Display substrate, display panel, and display apparatus
US-2024411399-A1 · Dec 12, 2024 · US
US9788429B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9788429-B2 |
| Application number | US-201514737165-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 11, 2015 |
| Priority date | Oct 29, 2014 |
| Publication date | Oct 10, 2017 |
| Grant date | Oct 10, 2017 |
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Official abstract text for this publication.
A display device includes a panel substrate, a first printed circuit board (PCB), a driver integrated circuit (IC), and a second PCB. The panel substrate includes a first substrate and a second substrate. The first PCB is disposed on the second substrate. The driver IC is disposed on the first substrate and is electrically connected to the first PCB. The second PCB is disposed on the first substrate and is electrically connected to the driver IC. The driver IC includes a first pad and a second pad. The first pad is disposed on an upper or lateral surface of the driver IC, the first pad being configured to transmit signals received via the first PCB. The second pad is disposed on a lower surface of the driver IC, the second pad being configured to receive the signals from the first PCB and to transmit the signals to the second PCB.
Opening claim text (preview).
What is claimed is: 1. A display device, comprising: a panel substrate comprising a first substrate and a second substrate; a first printed circuit board disposed on the second substrate; a driver integrated circuit (IC) disposed on the first substrate, the driver IC being electrically connected to the first printed circuit board; and a second printed circuit board disposed on the first substrate, the second printed circuit board being electrically connected to the driver IC, wherein: the first substrate comprises a pixel unit, the pixel unit comprising pixels; the driver IC comprises a first pad and a second pad; the first pad is disposed on an upper surface or a lateral surface of the driver IC, the first pad being configured to transmit signals received via the first printed circuit board; and the second pad is disposed on a lower surface of the driver IC, the second pad being configured to receive the signals from the first printed circuit board and to transmit the signals to the second printed circuit board. 2. The display device of claim 1 , wherein: the driver IC further comprises a through-electrode penetrating an inner portion of the driver IC; and the through-electrode is configured to electrically connect the first pad and the second pad to one another. 3. The display device of claim 1 , wherein the first printed circuit board overlaps a portion of the driver IC. 4. The display device of claim 1 , further comprising: an anisotropic conductive film, wherein the anisotropic conductive film couples the first printed circuit board to the second substrate. 5. The display device of claim 4 , wherein the anisotropic conductive film is configured to couple the second substrate and the first printed circuit board to one another in a relatively low temperature environment. 6. The display device of claim 1 , further comprising: a touch sensing layer disposed on the second substrate. 7. The display device of claim 6 , wherein the first printed circuit board is electrically connected to the touch sensing layer. 8. The display device of claim 1 , wherein the first printed circuit board and the second printed circuit board are flexible printed circuit boards.
Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components · CPC title
Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices · CPC title
Display · CPC title
characterised by the use of flexible or folded printed circuits · CPC title
Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means · CPC title
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