Component Connection
US-2015003899-A1 · Jan 1, 2015 · US
Method for connecting a component to a support via soldering and component connectable with a support
US10099318B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10099318-B2 |
| Application number | US-201314408345-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 18, 2013 |
| Priority date | Jun 19, 2012 |
| Publication date | Oct 16, 2018 |
| Grant date | Oct 16, 2018 |
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- Title
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- Abstract
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- Assignees and inventors
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- First independent claim
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Abstract
Official abstract text for this publication.
A method for connecting a component to a support via soldering between a first contact surface of the component and a second contact surface of the support. The method is distinguished by features including that at least one spacer is embodied in such a manner and arranged between the first contact surface and the second contact surface that the first contact surface and the second contact surface are spaced from one another, and that the soldering is executed in such a manner that the component and the support are connected with one another via the first contact surface and the second contact surface. Also claimed is a component connectable with a support via soldering is intended.
First claim
Opening claim text (preview).
The invention claimed is: 1. A method for the manufacturing of pressure sensors, wherein a sensor electronics on a circuit board is connected by means of a plurality of components via soldering with a ceramic, pressure sensitive, sensor element, the method comprising: connecting the components to the ceramic sensor element via soldering between a first contact surface of each of the components and a second contact surface of the sensor element, wherein solder joints obtained by said soldering provide simultaneously also the electrical contacting of the sensor element, wherein at least one spacer is embodied in such a manner and arranged between the first contact surface and the second contact surface that the first contact surface and the second contact surface are spaced from one another, wherein the spacer is formed on the cylindrical components, wherein the spacer has a height between 100 μm and 300 μm, and wherein the diameter of the spacer amounts to between 10 and 40 percent of the diameter of the first contact surface of the component, wherein the components and the spacer are manufactured of a metal or a metal alloy, wherein the spacer is one-piece with the component or with at least a section of the component having the contact surface, wherein the solder is applied on the second contact surface in the form of a solder paste and the components are superimposed in such a manner on the sensor element that the first contact surface of the components is positioned above the second contact surface of the sensor element, wherein the soldering is executed in such a manner that the components and the sensor element are connected with one another via the first contact surface and the second contact surface. 2. The method as claimed in claim 1 , wherein: the diameter of the spacer amounts to between 15 and 20 percent of the diameter of the first contact surface of the component.
Assignees
Inventors
Classifications
Cross-Sectional Technologies · mapped topic
- H05K3/3431Primary
Leadless components · CPC title
Cross-Sectional Technologies · mapped topic
Metallic bump or raised conductor not used as solder bump · CPC title
Permanent spacer or stand-off in a printed circuit or printed circuit assembly · CPC title
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Frequently asked questions
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- What does patent US10099318B2 cover?
- A method for connecting a component to a support via soldering between a first contact surface of the component and a second contact surface of the support. The method is distinguished by features including that at least one spacer is embodied in such a manner and arranged between the first contact surface and the second contact surface that the first contact surface and the second contact surf…
- Who is the assignee on this patent?
- Endress Hauser Gmbh Co Kg, Endress Hauser Se Co Kg
- What technology area does this patent fall under?
- Primary CPC classification H05K3/3431. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Oct 16 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).