Electrostatic chuck and showerhead with enhanced thermal properties and methods of making thereof

US2015061237A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2015061237-A1
Application numberUS-201414534574-A
CountryUS
Kind codeA1
Filing dateNov 6, 2014
Priority dateOct 27, 2010
Publication dateMar 5, 2015
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Embodiments of the present disclosure generally provide chamber components with enhanced thermal properties and methods of enhancing thermal properties of chamber components including bonding materials. One embodiment of the present disclosure provides a method for fabricating a composite structure. The method includes applying a bonding material to a first component, and converting the bonding material applied to the first component to an enhanced bonding layer by heating the bonding material to outgas volatile species from the bonding material. The outgassed volatile species accumulates to at least 0.05% in mass of the bonding material. The method further includes contacting a second component and the enhanced bonding layer to join the first and second components.

First claim

Opening claim text (preview).

1 . A chamber structure, comprising: a first component fabricated from a first material; a second component fabricated from a second material; and an enhanced bonding layer joining the first and second components, wherein the enhanced bonding layer is converted from a bonding material by heating the bonding material after applying the bonding material to the first component and prior to joining the second component with the first component, and the enhanced bonding layer has at least about 0.05% less volatile species than the bonding material from which the enhanced bonding layer is converted. 2 . The chamber structure of claim 1 , wherein the chamber structure is an electrostatic chuck, the first component is a chuck member having an body formed from a dielectric material, and the second component is a base member. 3 . The chamber structure claim 1 , wherein the structure is a showerhead, the first component is a showerhead cover, and the second component is a showerhead body. 4 . The chamber structure claim 1 , wherein the enhanced bonding layer has a molecular weight and molecular weight distribution less than that of the bonding material.

Assignees

Inventors

Classifications

  • using electrostatic chucks · CPC title

  • Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine (work-tables or other parts, e.g. faceplates, normally not incorporating means for securing work B23Q1/00; automatic position control B23Q15/00 {; food cutting boards A47J47/00; workpiece support for dies B21D37/02}; rotary tool heads for turning-machines B23B3/24, B23B3/26; non-driven tool holders B23B29/00; general features of turrets B23B29/24 {; drawbars in spindles B23B31/261; for electrical discharge machining B23H11/003; for welding B23K37/04; means for securing grinding wheels B24B45/00; mountings for abrasive wheels B24D5/16}; tools or bench devices for fastening, connecting, disengaging or holding B25B {; chucks for percussive tools B25D17/084; work benches for manual work B25H1/00; devices for securing circular saw blades B27B5/32; for assembling or manufacturing aircrafts B64F5/10; devices for holding circuit boards H05K13/0061; for holding semiconductors or wafers H10P72/00}) · CPC title

  • B23B31/28Primary

    using electric or magnetic means in the chuck · CPC title

  • with multiple outlet openings (B05B1/02, B05B1/26 take precedence); with strainers in or outside the outlet opening · CPC title

  • Curing of mixtures · CPC title

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Frequently asked questions

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What does patent US2015061237A1 cover?
Embodiments of the present disclosure generally provide chamber components with enhanced thermal properties and methods of enhancing thermal properties of chamber components including bonding materials. One embodiment of the present disclosure provides a method for fabricating a composite structure. The method includes applying a bonding material to a first component, and converting the bonding…
Who is the assignee on this patent?
Applied Materials Inc
What technology area does this patent fall under?
Primary CPC classification B23B31/28. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Mar 05 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).