Heat dissipation in electronics

Patent metadata

Field	Value
Publication number	US-10098259-B2
Application number	US-201514827068-A
Country	US
Kind code	B2
Filing date	Aug 14, 2015
Priority date	Aug 14, 2015
Publication date	Oct 9, 2018
Grant date	Oct 9, 2018

Abstract

Heat dissipation configurations and methods are described herein. A heat dissipation apparatus may include an individual piece of metal having a thermally conductive metal surface. The metal surface includes a plurality of ridges or protrusions extending from a base of the metal surface, wherein an air flow channel is provided between each two adjacent protrusions, therein providing a plurality of air flow channels. The apparatus is configured to dissipate heat for an electronic device having an active cooling source directing air through the plurality of air flow channels. In some examples, the heat dissipation apparatus is a vapor chamber, and the surface includes a section having a trough and a raised area or platform surrounded by the trough, wherein the raised area is configured to contact a microprocessor die in communication with the vapor chamber.

First claim

What is claimed is:

1. An electronic device comprising:
a heat generating component;
an apparatus having an individual piece of metal comprising a thermally conductive metal surface, the thermally conductive metal surface having a first section comprising a plurality of protrusions extending from a base of the thermally conductive metal surface and a second section separate from and adjacent to the first section, wherein the second section of the thermally conductive metal surface comprises a raised area and a trough surrounding a perimeter of the raised area; and
an active cooling source,
wherein an air flow channel is provided between each two adjacent protrusions of the plurality of protrusions, therein providing a plurality of air flow channels,
wherein the raised area contacts the heat generating component,
wherein the trough comprises a trough air flow channel around the perimeter of the raised area, and
wherein the electronic device dissipates heat from the heat generating component by driving air from the active cooling source through the trough air flow channel and the plurality of air flow channels.

2. The electronic device of claim 1 , wherein the individual piece of metal is copper.

3. The electronic device of claim 1 , wherein the apparatus is a heat pipe, heat sink, or heat fin.

4. The electronic device of claim 1 , wherein the thermally conductive metal surface is a first thermally conductive metal surface of a vapor chamber.

5. The electronic device of claim 4 , further comprising:
a second thermally conductive metal surface of the vapor chamber, the second metal surface opposite the first thermally conductive metal surface such that a sealed vacuum of the vapor chamber is positioned between the first thermally conductive metal surface and the second thermally conductive metal surface,
wherein the second thermally conductive metal surface comprises a plurality of protrusions, and
wherein the electronic device dissipates heat from the heat generating component by driving air from the active cooling source through a plurality of air flow channels positioned between the plurality of protrusions of the second thermally conductive metal surface.

6. The electronic device of claim 1 , wherein each protrusion of the plurality of protrusions comprises a width of 0.01-0.2 mm, a height of 0.01-0.2 mm, and a pitch to an adjacent protrusion of the plurality of protrusions of at least 0.1 mm.

7. The electronic device of claim 1 , wherein each protrusion of the plurality of protrusions is ovular, circular, rectangular, or a square, as viewed two-dimensionally from a point of view perpendicular to the thermally conductive metal surface.

8. The electronic device of claim 1 , wherein the second section comprises an additional raised area surrounded by the trough,
wherein the additional raised area is configured to contact the heat generating component or a separate heat generating component of the electronic device, and
wherein a height of the additional raised area is different from a height of the raised area.

9. The electronic device of claim 1 , wherein the heat generating component is a microprocessor die.

10. The electronic device of claim 1 , wherein the active cooling source is a fan.

Assignees

• Microsoft Technology Licensing Llc

Inventors

• Mclaughlin Robyn Rebecca Reed
• Stellman Jeffrey Taylor
• Hill Andrew
• Bornemann Paul

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W40/228

  the projecting parts being wire-shaped or pin-shaped · CPC title

• H10W40/037 Primary

  Assembling together parts thereof · CPC title

• H10W40/226

  characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461) · CPC title

• H10W40/73

  for cooling by change of state · CPC title