Encapsulation composition

Patent metadata

Field	Value
Publication number	US-12534593-B2
Application number	US-201917299222-A
Country	US
Kind code	B2
Filing date	Dec 9, 2019
Priority date	Dec 7, 2018
Publication date	Jan 27, 2026
Grant date	Jan 27, 2026

Abstract

The present disclosure relates to an encapsulation composition, an encapsulation film comprising the same, an organic electronic device comprising the same, and a method for manufacturing an organic electronic device using the same, which provides an encapsulation composition capable of effectively blocking moisture or oxygen introduced into an organic electronic device from the outside and realizing an organic electronic device with an extremely small bezel part structure.

First claim

The invention claimed is:

1 . An encapsulation composition comprising:
an encapsulation resin comprising an olefinic resin selected from the group consisting of polyisobutylene and butyl rubber, a moisture adsorbent surface-treated with an aliphatic hydrocarbon compound, and a tackifier having a softening point of 102° C. to 120° C., wherein the aliphatic hydrocarbon compound comprises at least one or more polar functional groups, wherein the aliphatic hydrocarbon compound has a carbon number in a range of 10 to 40, wherein the moisture adsorbent is comprised in a range of 300 to 1000 parts by weight relative to 100 parts by weight of the encapsulation resin, wherein the tackifier is comprised in a range of 150 to 400 parts by weight relative to 100 parts by weight of the encapsulation resin, and wherein the moisture adsorbent surface-treated with an aliphatic hydrocarbon compound is CaO surface-treated with stearic acid.

2 . The encapsulation composition according to claim 1 , wherein the moisture adsorbent has a particle diameter of 8 μm or less in a particle size analysis according to D90.

3 . The encapsulation composition according to claim 1 , wherein the tackifier has a weight average molecular weight in a range of 300 to 5000 g/mol.

4 . The encapsulation composition according to claim 1 , wherein the tackifier is a polymer polymerized from a monomer having a carbon number in a range of 3 to 15 in the molecular structure.

5 . The encapsulation composition according to claim 1 , further comprising an active energy ray polymerizable compound.

6 . The encapsulation composition according to claim 5 , wherein the active energy ray polymerizable compound is included in a range of 2 to 35 parts by weight relative to 100 parts by weight of the encapsulation resin.

7 . The encapsulation composition according to claim 1 , further comprising a radical initiator.

8 . An encapsulation film comprising an encapsulation layer comprising the encapsulation composition of claim 1 , wherein the encapsulation layer is a single layer or a multilayer structure of two or more layers.

9 . The encapsulation film according to claim 8 , wherein the encapsulation layer is said multilayer structure of two or more layers, and said encapsulation layer comprises a first layer including said encapsulation composition, and a second layer including no moisture adsorbent or including a moisture adsorbent in an amount lower than that in said first layer, wherein said moisture adsorbent is CaO surface treated with stearic acid.

10 . The encapsulation film according to claim 9 , wherein a ratio of the first layer thickness to the second layer thickness is in a range of 1.2 to 8.

11 . The encapsulation film according to claim 8 , further comprising a metal layer formed on the encapsulation layer.

12 . An organic electronic device comprising:
a substrate; an organic electronic element formed on the substrate; and the encapsulation film of claim 8 which encapsulates entire surface of the organic electronic element.

13 . A method for manufacturing an organic electronic device, comprising:
a step of applying the encapsulation film of claim 8 to a substrate on which an organic electronic element is formed, so as to cover the organic electronic element.

Assignees

• Lg Chemical Ltd

Inventors

• Lee Seung Min
• Mok Yeong Bong
• Moon Sung Nam
• Yang Se Woo

Classifications

• H10K85/151

  Copolymers · CPC title

• H10K71/00

  Manufacture or treatment specially adapted for the organic devices covered by this subclass · CPC title

• H10K59/874

  including getter material or desiccant · CPC title

• B01J20/28035

  with more than one layer, e.g. laminates, separated sheets · CPC title

• B01J20/28021

  Hollow particles, e.g. hollow spheres, microspheres or cenospheres · CPC title