Cooling system for processing chamber
US-2024393018-A1 · Nov 28, 2024 · US
Multi-layer ceramic plate device
US12558734B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12558734-B2 |
| Application number | US-202318347662-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 6, 2023 |
| Priority date | Nov 30, 2011 |
| Publication date | Feb 24, 2026 |
| Grant date | Feb 24, 2026 |
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- Title
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- Abstract
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- Assignees and inventors
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- Key dates
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- First independent claim
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Abstract
Official abstract text for this publication.
An electrostatic chuck includes a ceramic top plate layer made of a beryllium oxide material, a ceramic bottom plate layer made of a beryllium oxide material, a ceramic middle plate layer disposed between the ceramic top plate layer and the ceramic bottom plate layer, an electrode layer disposed between the ceramic top plate layer and the ceramic middle plate layer, and a heater layer disposed between the ceramic middle plate layer and the ceramic bottom plate layer. The electrode layer joins and hermetically seals the ceramic top plate layer to the ceramic middle plate layer, and the heater layer joins and hermetically seals the ceramic middle plate layer to the ceramic bottom plate layer.
First claim
Opening claim text (preview).
What is claimed is: 1 . An electrostatic chuck comprising: a ceramic top plate layer comprising a beryllium oxide material; a ceramic bottom plate layer comprising a beryllium oxide material; a ceramic middle plate layer disposed between the ceramic top plate layer and the ceramic bottom plate layer; an electrode layer disposed between the ceramic top plate layer and the ceramic middle plate layer; and a heater layer disposed between the ceramic middle plate layer and the ceramic bottom plate layer. 2 . The electrostatic chuck according to claim 1 , further comprising: a shaft comprising a beryllium oxide material, the shaft joined to a lower surface of the ceramic bottom plate layer; and a joining layer disposed between the shaft and the ceramic bottom plate layer, wherein the joining layer joins and hermetically seals the shaft to the ceramic bottom plate layer. 3 . The electrostatic chuck according to claim 2 , wherein an upper surface of the shaft comprises a plurality of mesas. 4 . The electrostatic chuck according to claim 1 , further comprising a labyrinth disposed around a periphery of the ceramic top plate layer and the ceramic middle plate layer. 5 . The electrostatic chuck according to claim 1 , further comprising a standoff disposed between the ceramic top plate layer and the ceramic middle plate layer. 6 . The electrostatic chuck according to claim 1 , further comprising a standoff disposed between the ceramic middle plate layer and the ceramic bottom plate layer. 7 . The electrostatic chuck according to claim 1 , further comprising an annular joining layer disposed radially outward from the heater layer, wherein the annular joining layer further joins and hermetically seals the ceramic middle plate layer to the ceramic bottom plate layer. 8 . The electrostatic chuck according to claim 1 , wherein at least one of the ceramic top plate layer, the ceramic middle plate layer, and the ceramic bottom plate layer comprise doped beryllium oxide. 9 . A ceramic heater assembly comprising: a ceramic top plate layer comprising a beryllium oxide material; a ceramic bottom plate layer comprising a beryllium oxide material; a heater layer disposed between the ceramic top plate layer and the ceramic bottom plate layer; and an annular joining layer disposed radially outward from the heater layer, wherein the annular joining layer further joins and hermetically seals the ceramic top plate layer to the ceramic bottom plate layer. 10 . The ceramic heater assembly according to claim 9 , further comprising: a shaft comprising a beryllium oxide material, the shaft joined to a lower surface of the ceramic bottom plate layer; and a joining layer disposed between the shaft and the ceramic bottom plate layer, wherein the joining layer joins and hermetically seals the shaft to the ceramic bottom plate layer. 11 . The ceramic heater assembly according to claim 10 , wherein an upper surface of the shaft comprises a plurality of mesas. 12 . The ceramic heater assembly according to claim 9 , further comprising a standoff disposed between the ceramic top plate layer and the ceramic bottom plate layer. 13 . The ceramic heater assembly according to claim 9 , wherein at least one of the ceramic top plate layer and the ceramic bottom plate layer comprise doped beryllium oxide. 14 . An electrostatic chuck comprising: a ceramic top plate layer comprising a beryllium oxide material; a ceramic bottom plate layer comprising a beryllium oxide material; a ceramic middle plate layer disposed between the ceramic top plate layer and the ceramic bottom plate layer; an electrode layer disposed between the ceramic top plate layer and the ceramic middle plate layer; a heater layer disposed between the ceramic middle plate layer and the ceramic bottom plate layer; a shaft comprising a beryllium oxide material, the shaft joined to a lower surface of the ceramic bottom plate layer; and a joining layer disposed between the shaft and the ceramic bottom plate layer. 15 . The electrostatic chuck according to claim 14 , wherein an upper surface of the shaft comprises a plurality of mesas. 16 . The electrostatic chuck according to claim 14 , further comprising an annular joining layer disposed radially outward from the heater layer, wherein the annular joining layer further joins and hermetically seals the ceramic middle plate layer to the ceramic bottom plate layer. 17 . The electrostatic chuck according to claim 14 , further comprising an annular joining layer disposed radially outward from the electrode layer, wherein the annular joining layer further joins and hermetically seals the ceramic top plate layer to the ceramic middle plate layer. 18 . The electrostatic chuck according to claim 14 , wherein at least one of the ceramic top plate layer, the ceramic middle plate layer, and the ceramic bottom plate layer comprise doped beryllium oxide. 19 . The electrostatic chuck according to claim 14 , further comprising a labyrinth disposed around a periphery of the ceramic top plate layer and the ceramic middle plate layer. 20 . A ceramic heater assembly comprising: a ceramic top plate layer comprising a beryllium oxide material; a ceramic bottom plate layer comprising a beryllium oxide material; a heater layer disposed between the ceramic top plate layer and the ceramic bottom plate layer; a shaft comprising a beryllium oxide material, the shaft joined to a lower surface of the ceramic bottom plate layer; and a joining layer disposed between the shaft and the ceramic bottom plate layer, wherein the joining layer joins and hermetically seals the shaft to the ceramic bottom plate layer.
Assignees
Inventors
Classifications
characterised by the mechanical construction of the susceptor, stage or support · CPC title
characterised by a coating, a hardness or a material · CPC title
Details of electrostatic chucks · CPC title
mainly by conduction · CPC title
- H10P72/72Primary
using electrostatic chucks · CPC title
Patent family
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US12558734B2 cover?
- An electrostatic chuck includes a ceramic top plate layer made of a beryllium oxide material, a ceramic bottom plate layer made of a beryllium oxide material, a ceramic middle plate layer disposed between the ceramic top plate layer and the ceramic bottom plate layer, an electrode layer disposed between the ceramic top plate layer and the ceramic middle plate layer, and a heater layer disposed …
- Who is the assignee on this patent?
- Watlow Electric Mfg
- What technology area does this patent fall under?
- Primary CPC classification H10P72/72. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Feb 24 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).