Sensor arrangement

Patent metadata

Field	Value
Publication number	US-9448130-B2
Application number	US-201314016046-A
Country	US
Kind code	B2
Filing date	Aug 31, 2013
Priority date	Aug 31, 2013
Publication date	Sep 20, 2016
Grant date	Sep 20, 2016

Abstract

A sensor arrangement for sensing an environmental property of an environment of the sensor arrangement, the sensor arrangement comprising:
a carrier; an active sensor component arranged at the carrier and configured for providing a sensor signal being indicative of the environmental property; a molding structure encapsulating at least a part of an exterior surface of the carrier and comprising an access recess exposing the active sensor component with regard to the environment; wherein the access recess is arranged asymmetrically with regard to the carrier.

First claim

What is claimed is:

1. A sensor arrangement for sensing an environmental property of an environment of the sensor arrangement, the sensor arrangement comprising:
a carrier;
an active sensor component arranged at the carrier and configured for providing a sensor signal being indicative of the environmental property;
a molding structure encapsulating at least a part of an exterior surface of the carrier and comprising an access recess exposing the active sensor component with regard to the environment;
wherein the access recess is arranged asymmetrically with regard to the carrier;
wherein one part of the molding structure being free of wire bonds substantially flushes with the active sensor component; and
wherein the one part of the molding structure forms a continuous surface together with a juxtaposed portion of the carrier; and
wherein the molding structure comprises an annular section which circumferentially surrounds the active sensor component and the continuous surface.

2. The sensor arrangement according to claim 1 , wherein a center of gravity of the access recess is displaced with regard to a center of gravity of the carrier in a lateral direction.

3. The sensor arrangement according to claim 1 , wherein a center of gravity of the active sensor component is displaced with regard to a center of gravity of the carrier in a lateral direction.

4. The sensor arrangement according to claim 1 , comprising at least one electric connection structure configured for electrically contacting the carrier and being arranged exclusively at a side of the active sensor component which faces a center of gravity of the carrier, whereas another side of the active sensor component which is averted with regard to the center of gravity of the carrier is free of electric connection structures.

5. The sensor arrangement according to claim 1 , comprising at least one wire bond configured for electrically contacting the carrier and being arranged exclusively at a lateral side of the active sensor component which faces a center of gravity of the carrier, whereas another lateral side of the active sensor component which is averted with regard to the center of gravity of the carrier is free of wire bonds.

6. The sensor arrangement according to claim 5 , comprising at least one electrically conductive pad extending partially inside and partially outside of the molding structure, wherein each of the at least one electrically conductive pad is electrically connected to an assigned one of the at least one wire bond.

7. The sensor arrangement according to claim 1 , wherein one part of the annular section being free of wire bonds has a smaller thickness in a lateral direction than another part of the annular section which encapsulates at least one wire bond for electrically contacting the carrier.

8. The sensor arrangement according to claim 1 , wherein a protrusion of the molding structure protrudes beyond the carrier only along a part of a circumference of the carrier.

9. The sensor arrangement according to claim 8 , wherein one part of the molding structure being free of wire bonds substantially flushes with the active sensor component while the protrusion encapsulates at least one wire bond for electrically contacting the carrier.

10. The sensor arrangement according to claim 1 ,
further comprising a further carrier and a further active sensor component mounted on the further carrier and configured for providing a further sensor signal being indicative of another environmental property;
wherein the molding structure encapsulates at least a part of an exterior surface of the further carrier and the further active sensor component is exposed with regard to the environment.

11. The sensor arrangement according to claim 1 ,
further comprising a further active sensor component mounted on the carrier and configured for providing a further sensor signal being indicative of a further environmental property;
wherein the molding structure comprises a further access recess exposing the further active sensor component with regard to the environment;
wherein the further access recess is arranged asymmetrically with regard to the carrier.

12. The sensor arrangement according to claim 1 , wherein the molding structure has an asymmetric shape.

13. The sensor arrangement according to claim 1 , wherein the active sensor component is mounted on a mounting surface of the carrier, in particular on a main surface of the carrier.

14. The sensor arrangement according to claim 1 , wherein the active sensor component is formed as part of the carrier, in particular at a lateral surface of the carrier and separated from a rest of the carrier by at least one trench.

15. A method of manufacturing a sensor arrangement for sensing an environmental property of an environment of the sensor arrangement, the method comprising:
arranging an active sensor component at a carrier;
configuring the active sensor component for providing a sensor signal being indicative of the environmental property when the sensor arrangement is in operation;
forming a molding structure to encapsulate at least a part of an exterior surface of the carrier and to comprise an access recess exposing the active sensor component with regard to the environment so that the access recess is arranged asymmetrically with regard to the carrier;
wherein one part of the molding structure being free of wire bonds substantially flushes with the active sensor component; and
wherein the one part of the molding structure forms a continuous surface together with a juxtaposed portion of the carrier; and
wherein the molding structure comprises an annular section which circumferentially surrounds the active sensor component and the continuous surface.

16. The method according to claim 15 , wherein the method comprises electrically contacting the carrier by electric connection structures, in particular by wire bonds, being attached to the carrier in an asymmetric pattern around only part of the circumference thereof before forming the molding structure to completely encapsulate the wire bonds.

17. The method according to claim 15 , wherein the method comprises forming the access recess by temporarily inserting at least one insert into a volume later forming the access recess, and retracting the at least one insert out of the access recess after having formed the molding structure.

18. The method according to claim 15 , wherein the method comprises forming the access recess by forming at least one sacrificial structure within a volume later forming the access recess, and selectively eliminating the sacrificial structure after having formed the molding structure.

19. The method according to claim 15 , wherein the method comprises arranging the access recess with regard to the carrier so that a distance between the active sensor component and at least one wire bond contacting the carrier is more than a predefined threshold value.

Assignees

• Infineon Technologies Ag

Inventors

• Vaupel Mathias
• Theuss Horst
• Lehmann Thomas

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W72/5449

  not being orthogonal to a side surface of the chip, e.g. fan-out arrangements · CPC title

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• H10W74/141 Primary

  the encapsulations being on at least the sidewalls of the semiconductor body · CPC title