Substrate holder and method for fixing and bonding a substrate

US12581908B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12581908-B2
Application numberUS-202017922505-A
CountryUS
Kind codeB2
Filing dateJun 29, 2020
Priority dateJun 29, 2020
Publication dateMar 17, 2026
Grant dateMar 17, 2026

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

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A substrate holder for mounting a substrate, comprising fixing elements for fixing the substrate, wherein the fixing elements can be grouped into zones, and a corresponding method.

First claim

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What is claimed is: 1 . A substrate holder for mounting a substrate, comprising: fixing elements configured to fix the substrate and adapt a propagation speed and a form of a bonding wave during bonding to minimize run-out error during the bonding, the fixing elements being grouped into a plurality of zones, the zones being arranged circular ring-shaped and exclusively in a periphery of the substrate holder, the zones being separated azimuthally from each other; and a pluralit…

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Frequently asked questions

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What does patent US12581908B2 cover?
A substrate holder for mounting a substrate, comprising fixing elements for fixing the substrate, wherein the fixing elements can be grouped into zones, and a corresponding method.
Who is the assignee on this patent?
Ev Group E Thallner Gmbh
What technology area does this patent fall under?
Primary CPC classification H10P72/7608. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 17 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).