Epoxy resin, epoxy compound, epoxy resin composition, resin sheet, prepreg, carbon fiber reinforced composite material and phenol resin

US12522690B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12522690-B2
Application numberUS-202117913176-A
CountryUS
Kind codeB2
Filing dateMar 17, 2021
Priority dateMar 23, 2020
Publication dateJan 13, 2026
Grant dateJan 13, 2026

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An epoxy resin represented by the following formula (1), in which in a total amount of an epoxy compound represented by n=1 in the epoxy resin of the above formula, a total content of an epoxy compound represented by the following formula (2) and an epoxy compound represented by the following formula (3) is 1 area % or more and less than 70 area % in HPLC area percentage.

First claim

Opening claim text (preview).

The invention claimed is: 1 . An epoxy resin represented by the following formula (1), wherein in a total amount of an epoxy compound represented by n=1 in the epoxy resin, a total content of an epoxy compound represented by the following formula (2) and an epoxy compound represented by the following formula (3) is 1 area % or more and less than 70 area % in HPLC area percentage, in the formula (1), G represents a substituted or unsubstituted glycidyl group, p and q are present independently of each other and each represents a real number of 1 or 2, and n represents a real number of 1 to 20, in the formula (2), G represents a substituted or unsubstituted glycidyl group, and in the formula (3), G represents a substituted or unsubstituted glycidyl group. 2 . The epoxy resin according to claim 1 , wherein an epoxy equivalent is 200 g/eq. or more and less than 230 g/eq. 3 . An epoxy resin composition comprising: the epoxy resin according to claim 2 ; and a curing agent. 4 . An epoxy resin composition comprising: the epoxy resin according to claim 1 ; and a curing agent. 5 . The epoxy resin composition according to claim 4 , wherein the curing agent is an amine-based curing agent or a phenol-based curing agent. 6 . A carbon fiber reinforced material comprising the epoxy resin composition according to claim 5 . 7 . A resin sheet obtained by coating a support base with the epoxy resin composition according to claim 5 . 8 . A prepreg obtained by impregnating a carbon fiber with the epoxy resin composition according to claim 5 . 9 . A carbon fiber reinforced material comprising the epoxy resin composition according to claim 4 . 10 . A resin sheet obtained by coating a support base with the epoxy resin composition according to claim 4 . 11 . A prepreg obtained by impregnating a carbon fiber with the epoxy resin composition according to claim 4 . 12 . A carbon fiber reinforced composite material obtained by curing the prepreg according to claim 11 . 13 . A cured product obtained by curing the epoxy resin composition according to claim 4 . 14 . An epoxy compound represented by the following formula (2) or the following formula (3), wherein in the formula (2), G represents a substituted or unsubstituted glycidyl group, and in the formula (3), G represents a substituted or unsubstituted glycidyl group. 15 . An epoxy resin composition comprising: the epoxy compound according to claim 3 ; and a curing agent. 16 . A resin sheet obtained by coating a support base with the epoxy resin composition according to claim 15 . 17 . A prepreg obtained by impregnating a carbon fiber with the epoxy resin composition according to claim 15 . 18 . An epoxy resin represented by the following formula (1), wherein a product of GPC area percentage and HPLC area percentage is 1 area % or more and 20 area % or less, the GPC area percentage indicating a content of the epoxy compound represented by n=1 in the epoxy resin, the HPLC area percentage indicating the total contents of the epoxy compound represented by the following formula (2) and the epoxy compound represented by the following formula (3) in the total amount of the epoxy compound represented by n=1, in a total amount of an epoxy compound represented by n=1 in the epoxy resin, a total content of an epoxy compound represented by the following formula (2) and an epoxy compound represented by the following formula (3) is 1 area % or more and less than 70 area % in HPLC area percentage, in the formula (1), G represents a substituted or unsubstituted glycidyl group, p and q are present independently of each other and each represents a real number of 1 or 2, and n represents a real number of 1 to 20, in the formula (2), G represents a substituted or unsubstituted glycidyl group, and in the formula (3), G represents a substituted or unsubstituted glycidyl group.

Assignees

Inventors

Classifications

  • Characterised by the use of epoxy resins; Derivatives of epoxy resins · CPC title

  • Manufacture of films or sheets · CPC title

  • Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule · CPC title

  • C08G59/06Primary

    of polyhydric phenols · CPC title

  • C08J5/243Primary

    using carbon fibres · CPC title

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Frequently asked questions

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What does patent US12522690B2 cover?
An epoxy resin represented by the following formula (1), in which in a total amount of an epoxy compound represented by n=1 in the epoxy resin of the above formula, a total content of an epoxy compound represented by the following formula (2) and an epoxy compound represented by the following formula (3) is 1 area % or more and less than 70 area % in HPLC area percentage.
Who is the assignee on this patent?
Nippon Kayaku Kk
What technology area does this patent fall under?
Primary CPC classification C08G59/06. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jan 13 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).