Cooling device

Patent metadata

Field	Value
Publication number	US-12557248-B2
Application number	US-202418405307-A
Country	US
Kind code	B2
Filing date	Jan 5, 2024
Priority date	Aug 18, 2023
Publication date	Feb 17, 2026
Grant date	Feb 17, 2026

Abstract

A cooling device includes a tungsten alloy cooling pad ( 10 ), a first substrate ( 20 ), a second substrate ( 30 ) and multiple connecting columns ( 40 ). The tungsten alloy cooling pad ( 10 ) is used for being attached on the heat source (H). The first substrate ( 20 ) is parallelly superposed on the tungsten alloy cooling pad ( 10 ). The second substrate ( 30 ) corresponds to the first substrate ( 20 ) to be parallelly arranged. Each connecting column ( 40 ) is perpendicularly connected between the first substrate ( 20 ) and the second substrate ( 30 ). Each connecting column ( 40 ) is arranged in a matrix. Accordingly, the tungsten alloy cooling pad ( 10 ) can rapidly disperse and transfer the heat of the heat source (H) to the first substrate ( 20 ) and transfer to the second substrate ( 30 ) through each connecting column ( 40 ) for cooling to avoid heat accumulation leading to overheat.

First claim

What is claimed is:

1 . A cooling device for cooling a heat source (H), the cooling device comprising:
a tungsten alloy cooling pad ( 10 ), having a first surface ( 11 ) attached on the heat source (H) and a second surface ( 12 ) opposite to the first surface; a first substrate ( 20 ), parallelly superposed on the second surface ( 12 ) of the tungsten alloy cooling pad ( 10 ); a second substrate ( 30 ), corresponding to the first substrate ( 20 ) to be parallelly arranged; and multiple connecting columns ( 40 ), perpendicularly connected between the first substrate ( 20 ) and the second substrate ( 30 ), and each connecting column ( 40 ) being arranged in a matrix; wherein the tungsten alloy cooling pad ( 10 ) is configured to transfer heat of the heat source (H) to the first substrate ( 20 ), each connecting column ( 40 ), and the second substrate ( 30 ) sequentially for cooling.

2 . The cooling device of claim 1 , wherein the tungsten alloy cooling pad ( 10 ) is a tungsten-copper alloy, a tungsten-nickel-copper alloy or a tungsten-nickel-iron alloy.

3 . The cooling device of claim 1 , wherein the connecting columns ( 40 ) include multiple n-type bismuth telluride cylinders ( 41 ) and multiple p-type bismuth telluride cylinders ( 42 ) arranged interlacedly in rows, a number of the n-type bismuth telluride cylinders ( 41 ) and a number of the p-type bismuth telluride cylinders ( 42 ) are same, the first substrate comprises a first electrode ( 23 ), and the second substrate ( 30 ) comprises a second electrode ( 33 ).

4 . The cooling device of claim 1 , wherein each connecting column ( 40 ) is arranged in a 4×5 matrix.

5 . The cooling device of claim 1 , wherein each connecting column ( 40 ) is arranged in a 4×4 matrix.

6 . The cooling device of claim 1 , wherein each connecting column ( 40 ) is arranged in a 3×6 matrix.

7 . The cooling device of claim 1 , wherein each connecting column ( 40 ) is arranged in a 4×6 matrix.

8 . The cooling device of claim 1 , wherein the first substrate ( 20 ) is directly and sealingly attached on the tungsten alloy cooling pad ( 10 ).

9 . The cooling device of claim 1 , wherein the connecting columns ( 40 ) are directly and sealingly attached on the first substrate ( 20 ) and the second substrate ( 30 ).

10 . The cooling device of claim 1 , wherein each of the first substrate ( 20 ) and the second substrate ( 30 ) is made of gold.

Assignees

• Jess Link Products Co Ltd

Inventors

• Sun Chi-Hsien
• Wu pei-fang

Classifications

• F28F21/081

  Heat exchange elements made from metals or metal alloys · CPC title

• H10W40/70

  Fillings or auxiliary members in containers or in encapsulations for thermal protection or control · CPC title

• H10N10/17

  characterised by the structure or configuration of the cell or thermocouple forming the device · CPC title

• H10N10/13

  characterised by the heat-exchanging means at the junction · CPC title

• H05K7/2039 Primary

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title