Chip on flex
US-12530096-B2 · Jan 20, 2026 · US
Wang Jiangsheng is listed as an inventor on 50 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wang Jiangsheng |
| Total patents | 50 |
| First publication | Nov 12, 2015 |
| Latest publication | Jan 20, 2026 |
Publications ranked by popularity score, then publication date.
US-12530096-B2 · Jan 20, 2026 · US
US-12426991-B2 · Sep 30, 2025 · US
US-2025150992-A1 · May 8, 2025 · US
US-12185610-B2 · Dec 31, 2024 · US
US-2024338093-A1 · Oct 10, 2024 · US
US-2024315803-A1 · Sep 26, 2024 · US
US-12045414-B2 · Jul 23, 2024 · US
US-11997794-B2 · May 28, 2024 · US
US-11886085-B2 · Jan 30, 2024 · US
US-11829541-B2 · Nov 28, 2023 · US
Latest publications not already listed above.
US-2023297185-A1 · Sep 21, 2023 · US
US-2023269286-A1 · Aug 24, 2023 · US
US-2023254978-A1 · Aug 10, 2023 · US
US-11698695-B2 · Jul 11, 2023 · US
US-11665827-B2 · May 30, 2023 · US
US-11644935-B2 · May 9, 2023 · US
US-11538833-B2 · Dec 27, 2022 · US
US-2022377903-A1 · Nov 24, 2022 · US
US-2022375998-A1 · Nov 24, 2022 · US
US-11489873-B2 · Nov 1, 2022 · US
US-2022317529-A1 · Oct 6, 2022 · US
US-2022276735-A1 · Sep 1, 2022 · US
US-2022147194-A1 · May 12, 2022 · US
US-11269472-B2 · Mar 8, 2022 · US
US-2021405843-A1 · Dec 30, 2021 · US
US-2021405824-A1 · Dec 30, 2021 · US
US-2021358959-A1 · Nov 18, 2021 · US
US-11070541-B2 · Jul 20, 2021 · US
US-10963111-B1 · Mar 30, 2021 · US
US-10757129-B2 · Aug 25, 2020 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Boe Technology Group Co Ltd | 24 |
| Chengdu Boe Optoelect Tech Co | 24 |
| Huawei Tech Co Ltd | 18 |
| Futurewei Technologies Inc | 4 |
| Qualcomm Inc | 2 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G06F3/0412 | 16 |
| G06F3/04164 | 12 |
| G06F2203/04103 | 12 |
| H04L63/0823 | 10 |
| H05K1/189 | 10 |