Flux and solder paste

Patent metadata

Field	Value
Publication number	US-12544862-B2
Application number	US-202117798286-A
Country	US
Kind code	B2
Filing date	Feb 17, 2021
Priority date	Feb 18, 2020
Publication date	Feb 10, 2026
Grant date	Feb 10, 2026

Abstract

A flux containing an organic acid, an acrylic resin, a rosin, a thixotropic agent, and a solvent, but not containing water is adopted. In this flux, the organic acid includes 1,2,3-propanetricarboxylic acid, and the content of the 1,2,3-propanetricarboxylic acid is 0.1% by mass or more and 15% by mass or less with respect to the total amount of the entire flux. According to this flux, the wettability of solder can be enhanced, temperature cycle reliability is excellent, and scattering due to heating during reflow can be suppressed.

First claim

What is claimed is:

1 . A solder paste comprising:
a flux and a solder powder, wherein the flux comprises an organic acid, an acrylic resin, a rosin, a thixotropic agent, and a solvent, and wherein the flux does not contain water, the organic acid includes 1,2,3-propanetricarboxylic acid, and a content of the 1,2,3-propanetricarboxylic acid is 0.1% by mass or more and 15% by mass or less with respect to a total amount of the entire flux, wherein the solder powder comprises a solder alloy (x) having an alloy composition (x) or a solder alloy (y) having an alloy composition (y), wherein the solder alloy (x) having the alloy composition (x) comprises As: 25 to 300 mass ppm, Pb: more than 0 mass ppm and 5100 mass ppm or less, at least one of Sb: more than 0 mass ppm and 3000 mass ppm or less and Bi: more than 0 mass ppm and 10000 mass ppm or less, and a balance of Sn and satisfying the following formula (1) and formula (2),
275≤2As+Sb+Bi+Pb  (1)

0.01≤(2As+Sb)/(Bi+Pb)≤10.00  (2)

in the formula (1) and the formula (2), As, Sb, Bi, and Pb each represent the content, in mass ppm, in the alloy composition (x), the solder alloy (y) having the alloy composition (y) comprises As: 10 mass ppm or more and less than 25 mass ppm, at least one of Bi: more than 0 mass ppm and 10000 mass ppm or less and Pb: more than 0 mass ppm and 5100 mass ppm or less, Sb: more than 0 mass ppm and 3000 mass ppm or less, and a balance of Sn and satisfying the following formula (3) and formula (4),
300≤3As+Sb+Bi+Pb  (3)

0.1≤{(3As+Sb)/(Bi+Pb)}×100≤200  (4)

in the formula (3) and the formula (4), As, Sb, Bi, and Pb each represent a content, in mass ppm, in the alloy composition (y).

2 . The solder paste according to claim 1 ,
wherein a mass ratio of a content of the rosin to a content of the acrylic resin is 1 or more and 9 or less.

3 . The solder paste according to claim 1 ,
wherein a total content of the organic acid is 0.1% by mass or more and 15% by mass or less with respect to the total amount of the entire flux.

4 . The solder paste according to claim 1 , further comprising:
azoles, wherein a content of the azoles is 0.1% by mass or more and 10% by mass or less with respect to the total amount of the entire flux.

5 . The solder paste according to claim 4 ,
wherein a mass ratio of a total content of the organic acid to the content of the azoles is 0.6 or more and 100 or less.

6 . The solder paste according to claim 1 , further comprising:
a resin other than the acrylic resin and the rosin, wherein a content of the resin other than the acrylic resin and the rosin is more than 0% by mass and 10% by mass or less with respect to the total amount of the entire flux.

7 . The solder paste according to claim 1 , further comprising:
a halogen compound, wherein a content of the halogen compound is more than 0% by mass and 5% by mass or less with respect to the total amount of the entire flux.

8 . The solder paste according to claim 1 , further comprising:
an antioxidant, wherein a content of the antioxidant is more than 0% by mass and 5% by mass or less with respect to the total amount of the entire flux.

