Electronic device including outer housing plated with conductive member and manufacturing method therefor
US-12540402-B2 · Feb 3, 2026 · US
Cho Bumjin is listed as an inventor on 27 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Cho Bumjin |
| Total patents | 27 |
| First publication | Dec 29, 2016 |
| Latest publication | Feb 3, 2026 |
Publications ranked by popularity score, then publication date.
US-12540402-B2 · Feb 3, 2026 · US
US-12519878-B2 · Jan 6, 2026 · US
US-12477051-B2 · Nov 18, 2025 · US
US-12368232-B2 · Jul 22, 2025 · US
US-12335421-B2 · Jun 17, 2025 · US
US-2025105494-A1 · Mar 27, 2025 · US
US-12113270-B2 · Oct 8, 2024 · US
US-2023352814-A1 · Nov 2, 2023 · US
US-2023257884-A1 · Aug 17, 2023 · US
US-2023224395-A1 · Jul 13, 2023 · US
Latest publications not already listed above.
US-2023208950-A1 · Jun 29, 2023 · US
US-2023090826-A1 · Mar 23, 2023 · US
US-2023038634-A1 · Feb 9, 2023 · US
US-2023007108-A1 · Jan 5, 2023 · US
US-11522271-B2 · Dec 6, 2022 · US
US-2021218129-A1 · Jul 15, 2021 · US
US-10516204-B2 · Dec 24, 2019 · US
US-10397764-B2 · Aug 27, 2019 · US
US-10347966-B2 · Jul 9, 2019 · US
US-10290923-B2 · May 14, 2019 · US
US-10243257-B2 · Mar 26, 2019 · US
US-2018241115-A1 · Aug 23, 2018 · US
US-2018199148-A1 · Jul 12, 2018 · US
US-2018151943-A1 · May 31, 2018 · US
US-2018109132-A1 · Apr 19, 2018 · US
US-2017033442-A1 · Feb 2, 2017 · US
US-2016380335-A1 · Dec 29, 2016 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 27 |
| Intops Co Ltd | 2 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H01Q1/243 | 24 |
| H01Q1/38 | 12 |
| H04M1/026 | 11 |
| H01Q9/42 | 9 |
| H04M1/0249 | 9 |