System and method for thermally calibrating semiconductor process chambers
US-11747209-B2 · Sep 5, 2023 · US
US12566092B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12566092-B2 |
| Application number | US-202318320685-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 19, 2023 |
| Priority date | Jan 19, 2021 |
| Publication date | Mar 3, 2026 |
| Grant date | Mar 3, 2026 |
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A method and a device determine the heating state of an optical element in an optical system, for example in a microlithographic projection exposure system. Electromagnetic radiation hits an incidence surface of the optical element during operation of the optical system. Using a calibration parameter, an average temperature at the incidence surface is estimated on the basis of a temperature measurement carried out via at least one temperature sensor located a distance from the incidence surface. The calibration parameter is selected differently in accordance with the illumination setting which is set in the optical system.
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What is claimed is: 1 . A method, comprising: exposing an incidence surface of an optical element to electromagnetic radiation; measuring a temperature using at least one temperature sensor arranged at a distance from the incidence surface; determining a calibration parameter based on an illumination setting in the optical system; and using the calibration parameter to estimate an average temperature of the incidence surface based on the temperature measurement, wherein the method further comprises determining the calibration parameter based on at least one measurement or simulation of a variable for the illumination setting currently set in the optical system, wherein the variable depends on a thermal state of the optical element, and wherein: the variable dependent on the thermal state of the optical element is an intensity distribution generated during the operation of the optical system in a plane located downstream of the optical element along a beam path of the electromagnetic radiation through the optical system; or the variable dependent on the thermal state of the optical element is a wavefront generated during the operation of the optical system in a plane located downstream of the optical element along a beam path of the electromagnetic radiation through the optical system. 2 . The method of claim 1 , further comprising: ascertaining a reference illumination setting; and determining the calibration parameter based on a reference calibration parameter for the reference illumination setting. 3 . The method of claim 1 , wherein the variable dependent on the thermal state of the optical element is an intensity distribution generated during the operation of the optical system in a plane located downstream of the optical element along a beam path of the electromagnetic radiation through the optical system. 4 . The method of claim 1 , wherein the variable dependent on the thermal state of the optical element is a wavefront generated during the operation of the optical system in a plane located downstream of the optical element along a beam path of the electromagnetic radiation through the optical system. 5 . The method of claim 1 , further comprising taking into account the distance of the at least one temperature sensor from the incidence surface when determining the calibration parameter. 6 . The method of claim 1 , further comprising repeatedly making the temperature measurement using the at least one temperature sensor, thereby ascertaining a time profile. 7 . The method of claim 1 , wherein the at least one temperature sensor is arranged in an access channel which extends from a side of the optical element facing away from the incidence surface into the optical element. 8 . The method of claim 1 , further comprising using the estimated average temperature as an input signal for closed-loop control of at least one parameter characterizing the optical element and/or the optical system. 9 . The method of claim 1 , further comprising controlling a pre-heating of the optical element based on the estimated average temperature to at least partially compensate for changes in the heating state of the optical element over time which occur during the operation of the optical system. 10 . The method of claim 1 , wherein the optical element comprises a mirror. 11 . The method of claim 1 , wherein the electromagnetic radiation has a wavelength of less than 30 nm. 12 . The method of claim 1 , wherein the optical system is a microlithographic projection exposure apparatus. 13 . The method of claim 12 , further comprising selecting the calibration parameter depending on a reticle used in the projection exposure apparatus. 14 . The method of claim 13 , wherein the average temperature is estimated during the operation of the microlithographic projection exposure apparatus. 15 . The method of claim 12 , wherein the average temperature is estimated during the operation of the microlithographic projection exposure apparatus. 16 . A method of estimating an average temperature of an incidence surface of an optical element of an optical system, the optical element configured to have electromagnetic radiation incident thereon during use of the optical system, the method comprising: measuring a temperature using at least one temperature sensor arranged at a distance from the incidence surface; determining a calibration parameter based on an illumination setting in the optical system; and using the calibration parameter to estimate the average temperature of the incidence surface based on the temperature measurement, wherein the method further comprises determining the calibration parameter based on at least one measurement or simulation of a variable for the illumination setting currently set in the optical system, wherein the variable depends on a thermal state of the optical element, and wherein: the variable dependent on the thermal state of the optical element is an intensity distribution generated during the operation of the optical system in a plane located downstream of the optical element along a beam path of the electromagnetic radiation through the optical system; or the variable dependent on the thermal state of the optical element is a wavefront generated during the operation of the optical system in a plane located downstream of the optical element along a beam path of the electromagnetic radiation through the optical system. 17 . The method of claim 16 , wherein the variable dependent on the thermal state of the optical element is an intensity distribution generated during the operation of the optical system in a plane located downstream of the optical element along a beam path of the electromagnetic radiation through the optical system. 18 . The method of claim 16 , wherein the variable dependent on the thermal state of the optical element is a wavefront generated during the operation of the optical system in a plane located downstream of the optical element along a beam path of the electromagnetic radiation through the optical system. 19 . The method of claim 16 , wherein the optical system is a microlithographic projection exposure apparatus. 20 . The method of claim 19 , further comprising selecting the calibration parameter depending on a reticle used in the projection exposure apparatus.
Temperature · CPC title
Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging · CPC title
Mirrors {(vehicle mirrors involving special optical features B60R1/08)} · CPC title
Calibration (using comparison with reference sources G01J5/52) · CPC title
with cooling or heating systems (cooling arrangements for laser mirrors H01S3/0401) · CPC title
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