Solder mask ink composition
US-9796864-B2 · Oct 24, 2017 · US
US12522690B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12522690-B2 |
| Application number | US-202117913176-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 17, 2021 |
| Priority date | Mar 23, 2020 |
| Publication date | Jan 13, 2026 |
| Grant date | Jan 13, 2026 |
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An epoxy resin represented by the following formula (1), in which in a total amount of an epoxy compound represented by n=1 in the epoxy resin of the above formula, a total content of an epoxy compound represented by the following formula (2) and an epoxy compound represented by the following formula (3) is 1 area % or more and less than 70 area % in HPLC area percentage.
Opening claim text (preview).
The invention claimed is: 1 . An epoxy resin represented by the following formula (1), wherein in a total amount of an epoxy compound represented by n=1 in the epoxy resin, a total content of an epoxy compound represented by the following formula (2) and an epoxy compound represented by the following formula (3) is 1 area % or more and less than 70 area % in HPLC area percentage, in the formula (1), G represents a substituted or unsubstituted glycidyl group, p and q are present independently of each other and each represents a real number of 1 or 2, and n represents a real number of 1 to 20, in the formula (2), G represents a substituted or unsubstituted glycidyl group, and in the formula (3), G represents a substituted or unsubstituted glycidyl group. 2 . The epoxy resin according to claim 1 , wherein an epoxy equivalent is 200 g/eq. or more and less than 230 g/eq. 3 . An epoxy resin composition comprising: the epoxy resin according to claim 2 ; and a curing agent. 4 . An epoxy resin composition comprising: the epoxy resin according to claim 1 ; and a curing agent. 5 . The epoxy resin composition according to claim 4 , wherein the curing agent is an amine-based curing agent or a phenol-based curing agent. 6 . A carbon fiber reinforced material comprising the epoxy resin composition according to claim 5 . 7 . A resin sheet obtained by coating a support base with the epoxy resin composition according to claim 5 . 8 . A prepreg obtained by impregnating a carbon fiber with the epoxy resin composition according to claim 5 . 9 . A carbon fiber reinforced material comprising the epoxy resin composition according to claim 4 . 10 . A resin sheet obtained by coating a support base with the epoxy resin composition according to claim 4 . 11 . A prepreg obtained by impregnating a carbon fiber with the epoxy resin composition according to claim 4 . 12 . A carbon fiber reinforced composite material obtained by curing the prepreg according to claim 11 . 13 . A cured product obtained by curing the epoxy resin composition according to claim 4 . 14 . An epoxy compound represented by the following formula (2) or the following formula (3), wherein in the formula (2), G represents a substituted or unsubstituted glycidyl group, and in the formula (3), G represents a substituted or unsubstituted glycidyl group. 15 . An epoxy resin composition comprising: the epoxy compound according to claim 3 ; and a curing agent. 16 . A resin sheet obtained by coating a support base with the epoxy resin composition according to claim 15 . 17 . A prepreg obtained by impregnating a carbon fiber with the epoxy resin composition according to claim 15 . 18 . An epoxy resin represented by the following formula (1), wherein a product of GPC area percentage and HPLC area percentage is 1 area % or more and 20 area % or less, the GPC area percentage indicating a content of the epoxy compound represented by n=1 in the epoxy resin, the HPLC area percentage indicating the total contents of the epoxy compound represented by the following formula (2) and the epoxy compound represented by the following formula (3) in the total amount of the epoxy compound represented by n=1, in a total amount of an epoxy compound represented by n=1 in the epoxy resin, a total content of an epoxy compound represented by the following formula (2) and an epoxy compound represented by the following formula (3) is 1 area % or more and less than 70 area % in HPLC area percentage, in the formula (1), G represents a substituted or unsubstituted glycidyl group, p and q are present independently of each other and each represents a real number of 1 or 2, and n represents a real number of 1 to 20, in the formula (2), G represents a substituted or unsubstituted glycidyl group, and in the formula (3), G represents a substituted or unsubstituted glycidyl group.
Characterised by the use of epoxy resins; Derivatives of epoxy resins · CPC title
Manufacture of films or sheets · CPC title
Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule · CPC title
of polyhydric phenols · CPC title
using carbon fibres · CPC title
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