Semiconductor module cooler and method for manufacturing same

Patent metadata

Field	Value
Publication number	US-2016293518-A1
Application number	US-201615177885-A
Country	US
Kind code	A1
Filing date	Jun 9, 2016
Priority date	May 20, 2014
Publication date	Oct 6, 2016
Grant date	—

Abstract

A semiconductor module cooler for reducing a pressure loss of a coolant includes a first plate mounted with a first semiconductor module; a jacket disposed under the first plate and having a distribution portion, and first and second through-holes separated from each other to be disposed at end portions of the depression respectively; an inlet-side header disposed to cover the first through-hole from under the jacket; an outlet-side header disposed to cover the second through-hole from under the jacket and extending in parallel to the inlet-side header; and a plurality of cooling fins disposed in the depression and extending from above a distribution portion of the inlet-side header to above a water collection portion of the outlet-side header.

First claim

What is claimed is:

1 . A semiconductor module cooler, comprising:
a first plate mounted with a first semiconductor module; a jacket disposed under the first plate, and having a depression on a first plate side, and first and second through-holes separated from each other to be disposed at end portions of the depression respectively; an inlet-side header having a distribution portion disposed to cover the first through-hole from under the jacket, and an inlet-side pipe portion extending from the distribution portion in a longitudinal direction of the distribution portion; an outlet-side header having a water collection portion disposed to cover the second through-hole from under the jacket, and an outlet-side pipe portion extending from the water collection portion in a longitudinal direction of the water collection portion and in parallel to the inlet-side header; and a plurality of cooling fins disposed in the depression between the first plate and the jacket, and extending from above the distribution portion of the inlet-side header toward above the water collection portion of the outlet-side header.

2 . The semiconductor module cooler according to claim 1 , wherein a height of the depression of the jacket is shorter than an inner diameter of the inlet-side pipe portion and an inner diameter of the outlet-side pipe portion.

3 . The semiconductor module cooler according to claim 2 , wherein the distribution portion has a semicircular bottom surface extending from the inlet-side pipe portion, and
the water collection portion has a semicircular bottom surface extending from the outlet-side pipe portion.

4 . The semiconductor module cooler according to claim 1 , wherein the plurality of cooling fins includes an inlet-side cutout region at an inlet-side end portion above the inlet-side header and an outlet-side cutout region at an outlet-side end portion above the outlet-side header, and
a height of the inlet-side cutout region and a height of the outlet-side cutout region are less than that of a central portion of the cooling fins.

5 . The semiconductor module cooler according to claim 1 , wherein a cross-sectional area of a coolant flow path surrounded by an inner wall of the inlet-side header, the jacket, and lower ends of the cooling fins is larger than a cross-sectional area of an inside of the inlet-side pipe portion, and
a cross-sectional area of a coolant flow path surrounded by an inner wall of the outlet-side header, the jacket, and the lower ends of the cooling fins is larger than a cross-sectional area of an inside of the outlet-side pipe portion.

6 . The semiconductor module cooler according to claim 1 , wherein the jacket has a second semiconductor module between the inlet-side header and the outlet-side header.

7 . The semiconductor module cooler according to claim 1 , further comprising a second plate mounted with a capacitor,
wherein the jacket has an opening between the inlet-side header and the outlet-side header, and the second plate covers the opening from below.

8 . The semiconductor module cooler according to claim 1 , wherein the jacket, the inlet-side header, and the outlet-side header are made of resin.

9 . A method for manufacturing the semiconductor module cooler of claim 1 , comprising:
a cooling fin assembly step of accommodating the plurality of cooling fins in the depression of the jacket and disposing the first plate to cover the depression; a first plate connecting step of connecting the jacket and the first plate to each other; and a header connecting step of connecting the inlet-side header and the outlet-side header to the jacket.

10 . The method for manufacturing the semiconductor module cooler according to claim 9 , wherein the header connecting step is performed using an adhesive.

Assignees

• Fuji Electric Co Ltd

Inventors

• Gohara Hiromichi
• Arai Nobuhide

Classifications

• H10W40/226

  characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461) · CPC title

• H10W70/02

  of conductive package substrates serving as an interconnection, e.g. of metal plates (manufacture or treatment of leadframes H10W70/04) · CPC title

• H10W40/037

  Assembling together parts thereof · CPC title

• H10W40/47 Primary

  by flowing liquids, e.g. forced water cooling · CPC title

• H01L21/4871

  Electricity · mapped topic