Apparatus for treating substrate

Patent metadata

Field	Value
Publication number	US-2016013079-A1
Application number	US-201514747704-A
Country	US
Kind code	A1
Filing date	Jun 23, 2015
Priority date	Jul 11, 2014
Publication date	Jan 14, 2016
Grant date	—

Abstract

A substrate treating apparatus is provided which includes a treating container of which a top end is opened, a substrate support unit placed in a treating container to support a substrate, a treatment solution supply unit supplying a treatment solution to a substrate put on the support unit, and a heating unit placed in the substrate support unit to heat the substrate. The heating unit includes a heating element and a reflection element reflecting a heat from the heating element upward.

First claim

What is claimed is:

1 . A substrate treating apparatus comprising:
a treating container of which a top end is opened; a substrate support unit placed in a treating container to support a substrate; a treatment solution supply unit supplying a treatment solution to a substrate put on the support unit; and a heating unit placed in the substrate support unit to heat the substrate, wherein the heating unit comprises: a heating element; and a reflection element reflecting a heat from the heating element upward.

2 . The substrate treating apparatus of claim 1 , wherein the heating element comprises in a plurality of lamps.

3 . The substrate treating apparatus of claim 2 , wherein the substrate support unit comprises:
a chuck stage on which a substrate is put and rotatable; and a rotary unit having a hollow form and rotating the chuck stage in connection with the chuck stage, wherein the heating element is located in the chuck stage and includes lamps concentrically arranged to have ring shapes of which distances from the center of the chuck stage are different from each other.

4 . The substrate treating apparatus of claim 3 , wherein the reflection element comprises a main reflection plate disposed between adjacent lamps.

5 . The substrate treating apparatus of claim 4 , wherein the reflection element further comprises:
an inner reflection plate located between the chuck stage and the lamps.

6 . The substrate treating apparatus of claim 5 , wherein the reflection element further comprises:
an outer reflection plate spaced apart from the inner reflection plate, with the lamps interposed therebetween.

7 . The substrate treating apparatus of claim 6 , wherein a height of the outer reflection plate is lower than those of the main reflection plate and the inner reflection plate.

8 . The substrate treating apparatus of claim 7 , wherein the reflection element further comprises:
a lower reflection plate located under the lamps.

9 . The substrate treating apparatus of claim 8 , wherein the main reflection plate protrudes upward from the lower reflection plate.

10 . The substrate treating apparatus of claim 9 , wherein the main reflection plate comprises a first side wall, and
wherein the first side wall is inclined to be away from the adjacent lamps toward a top end thereof.

11 . The substrate treating apparatus of claim 10 , wherein the main reflection plate further comprises:
a second side wall, and wherein the first side wall and the second side wall is symmetrical with a virtual line, passing through a center of the main reflection plate, as the center.

12 . The substrate treating apparatus of claim 4 , wherein a width of the main reflection plate becomes progressively narrower toward a top end thereof.

13 . The substrate treating apparatus of claim 12 , wherein the inner reflection plate is perpendicular to the lower reflection plate.

14 . The substrate treating apparatus of claim 1 , wherein a surface of the reflection element is formed of a metallic material.

15 . The substrate treating apparatus of claim 14 , wherein a surface of the reflection element is formed of one of gold, silver, or aluminum.

Assignees

• Semes Co Ltd

Inventors

• Choi Jung Bong
• Kim Seong Soo
• Heo Chan-Young
• Kwon Oh Jin

Classifications

• H10P72/0602

  Temperature monitoring · CPC title

• H10P72/0436

  mainly by radiation · CPC title

• H10P72/0414 Primary

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0424 Primary

  using mainly spraying means, e.g. nozzles · CPC title

• H01L21/67051

  Electricity · mapped topic