Systems and methods for analyzing a sample using charged particle beams and active pixel control sensors

Patent metadata

Field	Value
Publication number	US-12580150-B2
Application number	US-202318545447-A
Country	US
Kind code	B2
Filing date	Dec 19, 2023
Priority date	Dec 19, 2023
Publication date	Mar 17, 2026
Grant date	Mar 17, 2026

Abstract

Systems and methods taught herein utilize a single detector to provide both unidimensional data (e.g., for direct topographical imaging) and multidimensional data (e.g., for crystallographic data) for a sample that is interrogated with a charged particle beam. In some examples, unidimensional data can include signal intensity due to backscattered electrons received across the entire detector surface while multidimensional data can include signal intensity due to backscattered electrons as a function of pixel position. By obtaining unidimensional data and multidimensional data from a single detector, the unidimensional data and multidimensional data can be obtained at a same location, at a same time, or both at the same location and same time.

First claim

What is claimed is:

1 . A charged particle detector system, comprising:
an active pixel control sensor having a sensor layer and a readout chip and including a plurality of pixels, each pixel in the plurality of pixels producing at least an electron and a hole upon being struck by a charged particle; a first readout circuit in communication with the sensor layer and configured to receive a unidimensional data signal corresponding to one of the electron or hole produced by the charged particle strike; and a second readout circuit in communication with the readout chip and configured to receive a multidimensional data signal corresponding to the other of the electron or hole produced by the charged particle strike.

2 . The charged particle detector system of claim 1 , wherein the first readout circuit includes a current mirror to receive the unidimensional data signal as an input signal and to output at least two mirrored signals corresponding to the input signal.

3 . The charged particle detector system of claim 2 , wherein the first readout circuit includes an amplifier and a peripheral interface adapter, the amplifier receiving one of the mirrored signals from the current mirror.

4 . The charged particle detector system of claim 2 , wherein the first readout circuit includes a bias voltage source that receives one of the mirrored signals from the current mirror.

5 . The charged particle detector system of claim 1 , wherein the second readout circuit includes a field programmable gate array that receives and decodes the multidimensional data signal from the readout chip.

6 . The charged particle detector system of claim 1 , wherein the unidimensional data signal and the multidimensional data signal are generated by the active pixel control sensor contemporaneously.

7 . The charged particle detector system of claim 1 , further comprising:
a first computing device that processes the unidimensional data to produce an intensity image; and a second computing device that processes the multidimensional data to produce a structural image.

8 . The charged particle detector system of claim 7 , wherein the intensity image and the structural image are automatically co-registered.

9 . The charged particle detector system of claim 7 , wherein the first computing device and the second computing device are a same computing device.

10 . The charged particle detector system of claim 1 , wherein the active pixel control sensor is a monolithic active pixel sensor (MAPS).

11 . The charged particle detector system of claim 1 , wherein the active pixel control sensor is a hybrid pixel array detector (HPAD).

12 . The charged particle detector system of claim 1 , wherein the active pixel control sensor is configured to be disposed in a position with respect to the sample to measure reflected Kikuchi diffraction.

13 . A method of imaging a sample, comprising:
receiving charged particles from a sample at a plurality of pixels in an active pixel control sensor, the active pixel control sensor including a sensor layer and a readout chip, each pixel in the plurality of pixels producing at least an electron and a hole upon being struck by a charged particle; transmitting a unidimensional data signal corresponding to one of the electrons or holes produced by the charged particle strikes from the sensor layer to a first readout circuit; generating unidimensional data from the unidimensional data signal using the first readout circuit; transmitting a multidimensional data signal corresponding to the other of the electrons or holes produced by the charged particle strikes from the readout chip to a second readout circuit; and generating multidimensional data from the multidimensional data signal using the second readout circuit.

14 . The method of claim 13 , wherein generating the unidimensional data includes generating two mirrored signals corresponding to the unidimensional data signal using a current mirror.

15 . The method of claim 14 , furthering comprising applying a bias voltage to the active pixel control sensor using a bias voltage source that receives one of the mirrored signals from the current mirror.

16 . The method of claim 14 , wherein generating the unidimensional data further includes amplifying one of the mirrored signals using an amplifier.

17 . The method of claim 13 , wherein the steps of transmitting the unidimensional data signal and transmitting the multidimensional data signal happen contemporaneously.

18 . The method of claim 13 , further comprising:
forming an intensity image of the sample with a first computing device that receives unidimensional data from the first readout circuit; and forming a structural image of the sample with a second computing device that receives multidimensional data from the second readout circuit.

19 . The method of claim 13 , wherein the intensity image and the structural image are automatically co-registered.

20 . The method of claim 13 , wherein generating the multidimensional data includes receiving and decoding the multidimensional data signal at a field programmable gate array.

Assignees

• Fei Co

Inventors

• Straka Branislav
• Stejskal Pavel
• Vystavel Tomas
• Holzer Jakub

Classifications

• H01J2237/24495

  Signal processing, e.g. mixing of two or more signals · CPC title

• H01J2237/2441

  Semiconductor detectors, e.g. diodes · CPC title

• H01J37/28

  with scanning beams {(H01J37/268, H01J37/292, H01J37/2955 take precedence)} · CPC title

• G01N2223/418

  electron microscope · CPC title

• G01N2223/413

  sensor array [CCD] · CPC title