US12568577B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12568577-B2 |
| Application number | US-202318302258-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 18, 2023 |
| Priority date | Apr 27, 2022 |
| Publication date | Mar 3, 2026 |
| Grant date | Mar 3, 2026 |
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Disclosed are surface-treated copper foils having at least one treated surface that exhibit high conductivity and a set of surface properties. Also provided are flexible copper-clad laminates and printed circuits made therefrom. The present printed circuits exhibit low insertion loss and are suitable for use in high speed/high frequency applications.
Opening claim text (preview).
What is claimed is: 1 . A flexible copper-clad laminate, comprising: a surface-treated copper foil, characterized in that the surface-treated copper foil has an electric conductivity of 57.0×10 6 S/m or more, a cross-sectional average grain size of about 1 μm to about 2.5 μm, a thickness of about 3 μm to about 35 μm; and the surface-treated copper foil has a treated surface that has a surface roughness (Sz) of 3.0 μm or less, wherein the surface roughness (Sz) is measured at an outermost surface of the surface-treated copper foil according to ISO 25178; and a dielectric layer provided on the treated surface of the surface-treated copper foil, wherein: the dielectric layer has a thickness of about 5 μm to about 100 μm; the dielectric layer is composed of a layer of a polymeric material having a thermal decomposition temperature (1%) of 260° C. or higher; and the flexible copper-clad laminate has a peel strength of about 0.9 kN/m or more as measured according to IPC-TM 650. 2 . The flexible copper-clad laminate of claim 1 , wherein the dielectric layer has a Dk of 3.4 or less and a Df of 0.006 or less at a frequency of 10 GHz as measured according to IPC-TM 650 No. 2.5.5.13. 3 . The flexible copper-clad laminate of claim 1 , wherein the dielectric layer is composed of polyimide. 4 . A printed circuit board, that is manufactured from the flexible copper-clad laminate of claim 1 , wherein the printed circuit board is a flexible printed circuit board, a flexible-rigid printed circuit board or a rigid printed circuit board. 5 . The printed circuit board of claim 4 , which is a flexible printed circuit board that exhibits an insertion loss of 3.28 dB/10 cm or less at a frequency of 10 GHZ, or that exhibits an insertion loss of 6.10 dB/10 cm or less at a frequency of 28 GHz. 6 . An electronic device, comprising the printed circuit board of claim 4 .
of coating · CPC title
Absolute thicknesses specified · CPC title
Film [e.g., glaze, etc.] · CPC title
Oxide · CPC title
Coating layer not in excess of 5 mils thick or equivalent · CPC title
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