Systems and methods for active and passive cooling of electrical components

Patent metadata

Field	Value
Publication number	US-12580477-B2
Application number	US-202318162468-A
Country	US
Kind code	B2
Filing date	Jan 31, 2023
Priority date	Sep 28, 2022
Publication date	Mar 17, 2026
Grant date	Mar 17, 2026

Abstract

A method for mounting a fin system in a power module includes: sintering a fin system to a first base substrate, the fin system comprising a plurality of fins attached to and extending away from a base plate; sintering a first power switch component to the first base substrate; sintering a second power switch component to a second base substrate; and soldering a heat dissipation element to the second base substrate.

First claim

What is claimed is:

1 . A method for mounting a fin system in a power module, the method comprising:
sintering an active heat dissipation fin system to a base plate, wherein the active heat dissipation fin system is configured to be in direct contact with coolant and dissipate heat either directly from a first power switch or a second power switch or from a passive heat dissipation element, the active heat dissipation fin system comprising a plurality of fins attached to and extending away from the base plate; sintering the base plate to a first base substrate to seal and secure the first base substrate to the base plate; sintering a first power switch component to the first base substrate; sintering a second power switch component to a second base substrate; soldering the passive heat dissipation element to the second base substrate, wherein no coolant directly contacts the passive heat dissipation element, and sealing a full assembly, including the active heat dissipation fin system, the base plate, the first power switch, the second power switch, and the passive heat dissipation element, to a casting, with the active heat dissipation fin system within the casting to sealingly isolate the active heat dissipation fin system from the first power switch and the second power switch.

2 . The method of claim 1 , wherein at least one of the first base substrate or the second base substrate comprise a top substrate, a connection material, and a bottom substrate.

3 . The method of claim 1 , wherein the fin system is sintered to the first base substrate via a first sintering layer, the first power switch component is sintered to the first base substrate via a second sintering layer, and the second power switch component is sintered to the second base substrate via a third sintering layer.

4 . The method of claim 1 , wherein each exterior surface of each of the plurality of fins includes a first exterior surface and a plurality of other exterior surfaces, the first exterior surface being attached to the base plate and the plurality of other exterior surfaces being floating surfaces.

5 . The method of claim 1 , further comprising attaching the fin system sintered to the first base substrate, the first power switch component sintered to the first base substrate, the second power switch component sintered to the second base substrate, and the active heat dissipation element soldered to the second base substrate.

6 . The method of claim 5 , wherein the attaching comprises at least one of applying an adhesive, applying an epoxy attachment, applying an elastomeric sealing, or friction stir welding.

7 . The method of claim 1 , further comprising:
activating a power switch comprising the first power switch component and the second power switch component; and dissipating heat generated in response to activating the power switch to the fin system.

8 . The method of claim 7 , further comprising:
causing coolant to flow through a coolant passage comprising the plurality of fins; and dissipating a portion of the heat received at the active heat dissipation element to the coolant.

9 . The method of claim 1 , further comprising:
activating a power switch comprising the first power switch component and the second power switch component; and dissipating heat generated in response to activating the power switch to the passive heat dissipation element or the active dissipation element.

10 . The method of claim 1 , further comprising applying a fluid seal to sealingly isolate the plurality of fins from at least one of the first power switch component or the second power switch component.

11 . The method of claim 1 , wherein at least one of the first power switch component or the second power switch component is at least one of a lead frame or a die.

Assignees

• Borgwarner Us Tech Llc

Inventors

• Gertiser Kevin M
• Fruth Chris

Classifications

• H05K2201/10166

  Transistor · CPC title

• H05K2201/042

  Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other · CPC title

• H05K7/20927 Primary

  Liquid coolant without phase change · CPC title

• H05K7/209

  Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence) · CPC title

• H05K7/20854

  Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20863 takes precedence) · CPC title