Anodic aluminum oxide mold, mold structure including same, method of manufacturing molded article using anodic aluminum oxide mold, and molded article manufactured thereby

Patent metadata

Field	Value
Publication number	US-12540414-B2
Application number	US-202117403689-A
Country	US
Kind code	B2
Filing date	Aug 16, 2021
Priority date	Aug 19, 2020
Publication date	Feb 3, 2026
Grant date	Feb 3, 2026

Abstract

Proposed are an anodic aluminum oxide mold capable of manufacturing a molded article having at least a portion with a dimensional range of several tens of μm, and a mold structure including the same. Additionally, proposed are a method of manufacturing a molded article with a dimensional range of several tens of μm using the anodic aluminum oxide mold, and a molded article manufactured thereby.

First claim

What is claimed is:

1 . A method of manufacturing a molded article, the method comprising:
providing an anodic aluminum oxide mold made of an anodic aluminum oxide film, wherein the anodic aluminum oxide film is made by anodizing a metal base material and removing the metal base material; providing a support member configured to support the anodic aluminum oxide mold to maintain flatness; providing a metal layer between the anodic aluminum oxide mold and the support member, wherein the metal layer comprises a material capable of electroplating; providing a photosensitive material that physically contacts the other surface of the anodic aluminum oxide film; forming a plurality of openings in the anodic aluminum oxide film, wherein a shape of the openings is determined according to a shape of patterns resulting from patterning of the photosensitive material provided on the anodic aluminum oxide film forming a metal filler in each of the openings; and removing the anodic aluminum oxide mold, wherein the anodic aluminum oxide mold is separately manufactured from the metal layer by anodizing the metal base material to form the anodic aluminum oxide film and subsequently removing the metal base material.

2 . The method of claim 1 , wherein the forming of the metal filler in each of the openings comprises performing plating while the metal layer provided under the anodic aluminum oxide mold and exposed through the openings serves as a seed layer.

3 . The method of claim 1 , wherein the molded article is a probe pin.

4 . The method of claim 1 , wherein, after the metal base material has been entirely removed, the separately manufactured anodic aluminum oxide mold is provided on the metal layer.

5 . A method of manufacturing an anodic aluminum oxide mold, the method comprising:
providing the anodic aluminum oxide film made by anodizing a metal base material and removing the metal base material; providing a support member configured to support the anodic aluminum oxide mold to maintain flatness; providing a metal layer between the anodic aluminum oxide mold and the support member, wherein the metal layer comprises a material capable of electroplating; providing a photosensitive material that physically contacts a surface of the anodic aluminum oxide film; and forming a plurality of openings in the anodic aluminum oxide film, wherein a shape of the openings is determined according to a shape of patterns resulting from patterning of the photosensitive material provided on the anodic aluminum oxide film, wherein the anodic aluminum oxide mold is separately manufactured from the metal layer by anodizing the metal base material to form the anodic aluminum oxide film and subsequently removing the metal base material.

6 . The method of claim 5 , wherein the metal layer exposed through the openings serves as a seed layer.

Assignees

• Point Engineering Co Ltd

Inventors

• Ahn Bum Mo
• Park Seung Ho
• Byun Sung Hyun

Classifications

• G01R1/07342

  the body of the probe being at an angle other than perpendicular to test object, e.g. probe card · CPC title

• C25D11/04

  of aluminium or alloys based thereon · CPC title

• C25D1/00 Primary

  Electroforming · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W74/40 Primary

  characterised by their materials · CPC title