Probe guide plate and method for manufacturing the same
US-9523716-B2 · Dec 20, 2016 · US
US12546818B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12546818-B2 |
| Application number | US-202318485262-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 11, 2023 |
| Priority date | Oct 11, 2022 |
| Publication date | Feb 10, 2026 |
| Grant date | Feb 10, 2026 |
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Proposed are a guide plate and a test device including the guide plate capable of being insulated from electrically conductive contact pins and capable of blocking signal interference between the electrically conductive contact pins.
Opening claim text (preview).
What is claimed is: 1 . A guide plate comprising: a metal body comprising a penetration hole passing through the metal body in up and down directions; a surface insulation layer formed on a surface of the metal body; and a ground metal layer connected to the metal body by passing through the surface insulation layer. 2 . The guide plate of claim 1 , wherein the surface insulation layer comprises an anodic oxide insulation film formed by anodizing the metal body. 3 . The guide plate of claim 1 , wherein the surface insulation layer comprises a deposition insulation film formed by atomic layer deposition. 4 . The guide plate of claim 1 , wherein the surface insulation layer comprises: an anodic oxide insulation film formed by anodizing the metal body; and a deposition insulation film formed on a surface of the anodic oxide insulation film by atomic layer deposition. 5 . A test device comprising: a guide plate comprising a metal body that comprises a penetration hole, a surface insulation layer formed on a surface of the metal body and a ground metal layer connected to the metal body by passing through the surface insulation layer; and an electrically conductive contact pin inserted into the penetration hole.
using an intermediate card or back card with apertures through which the probes pass · CPC title
Testing of IC packages; Test features related to IC packages (containers per se H10W76/10, encapsulations per se H10W74/00) · CPC title
Contacting devices, e.g. sockets, burn-in boards or mounting fixtures (in general G01R1/04) · CPC title
concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding · CPC title
Interfaces, e.g. between probe and tester (G01R31/31905 and G01R1/07364 take precedence) · CPC title
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