.

14 . The polishing head assembly of claim 13 , wherein the band and the protective sheet overlap and are attached to each other to form a seal therebetween.

15 . The polishing head assembly of claim 14 , further comprising a backing film, the band overlapping a portion of the protective sheet to form a seal therebetween, the backing film overlapping at least a portion of both the protective sheet and the band to form the seal in a tortuous path.

16 . The polishing head assembly of claim 1 , further comprising a stopper located within the chamber to cause or limit deformation of the floor.

17 . The polishing head assembly of claim 1 , further comprising a source of pressurized fluid for causing deflection of the cap.

18 . The polishing head assembly of claim 17 , further comprising a controller connected with the source of pressurized fluid to control deflection of the cap.

19 . The polishing head assembly of claim 18 , wherein the controller is configured to modulate the deflection of the cap on a wafer-by-wafer basis.

20 . The polishing head assembly of claim 1 , further comprising a backing film along a bottom portion of the polishing head assembly for use with a liquid to retain the wafer on the polishing head assembly by surface tension.

21 . The polishing head assembly of claim 1 , further comprising a liquid along a bottom portion of the polishing head assembly for retaining the wafer on the polishing head assembly by surface tension.

22 . The polishing head assembly of claim 1 , further comprising a wafer retained along a bottom portion of the polishing head assembly by surface tension.

Assignees

• Sunedison Semiconductor Ltd Uen201334164H

Inventors

• Albrecht Peter
• Bhagavat Sumeet
• Chu Alex
• Yoshimura Ichiro
• Xin Yunbiao
• Vandamme Roland

Classifications

• H10P72/0428

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• B24B37/30 Primary

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• H01L21/67092

  Electricity · mapped topic