US12559773B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12559773-B2 |
| Application number | US-201917288693-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 21, 2019 |
| Priority date | Oct 26, 2018 |
| Publication date | Feb 24, 2026 |
| Grant date | Feb 24, 2026 |
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The present invention addresses the problem of providing a bubble ejection method based on a new principle that is different from conventional bubble ejection methods and a bubble ejecting device.To solve the problem, provided is a bubble ejection method using a bubble ejecting device, wherein the bubble ejecting device comprises a substrate formed of a dielectric,at least one bubble ejection hole formed so as to penetrate through a first face and a second face, which is a face opposite to the first face, of the substrate,a first opening formed at a position of the first face at which the bubble ejection hole penetrates, anda second opening formed at a position of the second face at which the bubble ejection hole penetrates,the bubble ejection method comprising:a substrate-conductive liquid contact step;a conductive liquid-electrode contact step;a voltage application step; anda bubble ejection step.
Opening claim text (preview).
The invention claimed is: 1 . A bubble ejection method using a bubble ejecting device, wherein the bubble ejecting device comprises: a substrate formed of a dielectric, at least one bubble ejection hole formed so as to penetrate through a first face and a second face, which is a face opposite to the first face, of the substrate, a first opening formed at a position of the first face at which the bubble ejection hole penetrates, and a second opening formed at a position of the second face at which the bubble ejection hole penetrates, the bubble ejection method comprising: disposing a conductive liquid onto a processing target; bringing a portion including at least the first opening and the second opening into contact with the conductive liquid; bringing a first electrode into contact with the conductive liquid on the first opening side and bringing a second electrode into contact with the conductive liquid on the second opening side; applying a voltage between the first electrode and the second electrode; ejecting a whole bubble from the bubble ejection hole onto the processing target through the conductive liquid disposed outside the bubble ejection hole. 2 . The bubble ejection method according to claim 1 , wherein at least two or more bubble ejection holes are formed. 3 . The bubble ejection method according to claim 1 , wherein a size of the first opening and a size of the second opening are different from each other. 4 . The bubble ejection method according to claim 1 , wherein a dielectric strength of the dielectric is greater than or equal to 10 MV/m. 5 . The bubble ejection method according to claim 1 , wherein the substrate is formed of a flexible material. 6 . The bubble ejection method according to claim 2 , wherein a dielectric strength of the dielectric is greater than or equal to 10 MV/m. 7 . The bubble ejection method according to claim 3 , wherein a dielectric strength of the dielectric is greater than or equal to 10 MV/m. 8 . The bubble ejection method according to claim 2 , wherein the substrate is formed of a flexible material. 9 . The bubble ejection method according to claim 3 , wherein the substrate is formed of a flexible material. 10 . The bubble ejection method according to claim 4 , wherein the substrate is formed of a flexible material. 11 . The bubble ejection method according to claim 1 , wherein a material forming the substrate is at least one selected from the group consisting of polyimide, polystyrene, a glass, an epoxy resin containing no filler, an epoxy resin containing a silica filler, and an epoxy resin containing a glass fiber filler. 12 . The bubble ejection method according to claim 4 , wherein a material forming the substrate is at least one selected from the group consisting of polyimide, polystyrene, a glass, an epoxy resin containing no filler, an epoxy resin containing a silica filler, and an epoxy resin containing a glass fiber filler. 13 . The bubble ejection method according to claim 10 , wherein a material forming the substrate is polyimide. 14 . The bubble ejection method according to claim 1 , wherein the processing target is cut by ejecting the ejected bubbles onto the processing target. 15 . The bubble ejection method according to claim 14 , wherein a material forming the substrate is at least one selected from the group consisting of polyimide, polystyrene, a glass, an epoxy resin containing no filler, an epoxy resin containing a silica filler, and an epoxy resin containing a glass fiber filler. 16 . The bubble ejection method according to claim 1 , wherein the conductive liquid includes an injection substance, and wherein the injection substance is introduced to the processing target by ejecting the ejected bubbles onto the processing target. 17 . The bubble ejection method according to claim 16 , wherein a material forming the substrate is at least one selected from the group consisting of polyimide, polystyrene, a glass, an epoxy resin containing no filler, an epoxy resin containing a silica filler, and an epoxy resin containing a glass fiber filler. 18 . The bubble ejection method according to claim 1 , wherein the conductive liquid is a plating liquid, and wherein the processing target is plated by ejecting the ejected bubbles onto the processing target. 19 . The bubble ejection method according to claim 18 , wherein a material forming the substrate is at least one selected from the group consisting of polyimide, polystyrene, a glass, an epoxy resin containing no filler, an epoxy resin containing a silica filler, and an epoxy resin containing a glass fiber filler.
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