Substrate treating apparatus

Patent metadata

Field	Value
Publication number	US-9748118-B2
Application number	US-201414446671-A
Country	US
Kind code	B2
Filing date	Jul 30, 2014
Priority date	Jul 31, 2013
Publication date	Aug 29, 2017
Grant date	Aug 29, 2017

Abstract

Provided is a substrate treating apparatus. The substrate treating apparatus includes a treating container having an opened upper portion, a substrate heating unit heating a substrate disposed in the treating container while supporting the substrate, and a treating solution supply unit supplying a treating solution onto the substrate disposed on the substrate heating unit. The substrate heating unit includes a rotatable chuck stage on which the substrate is placed, a rotation part having a hollow shape, the rotation part being coupled to the chuck stage to rotate the chuck stage, and a heat generation part disposed in the chuck stage.

First claim

What is claimed is:

1. A substrate treating apparatus comprising:
a treating device having an opened upper portion;
a substrate heating unit configured to heat a substrate in the treating device while supporting the substrate, the substrate heating unit including,
a rotatable chuck stage configured to support the substrate when the substrate is placed thereon,
a plurality of heat generators concentrically arranged on an upper surface of the rotatable chuck stage,
a rotator having a cavity therein, the rotator coupled to the rotatable chuck stage to rotate the rotatable chuck stage together with the plurality of heat generators, and
a plurality of temperature sensor assemblies between respective ones of the heat generators and the rotatable chuck stage such that the plurality of temperature sensor assemblies are directly below respective ones of the heat generators and rotate together with the heat generators; and

a treating solution supply configured to supply a treating solution toward the substrate.

2. The substrate treating apparatus of claim 1 , wherein the plurality of heat generators each include lamps arranged in a ring shape such that the lamps associated with each of the plurality of heat generators have radii different from each other with respect to a center of the rotatable chuck stage.

3. The substrate treating apparatus of claim 1 , wherein the substrate heating unit further comprises:
a reflection plate between the plurality of heat generators and the rotatable chuck stage to reflect heat energy emitted from the plurality of heat generators to the substrate.

4. The substrate treating apparatus of claim 3 , wherein the plurality of heat generators each include lamps arranged in a ring shape such that the lamps associated with each of the plurality of heat generators have radii different from each other with respect to a center of the rotatable chuck stage, and
the plurality of temperature sensor assemblies are on the reflection plate, the plurality of temperature sensor assemblies configured to measure a temperature of respective ones of the lamps.

5. The substrate treating apparatus of claim 2 , wherein the substrate heating unit further comprises:
a quartz window configured to protect the lamps, the quartz window including an edge supported by the rotatable chuck stage.

6. The substrate treating apparatus of claim 5 , wherein the quartz window is transparent and rotates together with the rotatable chuck stage.

7. The substrate treating apparatus of claim 4 , wherein each of the plurality of temperature sensor assemblies comprises:
a fixing block having a bolt coupling hole configured to fix the plurality of temperature sensor assemblies to the reflection plate;
a slim support plate extending from the fixing block in one direction, the slim support plate being spaced apart from the reflection plate; and
a temperature sensor having a signal lead wire connected thereto, the temperature sensor being on a bottom surface of the slim support plate.

8. The substrate treating apparatus of claim 7 , wherein each of the plurality of temperature sensor assemblies further comprises:
a slim cover plate configured to surround the temperature sensor, the slim cover plate having an edge welded to the bottom surface of the slim support plate.

9. The substrate treating apparatus of claim 7 , wherein each of the plurality of temperature sensor assemblies further comprises:
an insulation spacer between the fixing block and the reflection plate to block the heat transmitted from the reflection plate.

10. The substrate treating apparatus of claim 7 , wherein, in each of the plurality of temperature sensor assemblies, each of the fixing block, the slim support plate, and the slim cover plate includes a gold-plated layer.

11. The substrate treating apparatus of claim 4 , further comprising:
a back nozzle on a center of the upper surface of the rotatable chuck stage such that the back nozzle passes through the rotator, the back nozzle configured to spray the treating solution onto a rear surface of the substrate, the back nozzle including a nozzle body axially passing through the rotator, the nozzle body including a spray port configured to spray a cooling gas onto a bottom surface of the reflection plate in a direction in which the plurality of temperature sensor assemblies are arranged.

12. The substrate treating apparatus of claim 8 , wherein each of the plurality of temperature sensor assemblies further comprises:
an insulation spacer between the fixing block and the reflection plate to block the heat transmitted from the reflection plate.

13. A substrate heating apparatus comprising:
a chuck configured to support a substrate when the substrate is placed thereon;
a plurality of heat generators concentrically arranged on an upper surface of the chuck;
a rotator coupled to the chuck, the rotator being configured to rotate the chuck together with the plurality of heat generators; and
a plurality of temperature sensor assemblies between respective ones of the plurality of heat generators and the chuck such that the plurality of temperature sensor assemblies are directly below respective ones of the heat generators and rotate together with the heat generators.

14. The substrate heating apparatus of claim 13 , wherein the plurality of heat generators each include lamps arranged in a ring shape such that the lamps associated with each of the plurality of heat generators have radii different from each other with respect to a center of the chuck.

15. The substrate heating apparatus of claim 14 , wherein each of the plurality of temperature sensor assemblies is configured to measure a temperature of respective ones of the lamps.

Assignees

• Semes Co Ltd

Inventors

• Kim Yu-Hwan
• Choi Jung-Bong
• Hwang Ho-Jong

Classifications

• H10P72/0436

  mainly by radiation · CPC title

• H10P72/0414 Primary

  using mainly spraying means, e.g. nozzles · CPC title

• H01L21/67115

  Electricity · mapped topic

• H01L21/67051 Primary

  Electricity · mapped topic