Component mounting method and component mounting system

Patent metadata

Field	Value
Publication number	US-2015245493-A1
Application number	US-201514632279-A
Country	US
Kind code	A1
Filing date	Feb 26, 2015
Priority date	Feb 26, 2014
Publication date	Aug 27, 2015
Grant date	—

Abstract

A component mounting system makes a mounting head to which a component holder is attached perform component mounting operation including upward and downward movement operation with respect to a board and mounts a component on the board. A mounting apparatus repeats reciprocating mounting operations in which the component holder is moved in a mounting order relative to a reference line extending in a first direction being the board conveyance direction such that that the component holder is advanced over the board in a second direction orthogonal to the first direction and then a held high-height component is mounted and thereafter the component holder is retracted from the board in the second direction. The mounting order is set in order in which a mounting coordinate of the high-height component is larger in the second direction relative to the reference line.

First claim

What is claimed is:

1 . A component mounting method for making a mounting head to which a component holder is attached perform component mounting operation including upward and downward movement operation with respect to a board conveyed in a board conveyance direction and mounting each component held by the component holder on the board, the component mounting method comprising:
a low-height component mounting step of mounting a low-height component on the board; and a high-height component mounting step of mounting a high-height component on the board on which the low-height component is mounted, wherein the low-height component is a component capable of avoiding interference with a low-height component already mounted on the board by upward and downward movement operation of the component holder, the high-height component is a component which can avoid interference with the low-height component already mounted on the board by upward and downward movement operation of the component holder but cannot avoid interference with a high-height component already mounted on the board by upward and downward movement operation of the component holder, and the high-height component mounting step includes repeating reciprocating mounting operations in which the component holder is moved in a mounting order relative to a reference line extending in a first direction which is the board conveyance direction such that that the component holder is advanced over the board in a second direction orthogonal to the first direction and then a high-height component held by the component holder is mounted and thereafter the component holder is retracted from the board in the second direction, wherein the mounting order is set in order in which a mounting coordinate of the high-height component is larger in the second direction relative to the reference line.

2 . The component mounting method according to claim 1 , wherein the high-height component mounting step includes performing the reciprocating mounting operations with respect to a common board from both sides of the board in the second direction by a first mounting head and a second mounting head, and
the board is divided into a first region and a second region by a region-divide line set along the first direction, and the first mounting head and the second mounting head target the first region and the second region, respectively.

3 . A component mounting system for making a mounting head to which a component holder is attached perform component mounting operation including upward and downward movement operation with respect to a board conveyed in a board conveyance direction and mounting each component held by the component holder on the board, the component mounting system comprising:
a mounting apparatus for low-height component which mounts a low-height component on the board; and a mounting apparatus for high-height component which mounts a high-height component on the board on which the low-height component is mounted, wherein the low-height component is a component capable of avoiding interference with a low-height component already mounted on the board by upward and downward movement operation of the component holder, the high-height component is a component which can avoid interference with the low-height component already mounted on the board by upward and downward movement operation of the component holder but cannot avoid interference with a high-height component already mounted on the board by upward and downward movement operation of the component holder, and the mounting apparatus for high-height component repeats reciprocating mounting operations in which the component holder is moved in a mounting order relative to a reference line extending in a first direction which is the board conveyance direction such that that the component holder is advanced over the board in a second direction orthogonal to the first direction and then a held high-height component is mounted and thereafter the component holder is retracted from the board in the second direction, wherein the mounting order is set in order in which a mounting coordinate of the high-height component is larger in the second direction relative to the reference line.

4 . The component mounting system according to claim 3 , wherein the mounting apparatus for high-height component comprises includes a first mounting head and a second mounting head for performing the reciprocating mounting operations with respect to a common board from both sides of the board in the second direction and in the case of the reciprocating mounting operations, and
the board is divided into a first region and a second region by a region-divide line set along the first direction, and the first mounting head and the second mounting head target the first region and the second region, respectively.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Higashi Masayuki

Classifications

• H05K3/303

  with surface mounted components (H05K3/32 takes precedence) · CPC title

• H05K3/0008 Primary

  for aligning or positioning of tools relative to the circuit board (H05K3/4638, H05K3/4679 take precedence; for manufacturing assemblages of components H05K13/0015) · CPC title

• H05K13/085 Primary

  Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level · CPC title

• H05K3/34

  by soldering · CPC title

• H05K13/08 Primary

  Monitoring manufacture of assemblages · CPC title