Apparatus for processing a wafer-shaped article

Patent metadata

Field	Value
Publication number	US-12538752-B2
Application number	US-202118019653-A
Country	US
Kind code	B2
Filing date	Apr 7, 2021
Priority date	Aug 14, 2020
Publication date	Jan 27, 2026
Grant date	Jan 27, 2026

Abstract

Apparatus for processing a wafer-shaped article, the apparatus comprising a support configured to support the wafer-shaped article during a processing operation; wherein: the support comprises a support body and a plurality of gripping pin assemblies adapted and positioned relative to the support body for gripping the wafer-shaped article, wherein each of the gripping pin assemblies is rotatable relative to the support body between a gripping configuration in which the gripping pin assemblies grip the wafer-shaped article, and a non-gripping configuration in which the gripping pin assemblies do not grip the wafer-shaped article; each of the gripping pin assemblies protrudes from a respective hole in the support body; and a sealing member is positioned between at least one of the gripping pin assemblies and the respective hole, the sealing member being configured to restrict infiltration of a processing liquid used in the processing operation into the hole.

First claim

The invention claimed is:

1 . An apparatus for processing a wafer-shaped article, the apparatus comprising a support configured to support the wafer-shaped article during a processing operation to be performed on the wafer-shaped article; wherein:
the support comprises a support body and a plurality of gripping pin assemblies adapted and positioned relative to the support body for gripping the wafer-shaped article, wherein each of the gripping pin assemblies is rotatable relative to the support body between a gripping configuration in which the plurality of gripping pin assemblies grip the wafer-shaped article, and a non-gripping configuration in which the plurality of gripping pin assemblies do not grip the wafer-shaped article; each of the plurality of gripping pin assemblies protrudes from a respective hole in the support body; a sealing member is positioned between at least one of the plurality of gripping pin assemblies and the respective hole, the sealing member being configured to restrict infiltration of a processing liquid used in the processing operation into the hole; the sealing member comprises an inner sealing body, and an outer layer that reduces a sticking force between the sealing member and the hole, or the sticking force between the sealing member and the at least one of the plurality of gripping pin assemblies; and each of the at least one of the plurality of gripping pin assemblies comprises
a body,
a first circumferential groove formed in and extending around the body in which the sealing member is seated around a circumference of the body, and
a second circumferential groove formed in and extending around the body.

2 . The apparatus according to claim 1 , wherein the sealing member comprises an O-ring.

3 . The apparatus according to claim 1 , wherein the sealing member comprises a perfluoroelastomer polymer.

4 . The apparatus according to claim 1 , wherein the sealing member is configured to rotate with the at least one of the plurality of gripping pin assemblies relative to the hole.

5 . The apparatus according to claim 1 , wherein the outer layer is a fluoropolymer (e.g. PTFE) based outer layer, different than material of the inner sealing body.

6 . The apparatus according to claim 1 , wherein each of the plurality of gripping pin assemblies has a first gear that is located inside the support body, and the support body includes a driving mechanism for driving rotation of the first gear so as to rotate that gripping pin assembly.

7 . The apparatus according to claim 6 , wherein the driving mechanism comprises a second gear that is meshed with each of the first gears, so that rotation of the second gear causes synchronised rotation of each of the first gears.

8 . The apparatus according to claim 1 , wherein the support body comprises a respective channel for outputting a flow of a gas from the second circumferential groove.

9 . The apparatus according to claim 1 , wherein each of the gripping pin assemblies comprises:
a first gear; and a gripping part at a second end of the body for gripping the wafer-shaped article.

10 . The apparatus according to claim 9 , wherein the gripping part comprises a longitudinal protrusion from the second end of the body, the longitudinal protrusion being spaced apart from a longitudinal axis of the at least one of the plurality of gripping pin assemblies.

11 . The apparatus according to claim 1 , wherein each of the plurality of gripping pin assemblies comprises a reinforcement member positioned in a recess formed in that gripping pin assembly.

12 . The apparatus according to claim 1 , wherein the support is a chuck surrounded by a process chamber for processing of semiconductor wafers.

13 . The apparatus according to claim 1 , wherein the gripping pin assemblies are positioned in a circular series surrounding an area where the wafer-shaped article is to be positioned on the support, and the gripping pin assemblies are configured to make edge contact with the wafer-shaped article thereby to constrain it from lateral movement away from a pre-determined position.

14 . A gripping pin assembly for use in an apparatus for processing a wafer-shaped article, the gripping pin assembly comprising:
a body; a gear; a first circumferential groove formed in and extending around the body for seating a sealing member around the circumference of the body; and a second circumferential groove formed in and extending around the body.

15 . A gripping pin assembly for use in an apparatus for processing a wafer-shaped article, the gripping pin assembly comprising:
a body; a gear; a first circumferential groove formed in and extending around the body; a second circumferential groove formed in and extending around the body; and a sealing member seated in the first circumferential groove.

16 . The gripping pin assembly according to claim 14 , wherein the gripping pin assembly further comprises a reinforcement member positioned in a recess formed in the body.

17 . The gripping pin assembly according to claim 16 , wherein the reinforcement member extends from a first end of the body to a point at or beyond the first circumferential groove.

18 . The gripping pin assembly according to claim 14 , wherein the gripping pin assembly comprises a protrusion that protrudes longitudinally from a second end of the body, the protrusion being spaced apart from a longitudinal axis of the gripping pin assembly.

Assignees

• Lam Res Ag

Inventors

• Brugger Michael
• Schier Burkhart
• Duller Michael

Classifications

• H01L21/67126

  Electricity · mapped topic

• H01L21/68728 Primary

  Electricity · mapped topic

• H10P72/0424

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0441

  Apparatus for sealing, encapsulating, glassing, decapsulating or the like · CPC title

• H10P72/7608 Primary

  characterised by a plurality of separate clamping members, e.g. clamping fingers · CPC title