Electronic device including outer housing plated with conductive member and manufacturing method therefor

Patent metadata

Field	Value
Publication number	US-12540402-B2
Application number	US-202318137062-A
Country	US
Kind code	B2
Filing date	Apr 20, 2023
Priority date	Oct 20, 2020
Publication date	Feb 3, 2026
Grant date	Feb 3, 2026

Abstract

The present disclosure provides electronic device and methods of manufacturing the electronic devices. In some embodiments, the electronic device includes an outer housing at least partially forming an exterior of the electronic device, a trench including at least one valley and at least one peak, a first conductive member, and a coating layer laminated on the outer housing and disposed on the first conductive member. Each of the at least one valley is concave with respect to a surface of the outer housing. Each of the at least one peak is convex with respect to the surface of the outer housing and has a partially removed end. The trench is plated with the first conductive member.

First claim

What is claimed is:

1 . An electronic device, comprising:
an outer housing at least partially forming an exterior of the electronic device; a trench comprising:
at least one valley, wherein each of the at least one valley is concave with respect to a surface of the outer housing; and
at least one peak, wherein each of the at least one peak is convex with respect to the surface of the outer housing and has a partially removed end;
a first conductive member; and a coating layer laminated on the outer housing and disposed on the first conductive member, wherein the trench is plated with the first conductive member.

2 . The electronic device of claim 1 , wherein the first conductive member comprises an area corresponding to a portion of the at least one peak has been partially removed.

3 . The electronic device of claim 1 , further comprising a second conductive member disposed between the first conductive member and the coating layer.

4 . The electronic device of claim 1 , wherein:
a first area of a first surface of the outer housing comprises the trench, the first conductive member, and the coating layer, and a second area of a second surface opposite to the first surface of the outer housing is plated with a second conductive member.

5 . The electronic device of claim 4 , further comprising:
a hole part disposed on the outer housing; and a third conductive member plated at the hole part and coupling the first conductive member to the second conductive member.

6 . The electronic device of claim 5 , wherein:
the third conductive member is plated on a portion of an inner surface of the hole part, and a remaining portion of the inner surface of the hole part is in contact with a filler occupying the hole part.

7 . The electronic device of claim 5 , wherein the hole part comprises:
a first part extending from the second surface of the outer housing in a direction toward the first surface of the outer housing; and a second part extending from an end of the first part in the direction toward the first surface of the outer housing, wherein the second part has a diameter gradually decreasing from a second diameter, and wherein the second diameter is smaller than a first diameter of the first part.

8 . A method of manufacturing an electronic device, the method comprising:
forming a first trench in a first plating area of a first surface of an outer housing at least partially forming an exterior of the electronic device, the first surface being exposed to the outside; forming, in a plating area, a first plating layer comprising a first metallic material, the plating area comprising at least one of the first plating area, a second plating area, and a third plating area; polishing the first plating area; and forming a coating layer on the first surface of the outer housing.

9 . The method of claim 8 , wherein the polishing of the first plating area comprises:
polishing the first plating area before the forming of the first plating layer; and polishing the first plating area after the forming of the first plating layer.

10 . The method of claim 9 , wherein the polishing of the first plating area comprises cutting at least one of a first portion of a peak of the first trench and a second portion of the first plating layer.

11 . The method of claim 9 , wherein the polishing of the first plating area comprises reducing a step between the first plating area and a reference area other than the first plating area.

12 . The method of claim 8 , wherein the forming of the coating layer comprises:
forming, using at least two distinct primers, a compensation layer on the first surface thereby compensating for a step on the first surface of the outer housing; forming a color layer having a color on the compensation layer; and forming a protection layer on the color layer.

13 . The method of claim 8 , further comprising:
forming a hole part on the outer housing; and forming a second trench in the second plating area of a second surface opposite to the first surface of the outer housing and the third plating area of an inner surface of the hole part.

14 . The method of claim 13 , further comprising:
the hole part with a filler; and polishing a portion of the filler protruding from an outer surface of the outer housing.

15 . A case of an electronic device, comprising:
an outer housing; a trench comprising:
a valley that is concave with respect to a surface of the outer housing; and
a peak that is convex with respect to the surface of the outer housing and has a partially removed end;
a first conductive member; and a coating layer laminated on the outer housing and disposed on the first conductive member, wherein the trench is plated with the first conductive member.

16 . The case of claim 15 , further comprising a second conductive member disposed between the first conductive member and the coating layer.

17 . The case of claim 16 , wherein the case further comprises:
a hole part disposed on the outer housing; and a third conductive member plated at the hole part and coupling the first conductive member to the second conductive member, wherein a first area of a first surface of the outer housing comprises the trench, the first conductive member, and the coating layer, and wherein a second area of a second surface opposite to the first surface of the outer housing is plated with the second conductive member.

18 . The case of claim 17 , wherein:
the third conductive member is plated on a portion of an inner surface of the hole part, and a remaining portion of the inner surface of the hole part is in contact with a filler occupying the hole part.

19 . The case of claim 17 , wherein the hole part comprises:
a first part extending from the second surface of the outer housing in a direction toward the first surface of the outer housing; and a second part extending from an end of the first part in the direction toward the first surface of the outer housing, wherein the second part has a diameter gradually decreasing from a second diameter, and wherein the second diameter is smaller than a first diameter of the first part.

20 . The case of claim 15 , wherein the first conductive member comprises an area corresponding to a portion of the peak has been partially removed.

Assignees

• Samsung Electronics Co Ltd
• Intops Co Ltd

Inventors

• Jung Chunghyo
• Ko Wonjun
• Park Hyein
• Lee Yongsub
• Lim Jaedeok
• Cho Bumjin
• Yoon Chiyoung
• Kim Keunha
• Koo Kyungha
• Moon Hongki

Classifications

• B23K26/364

  for making a groove or trench, e.g. for scribing a break initiation groove · CPC title

• H05K5/0247

  Electrical details of casings, e.g. terminals, passages for cables or wiring · CPC title

• C23C18/1689

  After-treatment · CPC title

• C23C18/1651

  Two or more layers only obtained by electroless plating · CPC title

• B23C3/30

  Milling straight grooves, e.g. keyways · CPC title