Apparatus for adsorbing solder ball and method of attaching solder ball using the same

Patent metadata

Field	Value
Publication number	US-2016016247-A1
Application number	US-201514674019-A
Country	US
Kind code	A1
Filing date	Mar 31, 2015
Priority date	Jul 21, 2014
Publication date	Jan 21, 2016
Grant date	—

Abstract

Provided are an apparatus of adsorbing solder balls and a method of attaching the solder balls using the same. The solder ball adsorbing apparatus includes a body, a plurality of eject pins disposed in the body and configured to move in downward and upward directions with respect to a substrate on which the solder balls are to be loaded, and a solder ball holder disposed in the body and configured to hold the solder balls at the eject pins and release the solder balls therefrom. The eject pins include a first eject pin disposed at a center of the body in parallel with a vertical surface that is perpendicular to a bottom surface of the body, a second eject pin disposed at an edge of the body at a first angle with respect to the vertical surface, and a third eject pin disposed between the first and second eject pins.

First claim

What is claimed is:

1 . An apparatus for adsorbing solder balls, comprising:
a body; a plurality of eject pins disposed in the body and configured to move in downward and upward directions with respect to a substrate on which the solder balls are to be loaded; and a solder ball holder disposed in the body and configured to hold the solder balls at the eject pins and release the solder balls therefrom, wherein the eject pins comprise: a first eject pin disposed at a center of the body in parallel with a vertical surface that is perpendicular to a bottom surface of the body; and a second eject pin disposed at an edge of the body at a first angle with respect to the vertical surface.

2 . The apparatus of claim 1 , wherein the eject pins further comprise the third eject pin disposed between the first and second eject pins at a second angle with respect to the vertical surface.

3 . The apparatus of claim 2 , wherein the second angle is substantially the same as the first angle.

4 . The apparatus of claim 2 , wherein the second angle is less than the first angle.

5 . The apparatus of claim 1 , wherein the eject pins are configured to move through a plurality of holes, respectively, disposed at the solder ball holder, and
wherein each of the holes has a structure corresponding to a structure of each of the eject pins.

6 . The apparatus of claim 1 , further comprising a vacuum supplier connected to the solder ball holder to provide vacuum for respectively holding the solder balls on the eject pins.

7 . The apparatus of claim 1 , further comprising:
a plate to which the eject pins are connected; and an eject pin driver connected to the plate configured to move the eject pins in the downward and upward directions.

8 . The apparatus of claim 1 , wherein the eject pins are disposed in the body symmetrically with respect to the first eject pin.

9 . The apparatus of claim 1 , further comprising a driver configured to move the solder ball holder in a downward direction toward the substrate to release the solder balls from the eject pins to be loaded on a plurality of pads formed on the substrate, respectively,
wherein, at a time of releasing the solder balls from the eject pins, the driver is configured to maintain a vertical distance between a bottom end of the solder ball holder and each of the plurality of pads by using a distance x between two adjacent pads among the plurality of pads and an inclination θ of the second eject pin.

10 . The apparatus of claim 1 , wherein the body further comprises paths through which the plurality of eject pins respectively move.

11 . The apparatus of claim 10 , wherein the solder ball holder further comprises a plurality of holes in which the eject pins are configured to hold and release the solder balls, respectively, and
wherein each of the holes comprises: a connection hole communicating with each of the paths; and a holding hole communicating with the connection hole to hold and release each of the solder balls.

12 . An apparatus for adsorbing solder balls, comprising:
a solder ball holder comprising a plurality of holes in which a plurality of eject pins are disposed therein to hold and release the solder balls therefrom, respectively, wherein the plurality of holes comprise: a first hole disposed at a center of the solder ball holder and extended to be parallel with a vertical surface that is perpendicular to a substrate on which the solder balls released from the eject pins are to be loaded; and a second hole disposed at an edge of the solder ball holder and extended at a first angle with respect to the vertical surface.

13 . The apparatus of claim 12 , wherein the plurality of holes further comprise a third hole disposed between the first and second holes and extended at a second angle with respect to the vertical surface.

14 . The apparatus of claim 13 , wherein the second angle is substantially the same as the first angle.

15 . The apparatus of claim 13 , wherein the second angle is less than the first angle.

16 . The apparatus of claim 12 , further comprising a vacuum supplier connected to the solder ball holder to provide vacuum for respectively holding the solder balls on the eject pins.

17 . The apparatus of claim 12 , further comprising a driver configured to move the solder ball holder in a downward direction toward the substrate to release the solder balls from the eject pins to be loaded on a plurality of pads formed on the substrate, respectively,
wherein, at a time of releasing the solder balls from the eject pins, the driver is configured to maintain a vertical distance between a bottom end of the solder ball holder and each of the plurality of pads by using a distance x between two adjacent pads among the plurality of pads and an inclination θ of the second eject pin.

18 . An apparatus for adsorbing solder balls, comprising:
a body; a plurality of eject pins disposed in a plurality of paths of the body and configured to hold and release the solder balls, each of the plurality of eject pins being configured to move through a corresponding path among the plurality of paths; a solder ball holder disposed in the body and comprising a plurality of first holes and a plurality of second holes; and a vacuum supplier connected to the solder ball holder and configured to provide vacuum for holding the solder balls on the eject pins, wherein the plurality of first holes are configured to temporarily accommodate the solder balls, and wherein the plurality of second holes are configured to connect the plurality of holes to the plurality of paths.

19 . The apparatus of claim 18 , wherein the body includes a connection line connected to the vacuum supplier for supplying vacuum to the solder ball holder.

20 . The apparatus of claim 18 , further comprising a driver configured to move the body and the plurality of eject pins.

Assignees

• Samsung Electronics Co Ltd

Inventors

• An Eun-Sun

Classifications

• H10W72/01257

  by reflowing · CPC title

• H10W72/01225

  in solid form, e.g. by using a powder or by stud bumping · CPC title

• H10W72/252

  comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/019

  of bond pads · CPC title

• H10W72/0112

  Apparatus for manufacturing bump connectors · CPC title