Low cost approach for depositing solder and adhesives in a pattern for forming electronic assemblies

Patent metadata

Field	Value
Publication number	US-12564908-B2
Application number	US-202117200168-A
Country	US
Kind code	B2
Filing date	Mar 12, 2021
Priority date	Nov 29, 2018
Publication date	Mar 3, 2026
Grant date	Mar 3, 2026

Abstract

A method for depositing a material to join two surfaces of an electronic assembly includes determining, using dimensions of a pad area of a substrate, a deposition pattern for the material that extends across the pad area of the substrate. The method further includes creating a tool to deposit the material in the deposition pattern that extends across the pad area of the substrate.

First claim

What is claimed is:

1 . A substrate of an electronic assembly comprising:
a solder paste comprising a metal in a deposition pattern within a pad area of the substrate, the deposition pattern comprising an array of discrete domains of the solder paste comprising the metal that extends across the pad area of the substrate with regular spacings of about 0.076 to about 0.203 millimeters (mm) between the discrete domains, the deposition pattern comprising the array of discrete domains has a tangency with respect to an edge of the pad area of about 0.025 mm to about 0.127 mm; wherein the pad area comprises palladium or a palladium alloy.

2 . The substrate of claim 1 , wherein a pitch of the array of discrete domains is about 0.254 to about 1.27 millimeters (mm).

3 . The substrate of claim 1 , wherein the substrate is a bottom termination component or microcircuit.

4 . The substrate of claim 1 , wherein the solder paste includes lead (Pb).

5 . The substrate of claim 1 , wherein the solder paste is tin-lead (SnPb), tin-lead-silver (SnPbAg), tin-silver-copper (SnAgCu), tin-silver-bismuth (SnAgBi), tin-bismuth (SnBi), tin-indium (SnIn), or any combination thereof.

Assignees

• Raytheon Co

Inventors

• Martinez Sergio V
• Ogorzalek Jeffrey R
• Lott Patrick J

Classifications

• H05K2203/0126

  Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes · CPC title

• H05K3/3436

  having an array of bottom contacts, e.g. pad grid array or ball grid array components · CPC title

• H05K3/323

  by applying an anisotropic conductive adhesive layer over an array of pads · CPC title

• B23K3/0638

  for viscous material feeding, e.g. solder paste feeding (B23K3/0623 takes precedence) · CPC title

• B23K1/0016

  Soldering of electronic components · CPC title