Workpiece processing apparatus with thermal processing systems

Patent metadata

Field	Value
Publication number	US-12535273-B2
Application number	US-202117546497-A
Country	US
Kind code	B2
Filing date	Dec 9, 2021
Priority date	Dec 14, 2020
Publication date	Jan 27, 2026
Grant date	Jan 27, 2026

Abstract

A processing apparatus for a thermal treatment of a workpiece is presented. The processing apparatus includes a processing chamber, a workpiece support disposed within the processing chamber, a rotation system configured to rotate the workpiece support, a gas delivery system configured to flow one or more process gases into the processing chamber from the a first side of the processing chamber, one or more gas exhaust ports for removing gas from the processing chamber such that a vacuum pressure can be maintained, one or more radiative heating sources disposed on the second side of the processing chamber, one or more dielectric windows disposed between the workpiece support and the one or more radiative heating sources, and a workpiece temperature measurement system configured at a temperature measurement wavelength range to obtain a measurement indicative of a temperature of a back side of the workpiece.

First claim

What is claimed is:

1 . A processing apparatus for processing a workpiece, the workpiece having a top side and a back side opposite from the top side, the processing apparatus comprising:
a processing chamber, having a first side and a second side opposite from the first side of the processing chamber; a workpiece support disposed within the processing chamber, the workpiece support configured to support the workpiece, wherein the back side of the workpiece faces the workpiece support; a rotation system configured to rotate the workpiece support; a gas delivery system configured to flow one or more process gases into the processing chamber from the first side of the processing chamber; one or more gas exhaust ports for removing gas from the processing chamber such that a vacuum pressure can be maintained; one or more pumping plates dispose around an outer perimeter of the workpiece to facilitate process gas flow; one or more radiative heating sources disposed on the second side of the processing chamber, the one or more radiative heating sources configured to heat the workpiece from the back side of the workpiece; one or more dielectric windows disposed between the workpiece support and the one or more radiative heating sources; and a workpiece temperature measurement system configured at a temperature measurement wavelength range to obtain a temperature measurement indicative of a temperature of the back side of the workpiece.

2 . The processing apparatus of claim 1 , comprising one or more gas distribution plates disposed on the first side of the processing chamber, wherein the one or more gas distribution plates are disposed such that one or more process gases can be more uniformly exposed to the top side of the workpiece in the processing chamber.

3 . The processing apparatus of claim 1 , wherein the rotation system comprises a rotation shaft configured to rotate the workpiece support in the processing chamber.

4 . The processing apparatus of claim 3 , wherein a first portion of the rotation shaft is disposed in the processing chamber and a second portion of the rotation shaft is disposed outside the processing chamber such that a vacuum pressure can be maintained in the processing chamber.

5 . The processing apparatus of claim 1 , wherein the one or more dielectric windows comprises quartz, and the workpiece support comprises quartz.

6 . The processing apparatus of claim 1 , wherein the one or more radiative heating sources are configured to emit a broadband radiation to heat the workpiece.

7 . The processing apparatus of claim 6 , wherein the one or more dielectric windows comprise one or more transparent regions that are transparent to at least a portion of radiation within the temperature measurement wavelength range and one or more opaque regions that are opaque to the radiation within the temperature measurement wavelength range, wherein the one or more opaque regions are configured to block at least a portion of the broadband radiation emitted by the radiative heating sources within the temperature measurement wavelength range.

8 . The processing apparatus of claim 7 , wherein the one or more dielectric windows comprise quartz, and the one or more opaque regions comprise a higher level of hydroxyl (OH) groups than the one or more transparent regions.

9 . The processing apparatus of claim 1 , wherein the one or more radiative heating sources are configured to emit a monochromatic radiation at a heating wavelength range, wherein the heating wavelength range is different from the temperature measurement wavelength range.

10 . The processing apparatus of claim 1 , wherein the workpiece temperature measurement system is configured to obtain a reflectance measurement of the workpiece.

11 . The processing apparatus of claim 10 , wherein the temperature measurement system comprises:
one or more emitters configured to emit a calibration radiation within the temperature measurement wavelength range; and one or more sensors, wherein at least a portion of the calibration radiation emitted from the one or more emitters is reflected by the workpiece and collected by the one or more sensors.

12 . The processing apparatus of claim 11 , wherein the emitter emits the calibration radiation onto the workpiece with a modulation in intensity.

13 . A processing apparatus for processing a workpiece, the workpiece having a top side and a back side opposite from the top side, the processing apparatus comprising:
a processing chamber having a first side and a second side opposite from the first side of the processing chamber; a workpiece support disposed within the processing chamber, the workpiece support configured to support the workpiece, wherein the back side of the workpiece faces the workpiece support; a rotation system configured to rotate the workpiece support; a gas delivery system configured to flow one or more process gases into the processing chamber; one or more gas exhaust ports for removing gas from the processing chamber such that a vacuum pressure can be maintained; one or more pumping plates dispose around an outer perimeter of the workpiece to facilitate process gas flow; a first group of one or more radiative heating sources disposed on the first side of the processing chamber, the first group of one or more radiative heating sources configured to heat the workpiece from the top side of the workpiece; a second group of one or more radiative heating sources disposed on the second side of the processing chamber, the second group of one or more radiative heating sources configured to heat the workpiece from the back side of the workpiece; a first dielectric window disposed between the first group of one or more radiative heating sources disposed on the first side of the processing chamber and the workpiece; a second dielectric window disposed between the second group of one or more radiative heating sources disposed on the second side of the processing chamber and the workpiece support; and a workpiece temperature measurement system configured at a temperature measurement wavelength range to obtain a temperature measurement indicative of a temperature of the back side of the workpiece.

14 . The processing apparatus of claim 13 , wherein the rotation system comprises a rotation shaft configured to rotate the workpiece support in the processing chamber.

15 . The processing apparatus of claim 14 , wherein a first portion of the rotation shaft is disposed in the processing chamber and a second portion of the rotation shaft is disposed outside the processing chamber such that a vacuum pressure can be maintained in the processing chamber.

16 . The processing apparatus of claim 13 , wherein the first dielectric window and second dielectric window comprise quartz, and the workpiece support comprises quartz.

17 . The processing apparatus of claim 13 , wherein the one or more radiative heating sources are configured to emit a broadband radiation to heat the workpiece.

18 . The processing apparatus of claim 17 , wherein the first and second dielectric windows comprise one or more transparent regions that are transparent to at least a portion of radiation within the temperature measurement wavelength range and one or more opaque regions that are opaque to the radiation within the temperature measurement wavelength range, wherein the one or more opaque regions are configured to block at least a portion of the broadband radiation emitted by the radiative heating sources within the temperature measurement wavelength

Assignees

• Mattson Tech Inc
• Beijing E Town Semiconductor Tech Co Ltd

Inventors

• Sohn Manuel
• Wansidler Alex
• Hezler Dieter
• Cibere Joseph
• Bremensdorfer Rolf
• Zucker Martin
• Lembesis Pete
• Yang Michael

Classifications

• F27D2201/00

  Manipulation of furnace parts · CPC title

• F27D2019/0003

  Monitoring the temperature or a characteristic of the charge and using it as a controlling value · CPC title

• F27D2003/166

  the fluid being a treatment gas · CPC title

• F27D2003/0087

  Rotation about a vertical axis · CPC title

• F27D21/02

  Observation or illuminating devices · CPC title