Encapsulation film

Patent metadata

Field	Value
Publication number	US-10074827-B2
Application number	US-201615308800-A
Country	US
Kind code	B2
Filing date	Feb 4, 2016
Priority date	Feb 4, 2015
Publication date	Sep 11, 2018
Grant date	Sep 11, 2018

Abstract

Provided are an encapsulation film, an organic electronic device including the same, and a method of manufacturing the organic electronic device. Therefore, provided is the pressure-sensitive adhesive composition, which can form a structure capable of effectively blocking moisture or water entering the organic electronic device from the outside, and have excellent processability in a process of manufacturing a panel and excellent heat retention under a high-temperature and high-humidity condition.

First claim

What is claimed is:

1. An encapsulation film, comprising:
a metal layer and a pressure-sensitive adhesive layer,
wherein the pressure-sensitive adhesive layer comprises a first layer having an elastic portion calculated by General Equation 1 of 30 to 80%, and a second layer having an elastic portion calculated by General Equation 1 of 8 to 40%,
Ep (unit:%)=100×σ2/σ1,  [General Equation 1]

where σ1 is the maximum stress value measured when a force of 200 gf at 85° C. is applied in a direction normal to a surface of the film using a plate having a diameter of 8 mm, and positioned parallel to the surface of the film, in a stress relaxation test mode of an advanced rheometric expansion system (ARES) when the pressure-sensitive adhesive layer has a thickness of 600 μm and σ2 is a stress value measured after the force applied to the film has been maintained for 180 seconds.

2. The film of claim 1 , wherein the metal layer is directly attached to the first layer.

3. The film of claim 1 , wherein the first layer has a probe tack force measured according to ASTM D2979 in a range of 50 to 500 gf.

4. The film of claim 1 , wherein the second layer has a probe tack force measured according to ASTM D2979 in a range of 3 to 100 gf.

5. The film of claim 1 , wherein the pressure-sensitive adhesive layer comprises a polymer derived from butylene, and a compound satisfying Formula 1:

where T is a linear or branched alkyl group, alkenyl group or alkynyl group having 6 to 30 carbon atoms, or —U—[O—W] n —O-Q, in which U and W are each independently an alkylene group or alkylidene group, Q is an alkyl group, alkenyl group, alkynyl group or aryl group, and n is a number from 0 to 10.

6. The film of claim 5 , wherein the polymer derived from butylene is a homopolymer of a butylene monomer; a copolymer copolymerizing a butylene monomer with a different monomer capable of being polymerized therewith; a reactive oligomer using a butylene monomer; or a mixture thereof.

7. The film of claim 6 , wherein the monomer capable of being polymerized with the butylene monomer is isoprene, styrene or butadiene.

8. The film of claim 6 , wherein the reactive oligomer using the butylene monomer comprises a butylene polymer having a reactive functional group, and the butylene polymer binds to a different polymer having a reactive functional group.

9. The film of claim 5 , wherein the polymer derived from butylene is comprised at 60 to 95 parts by weight, and the compound satisfying Formula 1 is comprised at 5 to 40 parts by weight.

10. The film of claim 5 , wherein the pressure-sensitive adhesive layer further includes a multifunctional active energy ray polymerizable compound satisfying Formula 2:

where R 1 is hydrogen or an alkyl group having 1 to 4 carbon atoms, n is an integer of 2 or higher, and X is a residue derived from a linear, branched or cyclic alkyl group having 3 to 30 carbon atoms.

11. The film of claim 10 , wherein the polymer derived from butylene is comprised at 50 to 90 parts by weight, the compound satisfying Formula 1 is comprised at 5 to 35 parts by weight, and the multifunctional active energy ray polymerizable compound of Formula 2 is comprised at 5 to 25 parts by weight.

12. The film of claim 5 , wherein the pressure-sensitive adhesive layer further comprises a radical initiator.

13. The composition of claim 12 , wherein the radical initiator is a photoinitiator or a thermal initiator.

14. The film of claim 5 , wherein the pressure-sensitive adhesive layer further comprises a moisture scavenger.

15. The film of claim 1 , wherein the pressure-sensitive adhesive layer further includes a tackifier.

16. The film of claim 15 , wherein the tackifier is a hydrogenated cyclic olefin-based polymer.

17. The composition of claim 15 , wherein the tackifier is comprised at 5 to 100 parts by weight with respect to 100 parts by weight of the polymer.

18. The film of claim 1 , wherein the metal layer has a thermal conductivity of 50 W/mK or more.

19. The film of claim 1 , wherein the pressure-sensitive adhesive layer, having a thickness of 100 μm, has a water vapor transmission rate (WVTR) in a thickness direction of 50 g/m 2 ·day or less.

20. An organic electronic device, comprising:
a substrate;
an organic electronic element formed on the substrate; and
the encapsulation film of claim 1 , which encapsulates all surfaces of the organic electronic element not in contact with the substrate.

21. A method of manufacturing an organic electronic device, comprising:
applying the encapsulation film of claim 1 to a substrate on which an organic electronic element is formed to cover all surfaces of the organic electronic element not in contact with a substrate; and
curing the encapsulation film.

Assignees

• Lg Chemical Ltd

Inventors

• Yoo Hyun Jee
• Kim Hyun Suk
• Moon Jung Ok
• Yang Se Woo

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W74/121

  by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation · CPC title

• C09J7/10

  without carriers · CPC title

• C09J133/04

  Homopolymers or copolymers of esters {(C09J143/04 takes precedence)} · CPC title

• C09J7/38

  Pressure-sensitive adhesives [PSA] · CPC title