Multi-Beam Probes with Decoupled Structural and Current Carrying Beams and Methods of Making
US-2024094259-A1 · Mar 21, 2024 · US
Probe guide plate and method for manufacturing the same
US9523716B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9523716-B2 |
| Application number | US-201414202701-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 10, 2014 |
| Priority date | Mar 13, 2013 |
| Publication date | Dec 20, 2016 |
| Grant date | Dec 20, 2016 |
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Abstract
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There is provided a probe guide plate. The probe guide plate includes: a substrate having a through hole for guiding a probe, which is formed through the substrate, wherein the substrate includes a first main surface and a second main surface opposite to the first main surface; and a first insulating film formed on an inner wall of the through hole and on the first and second main surfaces of the substrate such that portions of the first and second main surfaces of the substrate are exposed.
First claim
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What is claimed is: 1. A probe guide plate comprising: a silicon substrate having a through hole for guiding a probe, which is formed through the silicon substrate, wherein the silicon substrate comprises a first main surface and a second main surface opposite to the first main surface; and a silicon oxide film formed directly on an inner wall of the through hole and on the first and second main surfaces of the silicon substrate such that portions of the first and second main su…
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Physics · mapped topic
- G01R1/07357Primary
Physics · mapped topic
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- What does patent US9523716B2 cover?
- There is provided a probe guide plate. The probe guide plate includes: a substrate having a through hole for guiding a probe, which is formed through the substrate, wherein the substrate includes a first main surface and a second main surface opposite to the first main surface; and a first insulating film formed on an inner wall of the through hole and on the first and second main surfaces of t…
- Who is the assignee on this patent?
- Shinko Electric Ind Co, Japan Electronic Materials
- What technology area does this patent fall under?
- Primary CPC classification G01R1/07357. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Dec 20 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).