Loop heat pipe, method of manufacturing the same, and electronic device

Patent metadata

Field	Value
Publication number	US-2016259383-A1
Application number	US-201615156869-A
Country	US
Kind code	A1
Filing date	May 17, 2016
Priority date	Dec 13, 2013
Publication date	Sep 8, 2016
Grant date	—

Abstract

Disclosed loop heat pipe includes: an evaporator configured to vaporize a working fluid; a condenser configured to liquefy the working fluid; a liquid line connecting the evaporator and the condenser; a porous body provided in a columnar shape in the liquid line; and a vapor line connecting the evaporator and the condenser, and forming a loop together with the liquid line.

First claim

What is claimed is:

1 . A loop heat pipe comprising:
an evaporator configured to vaporize a working fluid; a condenser configured to liquefy the working fluid; a liquid line connecting the evaporator and the condenser; a porous body provided in a columnar shape in the liquid line; and a vapor line connecting the evaporator and the condenser, and forming a loop together with the liquid line.

2 . The loop heat pipe according to claim 1 , wherein the porous body extends along the liquid line.

3 . The loop heat pipe according to claim 2 , wherein the porous body is provided away from a wall of the liquid line.

4 . The loop heat pipe according to claim 1 , wherein
the evaporator, the condenser, the liquid line, the vapor line, and the porous body are formed by stacking a plurality of metallic layers, and a plurality of pores are formed in a portion of each of the metallic layers that corresponds to the porous body.

5 . The loop heat pipe according to claim 4 , wherein
in the two metallic layers vertically adjacent to each other, at least a part of the pore in one of the metallic layers overlaps the pore in the other metallic layer.

6 . The loop heat pipe according to claim 4 , wherein
in the two metallic layers vertically adjacent to each other, the pore in one of the metallic layers has a different size than a size of the pores in the other metallic layer.

7 . The loop heat pipe according to claim 4 , wherein
the porous body is also provided in the evaporator, and the pore in the porous body in the evaporator is smaller than the pore in the porous body in the liquid line.

8 . The loop heat pipe according to any one of claim 1 , wherein a pillar is provided inside the vapor line.

9 . The loop heat pipe according to claim 8 , wherein a planar shape of the pillar is a linear shape extending along the vapor line.

10 . The loop heat pipe according to claim 8 , wherein
the condenser comprises a flow path connected to the liquid line and the vapor line, and the pillar is also provided in the flow path.

11 . An electronic device comprising:
a heat generating component; and a loop heat pipe configured to cool the heat generating component, wherein the loop heat pipe comprises;
an evaporator configured to vaporize a working fluid with a heat of the heat generating component;
a condenser configured to liquefy the working fluid;
a liquid line connecting the evaporator and the condenser;
a porous body provided in a columnar shape in the liquid line; and
a vapor line connecting the evaporator and the condenser, and forming a loop together with the liquid line.

12 . A method of manufacturing a loop heat pipe, comprising:
forming an evaporator, a condenser, a liquid line, and a vapor line by stacking a plurality of metallic layers; forming a porous body of a columnar shape in the liquid line by forming a plurality of pores in a portion of the metallic layer that corresponds to the liquid line; and pouring a working fluid into the liquid line.

Assignees

• Fujitsu Ltd

Inventors

• Shioga Takeshi
• Mizuno Yoshihiro

Classifications

• F28D15/043

  forming loops, e.g. capillary pumped loops · CPC title

• F28D15/046

  characterised by the material or the construction of the capillary structure · CPC title

• F28F3/086

  having one or more openings therein forming tubular heat-exchange passages · CPC title

• F28D15/0266

  with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers (F28D15/043 takes precedence) · CPC title

• G06F1/203 Primary

  for portable computers, e.g. for laptops · CPC title