Optical transmitter device

Patent metadata

Field	Value
Publication number	US-10348399-B2
Application number	US-201816035211-A
Country	US
Kind code	B2
Filing date	Jul 13, 2018
Priority date	Jul 21, 2017
Publication date	Jul 9, 2019
Grant date	Jul 9, 2019

Abstract

An optical transmitter device is disclosed. The optical transmitter device includes an optical integrating device, a carrier, and a thermo-electric cooler (TEC). The carrier has a top surface and a back surface opposite to the top surface. The carrier includes an insulating slab and a metal plate attached to the insulating slab. The metal plate has thermal conductivity better than thermal conductivity of the insulating slab. The insulating slab forms the top surface of the carrier that provides an interconnection thereon. The back surface mounts the optical integrating device thereon. The TEC faces the carrier and mounts the carrier thereon. The carrier has a base overlapped with the TEC and an extension not overlapped with the TEC, the extension mounting the optical integrating device thereon.

First claim

What is claimed is:

1. An optical transmitter device, comprising:
an optical integrating device;
a carrier having a top surface and a back surface opposite to the top surface, the carrier including an insulating slab and a metal plate attached to the insulating slab, the metal plate having a thermal conductivity better than a thermal conductivity of the insulating slab, the insulating slab forming the top surface of the carrier and providing an interconnection thereon, the back surface mounting the optical integrating device thereon; and
a thermo-electric cooler (TEC) facing the carrier and mounting the carrier thereon,
wherein the carrier has a base overlapped with the TEC and an extension not overlapped with the TEC, the extension mounting the optical integrating device thereon.

2. The optical transmitter device according to claim 1 ,
wherein the optical integrating device has an optical axis along which the extension extends from the base, and
wherein the extension has a width narrower than a width of the base, where the width of the extension and the width of the base are measured along a direction perpendicular to the optical axis.

3. The optical transmitter device according to claim 2 , further comprising a housing that encloses the optical integrating device and the carrier therein,
wherein the carrier provides an end opposite to the base thereof, the end being fixed with the housing through a locker.

4. The optical transmitter device according to claim 1 ,
wherein the base includes a stein and two branches each extending from the stein, the extension being put between the two branches.

5. The optical transmitter device according to claim 4 ,
wherein the carrier provides a via that electrically connects the interconnection in the top surface thereof with the optical integrating device on the back surface, and
wherein the metal plate is removed in a portion providing the via.

6. The optical transmitter device according to claim 1 ,
wherein the metal plate forms the back surface of the carrier.

7. The optical transmitter device according to claim 1 ,
wherein the back surface of the carrier mounts the optical integrating device through a chip carrier.

8. The optical transmitter device according to claim 7 ,
wherein the chip carrier mounts a capacitor, a terminator, and a thermistor thereon.

9. The optical transmitter device according to claim 1 ,
wherein the carrier further provides another insulating slab attached to the metal plate, the insulating slab and the another insulating slab sandwiching the metal plate, the another insulating slab being attached to the TEC and forming the back surface of the carrier.

10. The optical transmitter device according to claim 9 ,
wherein the another insulating slab provides another interconnection thereon, and
wherein the carrier further provides an auxiliary area except for the base and the extension, the auxiliary area providing a via that electrically connects the interconnection on the top surface of the carrier with the another interconnection on the back surface of the carrier.

11. The optical transmitter device according to claim 1 ,
wherein the carrier further mounts a wiring substrate on the back surface thereof, and
wherein the optical integrating device is provided with a driving signal through the wiring substrate.

12. The optical transmitter device according to claim 1 ,
wherein the optical integrating device includes a semiconductor laser diode (LD) driven in a DC mode and a semiconductor modulator driven in an AC mode, the semiconductor modulator being integrated with the LD and driven by a driving signal carried by the interconnection on the top surface of the carrier.

13. The optical transmitter device according to claim 1 ,
wherein the top surface of the carrier only mounts the interconnection thereon.

Assignees

• Sedi Inc

Inventors

• Teranishi Ryota

Classifications

• G02B6/4292

  the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements · CPC title

• H04B10/503

  Laser transmitters · CPC title

• H04B10/032 Primary

  using working and protection systems {(H04J14/0287 takes precedence)} · CPC title

• H01S5/02415

  by using a thermo-electric cooler [TEC], e.g. Peltier element · CPC title

• G02B6/4204

  the coupling comprising intermediate optical elements, e.g. lenses, holograms (encapsulated active devices H01S5/02208) · CPC title