Heat dissipation module

Patent metadata

Field	Value
Publication number	US-12550289-B2
Application number	US-202318479115-A
Country	US
Kind code	B2
Filing date	Oct 2, 2023
Priority date	Jul 24, 2023
Publication date	Feb 10, 2026
Grant date	Feb 10, 2026

Abstract

A heat dissipation module adapted for an electronic device with a fan is provided. The heat dissipation module includes a vapor chamber and a communicating pipe. The vapor chamber has a first cavity having an evaporating area and a second cavity communicated with the first cavity. The communicating pipe includes a first pipe and a second pipe communicated with the first pipe, wherein the first pipe is communicated with the first cavity, and the second pipe is communicated with the second cavity. An inner wall surface of the first pipe is a smooth surface, and an inner wall surface of the second pipe is provided with a wick structure. The first cavity, the second cavity and the communicating pipe surround and form a hollow area, wherein the fan is adapted for being disposed in the hollow area, and an air outlet of the fan faces the second pipe.

First claim

What is claimed is:

1 . A heat dissipation module, adapted for an electronic device with a fan having an air outlet, comprising:
a vapor chamber, comprises: a first cavity, having an evaporating area, wherein a surface of the vapor chamber corresponding to a position of the evaporating area is thermally coupled to a heat source; and a second cavity, communicated with the first cavity; and a communicating pipe, comprises: a first pipe, communicated with the first cavity, and an inner wall surface of the first pipe is a smooth surface; and a second pipe, communicated with the first pipe and the second cavity, and an inner wall surface of the second pipe is provided with a wick structure, wherein the first cavity, the second cavity and the communicating pipe surround and form a hollow area, and the fan is adapted for being disposed in the hollow area, and the air outlet faces the second pipe, wherein a first turning point is formed between the second pipe and the first pipe and a second turning point is formed between the second pipe and the second cavity, the inner wall surface of the second pipe is divided into a first part near the first turning point and a second part extending from the first part to the second turning point, the first part is a smooth surface and the wick structure is distributed on the second part, wherein the wick structure is located within a region of the second pipe facing the air outlet.

2 . The heat dissipation module according to claim 1 ,
wherein the second cavity and the first pipe are communicated on a same side of the first cavity, and the second pipe is located between the second cavity and the first pipe.

3 . The heat dissipation module according to claim 1 , further comprises:
a heat dissipation fin, disposed corresponding to the air outlet of the fan and thermally coupled to the second pipe.

4 . The heat dissipation module according to claim 1 , wherein the number of the communicating pipe is two, and the communicating pipes are disposed side by side.

5 . The heat dissipation module according to claim 1 , wherein the number of the first pipe is two, and the two first pipes are disposed side by side, the two first pipes are communicated with the second pipe.

6 . The heat dissipation module according to claim 1 , wherein the number of the second cavity is two, and the two second cavities are communicated with the opposite sides of the first cavity respectively, the number of the communicating pipe is two, wherein the two communicating pipes are communicated with the opposite sides of the first cavity respectively and the two second cavities respectively.

7 . The heat dissipation module according to claim 6 , wherein the number of the fan is two, wherein one of the fans is surrounded by the first cavity, one of the communicating pipes, and one of the second cavities, and another one of the fans is surrounded by the first cavity, another one of the communicating pipes, another one of the second cavities.

8 . The heat dissipation module according to claim 1 , wherein the first pipe is a steam delivery pipeline, and the second pipe is a condensation pipeline.

9 . The image generation device according to claim 8 , wherein the second pipe is perpendicular to the first pipe.

Assignees

• Asustek Comp Inc

Inventors

• Chiou Ing-Jer

Classifications

• H05K7/2039

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title

• H05K7/20336

  Heat pipes, e.g. wicks or capillary pumps · CPC title

• G06F1/203 Primary

  for portable computers, e.g. for laptops · CPC title

• G06F1/20

  Cooling means · CPC title

• H05K7/20154 Primary

  Heat dissipaters coupled to components · CPC title