9 . The solder paste according to claim 1 ,
wherein the solder powder comprises the solder alloy (x), and the alloy composition (x) further satisfies the following formula (1a),
275≤2As+Sb+Bi+Pb≤25200  (1a)

in the formula (1a), As, Sb, Bi, and Pb each represent a content, in mass ppm, in the alloy composition (x).

10 . The solder paste according to claim 1 ,
wherein the solder powder comprises the solder alloy (x), and the alloy composition (x) further satisfies the following formula (1b),
275≤2As+Sb+Bi+Pb≤5300  (1b)

in the formula (1b), As, Sb, Bi, and Pb each represent the content, in mass ppm, in the alloy composition (x).

11 . The solder paste according to claim 1 ,
wherein the solder powder comprises the solder alloy (x), and the alloy composition (x) further satisfies the following formula (2a),
0.31≤(2As+Sb)/(Bi+Pb)≤10.00  (2a)

in the formula (2a), As, Sb, Bi, and Pb each represent the content, in mass ppm, in the alloy composition (x).

12 . The solder paste according to claim 1 ,
wherein the solder powder comprises the solder alloy (y), and the alloy composition (y) further contains Ni: more than 0 mass ppm and 600 mass ppm or less.

13 . The solder paste according to claim 1 ,
wherein the solder powder comprises the solder alloy (y), and the alloy composition (y) further contains Fe: more than 0 mass ppm and 100 mass ppm or less.

14 . The solder paste according to claim 1 ,
wherein the solder powder comprises the solder alloy (y), and the alloy composition (y) further contains In: more than 0 mass ppm and 1200 mass ppm or less.

15 . The solder paste according to claim 1 ,
wherein the solder powder comprises the solder alloy (y), and the alloy composition (y) further contains at least two of Ni: more than 0 mass ppm and 600 mass ppm or less, Fe: more than 0 mass ppm and 100 mass ppm or less and In: more than 0 mass ppm and 1200 mass ppm or less and satisfies the following formula (6),
0<Ni+Fe≤680  (6)

in the formula (6), Ni and Fe each represent a content, in mass ppm, in the alloy composition (y).

16 . The solder paste according to claim 1 ,
wherein the solder powder comprises the solder alloy (y), and the alloy composition (y) further contains Ni: 0 mass ppm or more and 600 mass ppm or less and Fe: more than 0 mass ppm and 100 mass ppm or less and satisfies the following formula (5) and the following formula (6),
0≤Ni/Fe≤50  (5)

0<Ni+Fe≤680  (6)

in the formula (5) and the formula (6), Ni and Fe each represent a content, in mass ppm, in the alloy composition (y).

17 . The solder paste according to claim 1 ,
wherein the solder powder comprises the solder alloy (y), and the alloy composition (y) further satisfies the following formula (3a),
300≤3As+Sb+Bi+Pb≤18214  (3a)

in the formula (3a), As, Sb, Bi, and Pb each represent the content, in mass ppm, in the alloy composition (y).

18 . The solder paste according to claim 1 ,
wherein the solder powder comprises the solder alloy (y), and the alloy composition (y) further satisfies the following formula (4a),
0.1≤{(3As+Sb)/(Bi+Pb)}×100≤158.5  (4a)

in the formula (4a), As, Sb, Bi, and Pb each represent the content, in mass ppm, in the alloy composition (y).

19 . The solder paste according to claim 1 ,
wherein the solder powder comprises the solder alloy (y), and the alloy composition (y) further contains at least one of Ag: more than 0% by mass and 4% by mass or less and Cu: more than 0% by mass and 0.9% by mass or less.

Assignees

• Senju Metal Industry Co

Inventors

• Kawasaki Hiroyoshi
• Shiratori Masato
• MINEGISHI Kazuhiro
• Kawamata Yuji

Classifications

• B23K35/3601 Primary

  with inorganic compounds as principal constituents · CPC title

• C22C13/02 Primary

  with antimony or bismuth as the next major constituent · CPC title

• B23K35/362

  Selection of compositions of fluxes (B23K35/365, B23K35/368 take precedence) · CPC title

• B23K35/3618

  Carboxylic acids or salts · CPC title

• B23K35/262

  Sn as the principal constituent · CPC title