Display device and tiled display device including the same
US-12336287-B2 · Jun 17, 2025 · US
Display device and method of manufacturing the display device
US12581738B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12581738-B2 |
| Application number | US-202318192161-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 29, 2023 |
| Priority date | Apr 12, 2022 |
| Publication date | Mar 17, 2026 |
| Grant date | Mar 17, 2026 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
The display device includes light emitting elements disposed on a first surface of a substrate, a connection electrode disposed on a second surface of the substrate, a first protective layer disposed on the connection electrode, and a second protective layer disposed on the first protective layer. A surface roughness of the second protective layer is greater than a surface roughness of the first protective layer.
First claim
Opening claim text (preview).
What is claimed is: 1 . A display device comprising: light emitting elements disposed on a first surface of a substrate; a connection electrode disposed on a second surface of the substrate; a first protective layer disposed on the connection electrode; and a second protective layer disposed on the first protective layer, wherein an entirety of an outer surface of the first protective layer is in contact with the second protective layer, and wherein a surface roughness of the second protective layer is greater than a surface roughness of the first protective layer. 2 . The display device of claim 1 , wherein an oxygen (O) content of the second protective layer is greater than an oxygen (O) content of the first protective layer. 3 . The display device of claim 1 , wherein the first protective layer includes silicon nitride (SiN x ). 4 . The display device of claim 1 , wherein the second protective layer includes silicon oxide (SiO x ). 5 . The display device of claim 1 , wherein the second protective layer includes silicon oxynitride (SiO x N y ). 6 . The display device of claim 1 , wherein a thickness of the second protective layer is less than a thickness of the first protective layer. 7 . The display device of claim 1 , further comprising: a via layer disposed between the connection electrode and the first protective layer. 8 . The display device of claim 7 , wherein a thickness of the via layer is greater than a thickness of the first protective layer. 9 . The display device of claim 1 , further comprising: at least one transistor disposed on the first surface of the substrate. 10 . The display device of claim 9 , further comprising: electrodes electrically connecting the at least one transistor and the light emitting elements to each other. 11 . A method of manufacturing a display device, the method comprising: forming a front pattern on a first surface of a substrate; forming a rear pattern on a second surface of the substrate; forming a first protective layer on the rear pattern, forming a second protective layer on the first protective layer; and forming a protective film on the second protective layer, wherein an entirety of an outer surface of the first protective layer is in contact with the second protective layer, and wherein a surface roughness of the second protective layer is greater than a surface roughness of the first protective layer. 12 . The method of claim 11 , further comprising: forming a front protective layer on the front pattern. 13 . The method of claim 12 , further comprising: etching the front protective layer after the forming of the protective film. 14 . The method of claim 13 , further comprising: removing an entirety of the protective film after the etching of the front protective layer. 15 . The method of claim 11 , further comprising: forming a protective film layer on the second protective layer, wherein the forming of the protective film includes curing the protective film layer. 16 . The method of claim 15 , wherein the protective film layer is formed by an inkjet printing. 17 . The method of claim 11 , wherein the second protective layer is thinner than the first protective layer. 18 . The method of claim 11 , wherein the first protective layer includes silicon nitride (SiN x ). 19 . The method of claim 11 , wherein the second protective layer includes silicon oxide (SiO x ). 20 . The method of claim 11 , wherein the second protective layer includes silicon oxynitride (SiO x N y ).
Assignees
Inventors
Classifications
Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title
between multiple chips · CPC title
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
relative to the surface, e.g. recessed, protruding · CPC title
Dispositions of multiple bond pads · CPC title
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- What does patent US12581738B2 cover?
- The display device includes light emitting elements disposed on a first surface of a substrate, a connection electrode disposed on a second surface of the substrate, a first protective layer disposed on the connection electrode, and a second protective layer disposed on the first protective layer. A surface roughness of the second protective layer is greater than a surface roughness of the firs…
- Who is the assignee on this patent?
- Samsung Display Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10W90/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 17 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).