Z-channeling into a preform via needle perforation in a stand-alone tool

US12552085B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12552085-B2
Application numberUS-202318491569-A
CountryUS
Kind codeB2
Filing dateOct 20, 2023
Priority dateOct 20, 2023
Publication dateFeb 17, 2026
Grant dateFeb 17, 2026

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of forming z-channels in a fibrous ceramic preform includes mounting the preform in a tooling assembly, the tooling assembly comprising a first fixture and a second fixture, heating the preform mounted in the tooling assembly to a temperature above a glass transition temperature of a polymer binder within the preform to induce a softened state of the polymer binder, inserting a plurality of needles sequentially through respective first holes in the first fixture, the preform, and respective corresponding second holes in the second fixture, and removing the plurality of needles leaving behind a corresponding plurality of z-channels in the preform.

First claim

Opening claim text (preview).

The invention claimed is: 1 . A method of forming z-channels in a fibrous ceramic preform, the method comprising: mounting the preform in a tooling assembly, the tooling assembly comprising: a first fixture formed from plastic; and a second fixture formed from graphite; heating the preform mounted in the tooling assembly to a temperature above a glass transition temperature of a polymer binder within the preform to induce a softened state of the polymer binder; inserting a plurality of needles sequentially through respective first holes in the first fixture, the preform, and respective corresponding second holes in the second fixture; and removing the plurality of needles leaving behind a corresponding plurality of z-channels in the preform. 2 . The method of claim 1 and further comprising: removing at least the first fixture from the preform. 3 . The method of claim 2 and further comprising: removing the first fixture and the second fixture from preform. 4 . A method of forming a ceramic matrix composite component, the method comprising: densifying the preform of claim 2 with a ceramic matrix. 5 . The method of claim 4 , wherein the ceramic matrix comprises silicon carbide. 6 . The method of claim 4 , wherein the preform comprises fibers formed from silicon carbide. 7 . The method of claim 1 , wherein the polymer binder is polyvinyl butyral. 8 . The method of claim 7 , wherein the step of heating the preform comprises heating the preform to a temperature ranging from 250° F. to 350° F. 9 . The method of claim 1 , wherein the step of inserting the plurality of needles is performed while the polymer binder is in the softened state. 10 . The method of claim 9 , wherein the step of removing the plurality of needles is performed when the polymer binder is in the softened state. 11 . The method of claim 9 , wherein the step of removing the plurality of needles is performed when a temperature of the polymer binder is below the glass transition temperature. 12 . The method of claim 1 , wherein the step of inserting the plurality of needles comprises sequentially inserting each of the plurality of needles. 13 . The method of claim 1 , wherein the step of removing the plurality of needles comprises sequentially or simultaneously removing each of the plurality of needles. 14 . The method of claim 1 , wherein the step of inserting the plurality of needles comprises manually or robotically inserting each of the plurality of needles. 15 . The method of claim 1 , wherein each of the first holes in the first fixture has a first diameter, and wherein each of the second holes in the second fixture has a second diameter. 16 . The method of claim 15 , wherein at least one of the first diameter and the second diameter ranges from 0.075 in to 0.125 in. 17 . The method of claim 1 , wherein at least one of the first holes in the first fixture is spaced apart from an adjacent hole in the first fixture a distance ranging from 0.050 in to 0.250 in. 18 . The method of claim 1 , wherein at least one of the second holes in the second fixture is spaced apart from an adjacent hole in the second fixture a distance ranging from 0.050 in to 0.250 in. 19 . The method of claim 1 , wherein the second fixture is a mandrel and wherein the preform is laid up over the mandrel.

Assignees

Inventors

Classifications

  • Carbides; Nitrides · CPC title

  • Use of polyvinylalcohols, polyvinylethers, polyvinylaldehydes, polyvinylketones or polyvinylketals {or derivatives thereof} as moulding material · CPC title

  • of preforms, specially adapted for thermoforming (preheating sheets in general B29B13/023; B29C51/427 takes precedence) · CPC title

  • Clamping means for the sheets, e.g. clamping frames · CPC title

  • Textile or other fibrous material made from plastics fibres (combined with plastic layers B29C51/145; compression moulding of reinforced plastic articles in matched moulds B29C70/46; using pressure difference B29C70/44) · CPC title

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What does patent US12552085B2 cover?
A method of forming z-channels in a fibrous ceramic preform includes mounting the preform in a tooling assembly, the tooling assembly comprising a first fixture and a second fixture, heating the preform mounted in the tooling assembly to a temperature above a glass transition temperature of a polymer binder within the preform to induce a softened state of the polymer binder, inserting a plurali…
Who is the assignee on this patent?
Rtx Corp
What technology area does this patent fall under?
Primary CPC classification B29C51/008. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Feb 17 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).