Chip on flex

US12530096B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12530096-B2
Application numberUS-202418747987-A
CountryUS
Kind codeB2
Filing dateJun 19, 2024
Priority dateJun 27, 2019
Publication dateJan 20, 2026
Grant dateJan 20, 2026

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The embodiments of the present disclosure provide a chip on flex (COF), a touch assembly, and a display device. The chip on flex includes a flexible base provided with a first opening, the flexible base includes a bonding area provided with a plurality of metal bonding pads; on the flexible base, a spacing area with a preset range is provided between the first opening and the bonding area; wherein, the flexible base is provided with a reinforcement sheet thereon, the reinforcement sheet is located on a portion of the flexible base other than the first opening, the spacing area and the bonding area.

First claim

Opening claim text (preview).

What is claimed is: 1 . A chip on flex, comprising a flexible base provided with a first opening, the flexible base comprising a bonding area provided with a plurality of metal bonding pads; on the flexible base, a spacing area with a preset range being provided between the first opening and the bonding area; wherein, the flexible base is provided with a reinforcement sheet thereon, the reinforcement sheet is located on a portion of the flexible base other than the first opening, the spacing area and the bonding area, wherein the reinforcement sheet is made of steel; wherein along a first direction, the width of the chip on flex at the bonding area is larger than the width of the chip on flex at a location corresponding to the first opening; wherein the reinforcement sheet is provided with a second opening, and an orthographic projection of the first opening on a plane where the reinforcement sheet is located is inside the second opening or coincides with edges of the first opening. 2 . The chip on flex according to claim 1 , wherein the reinforcement sheet is provided on a surface of the flexible base opposite to the display flexible circuit board. 3 . The chip on flex according to claim 1 , wherein the reinforcement sheet is provided at least along one edge of the first opening. 4 . The chip on flex according to claim 1 , wherein the plurality of metal bonding pads in the bonding area are arranged along the first direction, the first opening is provided on a side away from the bonding area along a second direction, the second direction is vertical to the first direction; between the first opening and the bonding area, a size range of the preset range in the first direction is equal to a size range of the flexible base in the first direction, and a size range of the preset range in the second direction is a preset width range from the bonding area. 5 . The chip on flex according to claim 4 , wherein, in the second direction, a distance between the first opening and the bonding area is larger than a width value of the preset width range. 6 . The chip on flex according to claim 1 , wherein the metal bonding pads and the reinforcement sheet are located on a same surface of the flexible base. 7 . The chip on flex according to claim 1 , wherein the chip on flex further comprises a control chip which is located on a portion of the flexible base other than the first opening, the spacing area, the bonding area and the reinforcement sheet. 8 . The chip on flex according to claim 1 , wherein the reinforcement sheet is adhered and fixed to the flexible base. 9 . A chip on flex, comprising a flexible base provided with a first opening, the flexible base comprising a bonding area provided with a plurality of metal bonding pads; on the flexible base, a spacing area with a preset range being provided between the first opening and the bonding area; wherein, the flexible base is provided with a reinforcement sheet thereon, the reinforcement sheet is located on a portion of the flexible base other than the first opening, the spacing area and the bonding area, wherein the reinforcement sheet is made of steel; wherein along a first direction, the width of the chip on flex at the bonding area is larger than the width of the chip on flex at a location corresponding to the first opening; wherein a bending area portion is formed between the first opening and the bonding area; and on a portion of the flexible base extending from the bonding area towards a second direction, a size range of the spacing area on the flexible base is larger than or equal to a size range of the bending area portion. 10 . The chip on flex according to claim 9 , wherein the reinforcement sheet is provided on a surface of the flexible base opposite to the display flexible circuit board. 11 . The chip on flex according to claim 9 , wherein the reinforcement sheet is provided at least along one edge of the first opening. 12 . The chip on flex according to claim 9 , wherein the reinforcement sheet is provided with a second opening, and an orthographic projection of the first opening on a plane where the reinforcement sheet is located is inside the second opening or coincides with edges of the first opening. 13 . The chip on flex according to claim 9 , wherein the plurality of metal bonding pads in the bonding area are arranged along the first direction, the first opening is provided on a side away from the bonding area along the second direction, the second direction is vertical to the first direction; between the first opening and the bonding area, a size range of the preset range in the first direction is equal to a size range of the flexible base in the first direction, and a size range of the preset range in the second direction is a preset width range from the bonding area. 14 . The chip on flex according to claim 13 , wherein, in the second direction, a distance between the first opening and the bonding area is larger than a width value of the preset width range. 15 . The chip on flex according to claim 9 , wherein the metal bonding pads and the reinforcement sheet are located on a same surface of the flexible base. 16 . The chip on flex according to claim 9 , wherein the chip on flex further comprises a control chip which is located on a portion of the flexible base other than the first opening, the spacing area, the bonding area and the reinforcement sheet. 17 . The chip on flex according to claim 9 , wherein the reinforcement sheet is adhered and fixed to the flexible base.

Assignees

Inventors

Classifications

  • Display · CPC title

  • specially for flexible printed circuits, e.g. using folded portions · CPC title

  • Pads along the edge of rigid circuit boards, e.g. for pluggable connectors · CPC title

  • H05K1/0281Primary

    Reinforcement details thereof · CPC title

  • by capacitive means · CPC title

Patent family

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Frequently asked questions

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What does patent US12530096B2 cover?
The embodiments of the present disclosure provide a chip on flex (COF), a touch assembly, and a display device. The chip on flex includes a flexible base provided with a first opening, the flexible base includes a bonding area provided with a plurality of metal bonding pads; on the flexible base, a spacing area with a preset range is provided between the first opening and the bonding area; wher…
Who is the assignee on this patent?
Chengdu Boe Optoelect Tech Co, Boe Technology Group Co Ltd
What technology area does this patent fall under?
Primary CPC classification H05K1/0281. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jan 20 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).