Amorphous alloy, molding die, and method for forming optical element
US-11053151-B2 · Jul 6, 2021 · US
US12559834B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12559834-B2 |
| Application number | US-202318318096-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 16, 2023 |
| Priority date | May 23, 2022 |
| Publication date | Feb 24, 2026 |
| Grant date | Feb 24, 2026 |
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A method to grow metallic glass films utilizes engineering steep, spatially modulated compositional gradients during physical vapor deposition. This method can be used to enhance the thermal stability (increase glass transition and crystallization temperature) of thin film metallic glasses or can be used to produce amorphous films of metallic alloys that do not readily form a glassy structure.
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What is claimed is: 1 . A method of forming a metallic glass film, the method comprising: providing a first target comprising a first material and a second target comprising a second material to a sputtering system, simultaneously depositing the first material with a first applied power and the second material with a second applied power on a substrate, wherein the first applied power is greater than the second applied power, wherein the first applied power is applied to the first target and the second applied power is applied to the second target; adjusting the first applied power and the second applied power, by decreasing the first applied power and increasing the second applied power, wherein the second applied power is greater than the first applied power; and re-adjusting the first applied power and the second applied power, by decreasing the second applied power and increasing the first applied power, wherein the first applied power is greater than the second applied power, wherein the metallic glass film comprises a binary alloy, and wherein the first material is Ni and the second material is Al. 2 . The method of claim 1 , wherein the metallic glass film comprises an average atomic composition of 50% the first material and 50% of the second material. 3 . The method of claim 1 , wherein the metallic glass film comprises a second material composition that varies from 80% to 20% to 80% over each layer. 4 . The method of claim 1 , wherein the metallic glass film is amorphous. 5 . The method of claim 1 , further comprising annealing the metallic glass film after the desired film thickness is obtained at a temperature between 250 and 400 degrees Celsius, wherein the annealing results in crystallization of the film. 6 . The method of claim 1 , wherein the metallic glass film comprises a diffusion barrier in a semiconductor device. 7 . The method of claim 1 , wherein a third target comprising a third material is provided to the sputtering system, wherein the third material is deposited using a third applied power on the substrate, wherein the third applied power is applied to the third target, and wherein the third applied power is adjusted based on the first applied power and second applied power.
Metallic material, boron or silicon · CPC title
by cathodic sputtering · CPC title
Controlling or regulating the coating process · CPC title
Variation of parameters during sputtering · CPC title
by cathodic sputtering · CPC title
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